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In this paper, an innovative design of a miniaturized heterogeneous 3DIC-based wireless sensor node (WSN) is proposed. The design contains stacks of radio frequency (RF) die, mixed-signal die, digital die, and integrated antenna die using the through silicon via (TSV) technology. Significant enhancements to the existing 2D design and verification flow are developed to solve the critical concerns of heterogeneous 3DIC integration, including the block-level partitioning, TSV macro design, the TSV-related modeling and characterization, and physical verification. Solutions are proposed to minimize the electromagnetic interference (EMI) effects between the IC and the antenna. The size of the proposed 3DIC is only 66% as compared to a similar 2D implementation, permitting miniaturization of the complete WSN system. [ABSTRACT FROM PUBLISHER]

In this paper, three high-gain on-chip antennas are proposed using three different silicon-based technologies in the millimeter-wave/THz frequency range. A modified Vivaldi antenna is first implemented using the micro-fabricated floating process. In the proposed process, the top metal layer is supported by metal vias, separating it from the silicon substrate for low-loss application. The antenna gain of 5.5 dBi is obtained with 78% radiation efficiency. A monopole antenna is subsequently designed using the silicon-benzocyclobutene (Si-BCB) process, with micro-machined backed cavity for high efficiency and wideband application. The simulated gain of this antenna is 6 dBi with 88% radiation efficiency. Our third proposed on-chip antenna is fabricated using commercial 0.18-Hm CMOS technology. The antenna gain and efficiency are improved by the dielectric resonator on the surface of the antenna. The measured gain is 2.7 dBi with radiation efficiency of 43% The three proposed antennas with different silicon compatible processes are therefore suitable for application in the millimeter-wave/THz integrated circuits. [ABSTRACT FROM PUBLISHER]