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In this work, high-performance GaN vertical Schottky barrier diodes (SBDs) are successfully fabricated on the GaN-on-GaN substrate by using the self-alignment trench structure and argon (Ar) ion implantation. The fabricated diodes achieve a high current ON/ OFF ratio of 108 and high breakdown voltage (BV) of 656 V due to the reduced surface electric field effect. Besides, the temperature-dependent reverse leakage characteristics show that two Poole–Frenkel emission (PFE) processes dominate the carrier transport. This work shows great potential of the self-alignment trench structure in fabricating GaN vertical SBDs to improve the BV with simply fabrication process. [ABSTRACT FROM AUTHOR]

Surface treatment is quite vital to reduce the reverse leakage current and improve the current On–Off ratio of gallium nitride (GaN) quasi-vertical Schottky barrier diode (SBD). In this work, we report a new nondestructive low temperature supercritical CO2 fluid (SCF) nitridation technology to treat the surface of GaN and substantially reduce the leakage current of GaN quasi-vertical SBD. The X-ray photoelectron spectroscopy (XPS) reveals the increased nitriding degree and oxygen doping degree in the form of GaOx after the SCF process results in the leakage performance improvement. As a result, the defects at metal/semiconductor interface are passivated. Also, because of NH-2 and OH− generated from the SCF process, the surface peak electric field of n−GaN decreases, and thus the breakdown voltage is enhanced. The reverse leakage current density is reduced by more than three orders of magnitude from 3.7 × 10−6 to 3.52 × 10−9 A/cm2 (at −3 V) and the ON-/ OFF-current ratio is improved by three orders from 8 × 107 to 5.74 × 1010. [ABSTRACT FROM AUTHOR]

Considering potential applications related to superconductivity and aerospace (typically less than 100 K), in this article, the temperature dependence of silicon carbide (SiC) power diodes is systematically characterized and analyzed over a wide temperature range of 90–478 K, especially focusing on cryogenic temperature. First, the static performance degradation mechanism of SiC diodes is established in an ultrawide temperature range, including forward/reverse I-V characteristics and junction capacitance (Cj) characteristics. Second, the reverse recovery characteristics are achieved, including peak reverse recovery current (Irm), reverse recovery charge (Qrr), and switching energy (Esw), clarifying a clearer internal relationship between reverse recovery and junction temperature. Meanwhile, the aforementioned critical parameters are further analyzed on an electrical scale with normal atmosphere temperature, including switching speed range of 62.3–2054.8 A/μs, load current range of 6–30 A, and dc voltage range of 400–1000 V. Third, based on newly proposed power loss analysis method, the continuous operation performance of SiC diodes is quantified and analyzed in actual cryogenic converters. The excellent temperature dependence indicates that SiC diodes have great superiority for extreme applications. Importantly, SiC mosfet's body diode shows the great potential to operate as a freewheeling diode in the compact converter, especially at cryogenic temperature. [ABSTRACT FROM AUTHOR]