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Perturbations in N-well potential have been shown to strongly affect the charge collection, charge sharing, and parasitic bipolar transistor characteristics. In this paper, temporal and spatial characteristics of the well-potential modulation are characterized through 3-D TCAD simulations. Effects of well-contact layout, ion energy, and technology process parameters for a 90-nm bulk CMOS process are investigated. [ABSTRACT FROM PUBLISHER]

Heavy-ion experiments on spatially isolated inverters and densely populated inverters demonstrate the effects of transistor density on single-event (SE) transients in bulk CMOS. Increased transistor density reduces SE cross section dramatically while having little impact on transient pulse width. [ABSTRACT FROM PUBLISHER]

Heavy-ion data from a 130-nm bulk CMOS process shows a counterproductive result in using a common single-event charge collection mitigation technique. Guard bands, which are well contacts that surround individual transistors, can reduce single-event pulsewidths for normal strikes, but increase them for angled strikes. Calibrated 3-D TCAD mixed-mode modeling has identified a multiple-transistor charge collection mechanism that explains the experimental data, namely that angled strikes result in charge collection in the normally ON device that increases the restoring current on the struck device. [ABSTRACT FROM PUBLISHER]

A layout technique that exploits single-event transient pulse quenching to mitigate transients in combinational logic is presented. TCAD simulations show as much as 60% reduction in sensitive area and 70% reduction in pulse width for some logic cells. [ABSTRACT FROM AUTHOR]

Mixed mode simulations and heavy-ion experiments indicate the presence of multinode charge collection in advanced technologies. For logic circuits, such charge collection may result in concatenation of transients, extending the width of SETs. Mixed-mode simulations of a 4-bit adder circuit indicate that the increase in SET pulse width due to two-node charge collection can be as high as 75%. An analytical model for the increase in the SET width is developed showing the increase in SET width is proportional to the width of the individual transients, the relative delay between charge collection nodes, and the circuit topology. [ABSTRACT FROM PUBLISHER]