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Spin-transfer torque magnetic random access memory (STT-MRAM) has emerged as a promising candidate for the next-generation high-speed, low-power, and scalable nonvolatile memory technology. Its advantageous features have attracted much attention in the area of research and development, and a number of preindustrial prototypes and small-scale products have been demonstrated. One expects to widely commercialize it in the next few years. One of the critical issues that blocks STT-MRAM’s wide commercialization is its low sensing reliability due to the relatively small tunnel magnetoresistance ratio of the magnetic tunnel junction (MTJ) and the continuously increasing process variations, especially as technology process scales down to the deep submicrometer nodes (e.g., 40 nm). In this paper, we present a variation-tolerant high-reliability sensing circuit for deep submicrometer STT-MRAM. This circuit, using triple-stage sensing and charge transfer amplification, is able to tolerate significantly the process variations and improve greatly the sensing margin by sacrificing some sensing time. Using a CMOS 40 nm design kit and a precise STT-MTJ compact model, transient and Monte Carlo simulations have been carried out to demonstrate its sensing performance. [ABSTRACT FROM AUTHOR]

Magnetic tunnel junction (MTJ) embedded in complementary metal–oxide–semiconductor (CMOS) has been considered as one of the potentially powerful solutions to build up nonvolatile memory and logic circuits. It possesses many intrinsic merits, such as high speed, instant on/off, good scalability and low-leakage power, and promises to extend the Moore's law. A critical issue in this hybrid MTJ/CMOS structure is the reliable integration of MTJ electric signals to CMOS electronics, especially for the deep submicrometer technology nodes (e.g., 28 nm) in presence of low supply voltage and serious process variations. In this paper, we propose a new sensing amplifier, named separated precharge sense amplifier. This circuit, by separating the discharging and evaluation stages of the sensing operation, can operate at a lower supply voltage (<1.0~V) and reduces the effects of process variations as technology scales, thereby providing higher sensing reliability compared with the previously proposed solutions while preserving the high-speed and low-power consumption. Transient and Monte-Carlo statistical simulations are performed to demonstrate its sensing performance. [ABSTRACT FROM AUTHOR]

Power issues have become a major problem of CMOS logic circuits as technology node shrinks below 90 nm. In order to overcome this limitation, emerging logic-in-memory architecture based on nonvolatile memories (NVMs) are being investigated. Spin transfer torque (STT) magnetic random access memory (MRAM) is considered one of the most promising NVMs thanks to its high speed, low power, good endurance, and 3-D back-end integration. This paper presents a novel magnetic full-adder (MFA) design based on perpendicular magnetic anisotropy (PMA) STT-MRAM. It provides advantageous power efficiency and die area compared with conventional CMOS-only full adder (FA). Transient simulations have been performed to validate this design by using an industrial CMOS 40 nm design kit and an accurate STT-MRAM compact model including physical models and experimental measurements. [ABSTRACT FROM PUBLISHER]

Magnetic tunnel junctions (MTJ) are considered as one of the most promising candidates for the next generation of nonvolatile memories and programmable logic chips. Spin transfer torque (STT) in CoFeB/MgO/CoFeB MTJs with perpendicular magnetic anisotropy (PMA) exhibits noticeable performance enhancements compared to that with In-plane magnetic anisotropy, particularly in terms of thermal stability, critical current for switching, access speed and power consumption. However, the STT switching of MTJ has been revealed stochastic, which results from unavoidable thermal fluctuations of magnetization. This leads to the occurrence of write errors which deeply affects the reliability of hybrid CMOS/MTJ circuits. In this paper, we present the first spice-compact model of CoFeB/MgO/CoFeB structure PMA-MTJ integrating STT stochastic behaviors. Depending on the relative magnitude between the switching current (I) and the critical current (Ico), the STT stochastic behaviors of this PMA-MTJ can be categorized into two regions: Sun model (I>Ico) and Neel-Brown model (I<0.8Ico). The Monte-Carlo simulations for single cell and hybrid CMOS/MTJ circuits show the stochastic behaviors in both writing and sensing operations. This model can be very useful for investigating the reliability issues during the design and simulation before process fabrication. [ABSTRACT FROM AUTHOR]

Spin transfer torque (STT) is one of the most promising switching approaches for magnetic tunnel junction (MTJ) nanopillars to build up innovative nonvolatile memory and logic circuits. It presents low critical current (e.g., < 100\ \muA at 65 nm), simple switching scheme, and fast-speed; however, it suffers from a number of reliability issues like stochastic switching effects, process voltage temperature (PVT) variations, and erroneous reading etc. The mainstream solution is to enlarge the write pulse duration to reduce error rate, which sacrifices the speed and low power advantages. In this paper, we present a new switching circuit for STT memory and logic, allowing “error-free” as the switching operation becomes deterministic benefiting from the self-enabled mechanism. The switching power efficiency can be also improved thanks to a shorter switching duration. By using an accuracy spice model of STT-MTJ and CMOS 65 nm design-kit, mixed simulations have been performed to demonstrate its high-reliable write/read operations and evaluate its potential area, power, and speed performance. [ABSTRACT FROM PUBLISHER]

Magnetic RAM (MRAM) is considered as a promising nonvolatile memory technology for aerospace and avionic electronics thanks to its intrinsic hardness to radiation. Data is stored on the spin direction “up” and “down” of electrons instead of positive and negative charge. Thanks to its fast speed, easy integration with CMOS and infinite endurance, MRAM has been proposed to build up nonvolatile latches and logic circuits to overcome the power challenge of conventional CMOS circuits. However, they are vulnerable to single event effects (SEE) due to their CMOS peripheral circuits. Hardening techniques to mitigate SEE are described in this paper. A new design of Radhard MRAM latch is firstly presented. TMR technique is then implemented on configurable logic block (CLB) to mitigate SET on data paths. By using 65 nm design kit and an MRAM compact model, hybrid simulations have been done to demonstrate the radiation hardness and performance. [ABSTRACT FROM AUTHOR]