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A study of proton-induced destructive SEE (DSEE) from Au-plated lid fission fragments has been expanded. Seventeen additional lid materials (Z =26–83) are studied. Lead (Pb) produced a higher sensitivity than seen in previous work with gold (Au), raising new concerns of SEE enhancement due to die-proximate Pb-based solder in flip-chip package designs. New analysis has allowed generalized RHA rules to be developed. [ABSTRACT FROM PUBLISHER]

Proton single event dielectric rupture was observed in Analog Devices OP470 devices only when the package included gold flashing facing the die on the inner surface of the metal lid. The supply voltage was also a factor. Analysis shows that proton on gold fission fragments have the linear energy transfer and range to cause this effect. The physics of proton on gold reactions and radiation hardness assurance implications are explored. [ABSTRACT FROM PUBLISHER]