6 results on '"Chen, Chuantong"'
Search Results
2. Online Condition Monitoring of Solder Fatigue in a Clip-Bonding SiC mosfet Power Assembly via Acoustic Emission Technique.
3. Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm 2 Power Cycling Tests.
4. Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip.
5. Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests.
6. Reliability Evaluation of SiC Power Module With Sintered Ag Die Attach and Stress-Relaxation Structure.
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.