Search

One of the factors causing the failure of spacecraft integrated circuits is exposure to heavy charged particles. The entry of heavy charged particles into electronic devices leads to the appearance of single event transients (short current pulses), which in analog microcircuits manifest themselves in distortion of the output signal shape, and in digital microcircuits can cause a single event upset. The article discusses a technique for circuit mode-ling of the effect of heavy charged particles on bipolar analog microcircuits, including the developed equivalent electrical circuit of a bipolar transistor for LTSpice and the procedure for modeling transient processes. Despite the simplifications adopted, namely: failure to take into account the dependence of the duration of the rise and fall of the current pulse generated by a charged particle on the parameters of the transistor structure, the assumption that the entire charge is generated in the active base and the space charge regions of the emitter and collector junctions, an equivalent circuit has been developed made it possible to determine that the shape of the collector current pulse for circuit with a common emitter when exposed to a heavy charged particle is determined by the speed of the transistor and its operating mode. Using the developed methodology, the “critical” transistors of the two studied analog microcircuits were determined, and the need to bypass the current-setting resistors with a small capacitor was justified.

Determination of optical, mechanical and electrical characteristics is one of the decisive factors in the design of instrumentation structures of thermal uncooled bolometer-type detectors (microbolometers). The paper presents the results of optimization calculations by means of computer simulation of absorption, transmittance and reflection spectra of device structures of microbolometers based on thermosensitive vanadium oxide film by finite-difference time-domain method (FDTD). The characteristics of the investigated microbolometer structure were checked for compliance with mechanical and electrical requirements for this class of devices.

The increased interest in utilizing uncooled thermal bolometer-type detectors (microbolometers) within the infrared or terahertz detection field is justified by their operational and technological characteristics, in particular: relatively low manufacturing cost, high detection efficiency, compatibility with silicon CMOS technology, and operation at room temperature. The performance of such detectors depends on optimizing critical parameters, which are dictated by both the geometrical design and the electrical, optical, and thermal properties of the materials used. The determination of optical parameters stands as a decisive factor in the design of microbolometer structures. This article delves into the examination of optical parameters of thin films of structural materials of microbolometer based on thermosensitive vanadium oxide film manufactured at JSC “INTEGRAL”. The investigation showcases the results of determining optical constants (refractive indexes n and absorption coefficients k) of thin films from the transmission curve by applying the reflection-transmission method. Furthermore, a comparison is carried out between the results of computer modeling of the transmission, reflection and absorption spectra – taking into account the obtained values of the coefficients n and k – and the empirical data from the in-situ experiment.

Uncooled bolometric type thermal detectors, combined into a matrix and placed into a focal plane array have the following characteristics: low cost, operation at room temperature, compatibility with the silicon CMOS technology, and high detecting performance; therefore recently it became a hot spot in infrared or terahertz detection field. The performance of uncooled infrared focal plane detector arrays depends on the optimization of critical parameters which are determined by geometrical design and the electrical, optical, and thermal physical properties of the detector materials. We report the study of a fabrication process and characterization of two (2D) dimensional arrays of uncooled microbolometers based on silicon (α-Si) thermo-sensing films. Because these arrays substantially reduce sensor size, they are becoming the preferred format for most modern applications.

The results of the simulation the influence of the proton flux on the electrical characteristics of the device structure of dual-channel high electron mobility field effect transistor based on GaAs are presented. The dependences of the drain current ID and cut-off voltage on the fluence value and proton energy, as well as on the ambient temperature are shown.

