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The single-event transient (SET) response of a W-band (75–110 GHz) radar receiver front-end is investigated in this paper. A new technique to facilitate the SET testing of the high frequency transceivers is proposed and demonstrated experimentally. The entire radar receiver front-end, including the high frequency signal sources and modulators, were designed and fully integrated in 90 nm 300 GHz SiGe process technology (Global Foundries SiGe 9HP). Two-photon absorption (TPA) laser pulses were utilized to induce transient currents in different devices in various circuit blocks. The study shows how short transient pulses from the high frequency tuned circuits are propagated throughout the receiver and are broadened while passing through low-pass filters present at supply nodes and the low-pass filter following the down-conversion mixer, thus affecting the digital data at the output of the receiver. The proposed methodology allows the study of the effect of SETs on the recovered digital data at the output of the high frequency receivers, thus allowing bit error rate calculations. Comprehensive device and circuit level simulations were also performed, and a close agreement between the measurement results and simulation data was demonstrated. To the authors’ best knowledge, this is the first study of SET on full receiver at millimeter-wave (mmW) frequencies. [ABSTRACT FROM PUBLISHER]

Heavy-ion-induced single-event measurements for p-channel InGaSb quantum-well metal-on-insulator field-effect transistors (QW-MOSFETs) are demonstrated for a range of gate bias conditions. Two p-channel In0.33Ga0.67Sb QW structures were evaluated– a buried channel structure and a surface channel structure with and without an Al0.8In0.2Sb barrier layer respectively. The heavy-ion induced transient response is investigated for both structures. A slowly relaxing transient decay is observed in the buried channel device which is responsible for the bulk of the charge enhancement. It is effectively eliminated with the removal of the Al0.8In0.2Sb barrier, leading to a $10\times $ reduction in collected charge in the surface channel device. To analyze the transient response, a calibrated TCAD device simulation equipped with a heavy ion induced ionization model has been developed, which shows excellent agreement with the measured results for the entire range of evaluated gate bias conditions. The simulation analysis reveals that the charge collection enhancement phenomenon in a p-channel InGaSb QW-MOSFET is associated with the increased bipolar gain due to electron trapping in the Al0.8In0.2Sb barrier. [ABSTRACT FROM PUBLISHER]

Silicon-germanium heterojunction bipolar transistor (SiGe HBT) models are used in technology computer aided design (TCAD) to investigate single event transients induced by heavy-ion broadbeam and pulsed-laser two-photon absorption sources. A comparison between transient waveforms is provided, the proper extraction of heavy-ion broadbeam transients is discussed (along with circuit implications), and basic laser strike profiles are implemented in TCAD to provide insight into future design practices for simulation software to be used to describe laser-induced upsets in terms of an effective linear energy transfer (LET). [ABSTRACT FROM PUBLISHER]

The impact of semiconductor process scaling on the overall transient response of SiGe BiCMOS platforms is investigated. Pulsed-laser two-photon absorption (TPA) and heavy-ion broad-beam testing of SiGe HBT device and digital test structures across several generations of SiGe technologies are utilized to investigate the potential impacts of semiconductor process scaling (e.g., lateral/vertical scaling, changes in doping, Ge content, etc.) on the overall transient shape, magnitude, and duration. Technology scaling is shown to increase the single-event effect (SEE) sensitivity of SiGe HBTs (i.e., elevated collected charge, where 1st Gen. QC <3 rd Gen. QC <4 th Gen. QC ). Modern third-generation and fourth-generation devices under a forward-active bias (i.e., forward-biased EB junction, reverse-biased CB junction) exhibit a large diffusive transient component between the emitter and collector terminals, driving an elevation in collected charge. 3-D TCAD modeling is utilized to understand the fundamental transient mechanisms and assess the primary scaling factors affecting SEE sensitivity. Ion-strike simulations show that bulk traps can substantially enhance the charge collection mechanisms within these devices. These results suggest that SiGe technology scaling may have a strong impact on the radiation-induced transient response of SiGe HBTs, with future SiGe technology generations potentially exhibiting increased sensitivities to single-event effects. [ABSTRACT FROM PUBLISHER]

The single-event transient (SET) response of two different silicon-germanium (SiGe) X-band (8–12 GHz) low noise amplifier (LNA) topologies is fully investigated in this paper. The two LNAs were designed and implemented in 130nm SiGe HBT BiCMOS process technology. Two-photon absorption (TPA) laser pulses were utilized to induce transients within various devices in these LNAs. Impulse response theory is identified as a useful tool for predicting the settling behavior of the LNAs subjected to heavy ion strikes. Comprehensive device and circuit level modeling and simulations were performed to accurately simulate the behavior of the circuits under ion strikes. The simulations agree well with TPA measurements. The simulation, modeling and analysis presented in this paper can be applied for any other circuit topologies for SET modeling and prediction. [ABSTRACT FROM PUBLISHER]

