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SiO2‐Al2O3‐CaO‐based glass (10–60 wt%)/mullite composites were investigated for the LTCC and radome applications. The optimum densification temperatures decreased from 1550°C (10 wt% glass) to 1400°C (30 wt% glass) by means of liquid‐phase sintering, and to 850°C–825°C (50–60 wt% glass) by means of viscous phase sintering. XRD analysis showed that mullite was the main phase as well as in situ crystallized anorthite after 825°C. The composite with 20 wt% glass was a suitable candidate for the radome applications (bulk density = 2.86 g/cm3 after sintering at 1450°C, dielectric constant (loss) = 7.12 (0.0025) at 5 MHz, thermal expansion coefficient = 4.27 ppm/°C between 25°C and 800°C, thermal shock resistance parameter = 162°C), and the composite with 50 wt% glass was a suitable candidate for the low‐temperature cofired ceramic applications (bulk density = 2.64 g/cm3 after sintering at 850°C, dielectric constant (loss) = 6.79 (0.0043) at 5 MHz, thermal conductivity = 2.11 W/m⋅K at 25°C, and thermal expansion coefficient = 3.93 ppm/°C between 25°C and 300°C). [ABSTRACT FROM AUTHOR]

Mullite/glass/nano aluminum nitride (AlN) filler (1–10 wt% AlN) composites were successfully fabricated for the low‐temperature co‐fired ceramics applications that require densification temperatures lower than 950°C, high thermal conductivity to dissipate heat and thermal expansion coefficient matched to Si for reliability, and low dielectric constant for high signal transmission speed. Densification temperatures were ≤825°C for all composites due to the viscous sintering of the glass matrix. X‐ray diffraction proved that AlN neither chemically reacted with other phases nor decomposed with temperature. The number of closed pores increased with the AlN content, which limited the property improvement expected. A dense mullite/glass/AlN (10 wt%) composite had a thermal expansion coefficient of 4.44 ppm/°C between 25 and 300°C, thermal conductivity of 1.76 W/m.K at 25°C, dielectric constant (loss) of 6.42 (0.0017) at 5 MHz, flexural strength of 88 MPa and elastic modulus of 82 GPa, that are comparable to the commercial low temperature co‐fired ceramics products. [ABSTRACT FROM AUTHOR]

Al2O3/glass/hBN composites were successfully fabricated for the LTCC applications. Alignment and homogeneous distribution of the platelet hBN particles during tape casting allowed high hBN (5 wt%) loading as well as facilitated densification at 800°C (density of 2.65 g/cm3, apparent porosity of 0.7%). XRD results proved that hBN neither chemically reacted with the other phases nor decomposed with temperature, which was critical to increase thermal conductivity and at the same time to decrease dielectric constant. Dielectric constant of the dense composites decreased (or, alternatively, enhanced) with increasing hBN content from 7.3 for the 0 wt% hBN to 6.55 for the 5 wt% hBN at 5 MHz. In addition, hBN addition strongly improved the mean thermal conductivity from 1.86 W/m·K for the 0 wt% hBN to 2.43 W/m·K for the 5 wt% hBN between 75°C and 250°C. Therefore, the hBN phase itself effectively optimized both dielectric and thermal properties at the same time and made the Al2O3/glass/hBN composites a promising candidate for the LTCC applications. [ABSTRACT FROM AUTHOR]

Al 2 O 3 /B 2 O 3 powder mixtures prepared at various ratios from 10.7 to 54.1 wt% B 2 O 3 were used to synthesize Al 18 B 4 O 33 powders by solid state calcination at 1300 °C for 1 h. Al 18 B 4 O 33 formation was completed at 44 wt% B 2 O 3 instead of stoichiometric ratio of 13.17 wt% B 2 O 3. In other words, B 2 O 3 -rich liquid phase accelerated Al 18 B 4 O 33 crystallization. Al 18 B 4 O 33 particles were not acicular in shape when first formed, but they were fully acicular for the 44 wt% and the 54.1 wt% B 2 O 3 mixtures. Anorthite-based glass and CaO were selected to induce liquid phase sintering. CaO considerably improved densification to 95.4 % relative density at 1350 °C. Both glass and mullite also enhanced densification to 94.8 %. Epitaxial nucleation of mullite on Al 18 B 4 O 33 particles resulted in a solid solution as well. Dielectric, mechanical and thermal properties of the samples were investigated and evaluated for possible applications. [ABSTRACT FROM AUTHOR]