The use of microelectronic products in outer space is possible if protection is provided against special external influencing factors, including radiation effect. For digital integrated circuits manufactured using submicron CMOS processes, the greatest influence is exerted by radiation effects caused by exposure to a heavy charged particle. The use of special design tools in the development of dual-purpose microcircuits, with increased resistance to the impact of heavy charged particles, prevents single events from occurring. Thus, the use of modern software products for device and technological modeling in microelectronics when developing the element base of radiation-resistant microcircuits for space purposes will cut the time to develop new products and make it possible to modernize (improve performance) already existing device and circuitry solutions. The paper delivers the results of modeling the impacts of heavy charged particles with a magnitude of linear energy transfer equal to 1.81, 10.1, 18.8, 55.0 MeV·cm2/mg, corresponding to nitrogen ions 15N+4 with an energy E = 1,87 MeV; argon 40Ar+12 with an energy E = 372 MeV; ferrum 56Fe+15 with an energy E = 523 MeV; xenon 131Xe+35 with an energy E = 1217 MeV, on electrical characteristics of n-MOSFET device structure. The dependences of the maximum drain current IС on the motion trajectory of a heavy charged particle and the ambient temperature are shown.

The self-heating effect is a major problem for gallium nitride electronic, optoelectronic and photonic devices. Average temperature increase and non-uniform distribution of dissipated power in the gallium nitride high electron mobility transistor lead to the forming of a hot spot in the vicinity of the conducting channel and to degradation of the drain current, output power and gain, as well as poor reliability. The purpose of this work is to develop the design using numerical simulation and to study the thermal phenomena that occur in the gallium nitride high-electron mobility transistor with a graphene-based heat removal system. The objects of the research are the structures fabricated on sapphire, silicon and silicon carbide substrates. The subject of the research is the electrical, frequency and thermal characteristics of the gallium nitride high-electron mobility transistor with a graphene-based heat removal system. The calculation results show that the integration of a graphene-based heat removal element into the design of the high electron mobility transistor can effectively mitigate the self-heating effect and thus improve the device performance. The advantage of the proposed concept is that the graphene-based heat removal element is structurally connected with a heat sink and aims at removing heat immediately from the maximum temperature region, providing an additional heat escape channel. The obtained results can be used by the electronics industry of the Republic of Belarus for developing the hardware components of gallium nitride power electronics.

Results of the investigation of IGBT manufacturing technology parameters influence on its dynamic features are presented. The important role of impurities concentration in various parts of IGBT structure (concentration level in the emitter of the bipolar transistor as apart of the IGBT structure, implantation dose in the MOS channel, the energy of ions implanted in the base of the bipolar transistor) was shown. These effects are discussed with the standpoint of dynamic characteristics of charge carriers. It was discovered that the level of impurity concentration in the emitter does not affect on the device dynamic features and reveals only small influence from the level of impurity concentration in the base. More effect is determined by the dose and energy of implanted ions under the doping of the MOS channel: the two-time dose increasing leads 20 % decreasing of switch on and switch off times of IGBT and the 20 % increasing of the ion energy leads to 25 % increasing of output impulse duration.

Current-voltage characteristics of MOSFET are obtained by computer simulation and their analysis is performed. The inadequacy of the classical models for simulation of nanoscale structures is revealed, as well as the unsuitability methods of direct quantum description for studies requiring a large number of computer experiments is detected.

The development and research of new constructive solutions, materials and technologies for sensor systems production is an actual problem. The transistor with high electron mobility (HEMT) is increasingly being used in such systems. The device-technological simulation of the characteristics of HEMT, based on AlGaN / GaN using different substrate materials has implemented. The influence of the percentage of Al and Ga in combination Alх Gaх-1N on the characteristics of considered unit has studied.

The results of the device simulation of a three-dimensional magnetometer based on Hall sensors integrated in a standard CMOS technology are presented. The Hall voltage vs magnetic field, Hall voltage vs magnetic field deviation angle, and sensitivity vs temperature curves were measured. The first-principles simulation of chalcogenide spinel CuCr2Se4 used in creation of a magnetic field concentrator was performed.

The results of the optimization of design and technological parameters device structures insulated-gate bipolar transistor (IGBT), formed in bulk silicon and using «Silicon on Insulator» (SOI) technology are presented. The specific features of the functioning of various constructive solutions IGBT are studied. A construction of SOI-IGBT structure with multiple gates, which allows a step change in the switched current, is suggested and investigated.