The single-event transient (SET) response of the pre-amplification stage of two latched comparators designed using either npn or pnp silicon-germanium heterojunction bipolar transistors (SiGe HBTs) is investigated via two-photon absorption (TPA) carrier injection and mixed-mode TCAD simulations. Experimental data and TCAD simulations showed an improved SET response for the pnp comparator circuit. 2-D raster scans revealed that the devices in the pnp circuit exhibit a reduction in sensitive area of up to 80% compared to their npn counterparts. In addition, by sweeping the input voltage, the sensitive operating region with respect to SETs was determined. By establishing a figure-of-merit, relating the transient peaks and input voltage polarities, the pnp device was determined to have a 21.4% improved response with respect to input voltage. This study has shown that using pnp devices is an effective way to mitigate SETs, and could enable further radiation-hardening-by-design techniques. [ABSTRACT FROM PUBLISHER]

Carrier injection by single-photon absorption using ultraviolet optical pulses is used to investigate single-event transients in pristine and proton-irradiated AlGaN/GaN HEMTs. High-precision spatial mapping of defects and traps in AlGaN/GaN HEMT devices identify regions of enhanced SET signals, or “hot spots” that are ascribed to the presence of lattice defects that modify the electric field in the structure. The resulting transient shape and amplitude depend strongly on the specific location of the injected carriers, and vary with changes in gate and drain bias. Proton irradiation significantly alters transient signal shapes, increases the integrated collected charge, and increases density of defects and traps. [ABSTRACT FROM PUBLISHER]

The propagation of Analog Single Event Transients (ASETs) to multiple outputs of Bipolar Junction Transistor (BJTs) Integrated Circuits (ICs) is reported for the first time. The results demonstrate that ASETs can appear at several outputs of a BJT amplifier or comparator as a result of a single ion or single laser pulse strike at a single physical location on the chip of a large-scale integrated BJT analog circuit. This is independent of interconnect cross-talk or charge-sharing effects. Laser experiments, together with SPICE simulations and analysis of the ASET’s propagation in the s-domain are used to explain how multiple-output transients (MOTs) are generated and propagate in the device. This study demonstrates that both the charge collection associated with an ASET and the ASET’s shape, commonly used to characterize the propagation of SETs in devices and systems, are unable to explain quantitatively how MOTs propagate through an integrated analog circuit. The analysis methodology adopted here involves combining the Fourier transform of the propagating signal and the current-source transfer function in the s-domain. This approach reveals the mechanisms involved in the transient signal propagation from its point of generation to one or more outputs without the signal following a continuous interconnect path. [ABSTRACT FROM PUBLISHER]

The single-event transient (SET) response of a SiGe-based, L-band low-noise amplifier (LNA) is investigated, with a focus on providing recommendations for radiation event simulation techniques. Pulsed-laser, two-photon absorption experiments show that the SET sensitivity of the SiGe LNA is highly dependent on operating conditions and strike location. Time and frequency-domain analyses raise potential concerns for digital data modulated on RF carrier signals. Device and circuit-level ion-strike TCAD simulations are utilized to compare alternative simulation approaches, highlight the importance of parasitics on SET simulation accuracy, and suggest best practices for modeling radiation-induced transients within RF/mm-wave circuits. [ABSTRACT FROM AUTHOR]

The single event effect (SEE) response of devices and differential pairs in a 32-nm SOI CMOS technology is explored using laser-induced carrier injection and TCAD simulations. Both nFETs and pFETs in this technology exhibit similar sensitive area to laser-induced SEE and are strongly dependent on the drain bias condition. TCAD simulations were conducted in order to confirm results and utilize a 3-D mixed-mode simulation approach to more accurately model testing conditions. The differential pair (diff. pair) circuit SEE response extends the discussion to include the use of these devices in a core analog/RF circuit block. The analysis includes the use of floating body (FB) and body-connected (BC) devices. Body-connected FETs tend to exhibit a transient response that is much shorter in duration when compared directly to its floating body counterpart. [ABSTRACT FROM PUBLISHER]

The effects of negative feedback, both external and internal, on single event transients (SETs) in SiGe HBT analog circuits are investigated. In order to examine internal negative feedback effects, basic common-emitter NPN current mirrors, with and without emitter degeneration resistors, are utilized. A Wilson current mirror and a Wilson mirror with its intrinsic external feedback removed are used to study external negative feedback effects under the influence of laser-induced single events. The measurement data clearly show notable improvements in SET response that can be made by employing both internal and external negative feedback. The peak transient in the output current is reduced, and the settling time upon a laser strike is shortened significantly by negative feedback. All four investigated current mirrors were fabricated with IBM 8HP 130 nm SiGe BiCMOS technology. [ABSTRACT FROM PUBLISHER]

The single-event transient (SET) response of a third-generation bulk C-SiGe (\ npn + \ pnp) BiCMOS platform is investigated for the first time. Pulsed-laser, two-photon absorption experiments show that the pnp SiGe heterojunction bipolar transistor (SiGe HBT) exhibits a significant reduction in sensitive area as well as an improved transient response compared with the npn SiGe HBT. Ion-strike simulations on 3-D TCAD, C-SiGe HBT models agree with experimental findings, showing a reduction in overall transient duration and collected charge for the pnp SiGe HBT. These improvements in device-level SETs are attributed to the n-well isolation layer present in the vertical material stack of the pnp HBT. These results suggest that precision analog, RF/mm-wave, and high-speed digital applications utilizing unhardened, high-performance bulk pnp SiGe HBTs should benefit from an inherently improved SEE response. [ABSTRACT FROM PUBLISHER]

The single-event effect sensitivity of three different commonly employed current mirror circuits, as well as an unconventional inverse-mode current mirror, all implemented in C-SiGe (NPN + PNP) HBT on SOI technology are investigated. Comparisons of the measured data of the basic NPN and PNP current mirror circuits show higher single-event radiation tolerance of PNP SiGe HBTs compared with NPN SiGe HBTs. The concept of utilizing inverse-mode SiGe HBTs in current mirror circuits is investigated. Measurement results validate the feasibility of employing inverse-mode PNP SiGe HBTs in current mirrors and show an excellent resilience against ion-strikes. Full 3-D NanoTCAD models of the SiGe HBTs are developed and used in mixed-mode TCAD simulations (within Cadence) to validate the measurement results. Finally, based on the measurement data and analysis of the four current mirrors, some practical suggestions and observations are offered for operation of such circuits in extreme environments. [ABSTRACT FROM PUBLISHER]

Ion-induced, time-resolved charge-collection measurements for p-channel AlGaSb/InGaSb field-effect transistors are reported for a range of gate and drain bias conditions. The transient response reveals two distinct contributions: a faster initial response (< 1~ns) followed by a slower, > 10~ns, relaxation. The slower contribution depends sensitively on the applied gate bias, is suppressed when the gate is made more positive toward depletion, and is identified with an enhanced source-drain current in which more charge is collected than is deposited by the ion. A model consistent with the experimental measurements suggests that the dynamics of the enhancement processes are associated with the trapping and detrapping dynamics of electrons in the AlGaSb barrier materials. [ABSTRACT FROM PUBLISHER]

This paper uses charge deposition by two-photon absorption to present the first investigation of the physical mechanisms underlying the single event transient (SET) response of cascode structures in a 45-nm RF-CMOS/SOI technology, provides the first experimental comparison of SET between 45-nm and 32-nm RF-CMOS/SOI devices, and presents implications for circuit design in both technologies. This work leverages a number of different device types and is supported by calibrated TCAD simulations. [ABSTRACT FROM PUBLISHER]

Analog Single Event Transients (ASETs) in two different shunt voltage references used in power management systems are investigated. Little has been published regarding how the dynamic parameter changes induced by external circuit design, such as time constant, damping coefficient or natural frequency affect ASET shapes. Modifications of the dynamic parameters of the circuit are measured by step response measurement. A correlation between dynamic parameters and ASET laser testing results is proposed. This study establishes the correlation between the dynamic parameters of a shunt voltage reference and ASET parameters such as pulse duration, and positive and negative amplitude. [ABSTRACT FROM AUTHOR]

The Synergistic effect between TID and ATREEs (Analog Transient Radiation Effects on Electronics) in an operational amplifier (opamp) (LM124) is investigated for three different bias configurations. An accelerated irradiation technique is used to study these synergistic effects. The impact of TID on ATREEs is found to be identical regardless of whether the irradiation is performed at low dose rate or whether the dose rate is switched from high to low using the Dose Rate Switching (DRS) technique. The correlation between the deviations of the opamp's electrical parameters and the changes of ATREE widths is clearly established. [ABSTRACT FROM AUTHOR]