51. Mechanism of leakage of ion-implantation isolated AlGaN/GaN MIS-high electron mobility transistors on Si substrate
- Author
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Zhang Zhili, Yong Cai, Shuiming Li, Xuguang Deng, Shichuang Sun, Guohao Yu, Jie Yuan, Baoshun Zhang, Xiaodong Zhang, Zhihua Dong, Li Xiajun, Li Weiyi, Qian Sun, Yaming Fan, Liang Song, and Kai Fu
- Subjects
010302 applied physics ,Materials science ,Annealing (metallurgy) ,business.industry ,Gate dielectric ,Transistor ,02 engineering and technology ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,Series and parallel circuits ,01 natural sciences ,Variable-range hopping ,Electronic, Optical and Magnetic Materials ,law.invention ,Ion implantation ,law ,Electric field ,0103 physical sciences ,Materials Chemistry ,Optoelectronics ,Electrical and Electronic Engineering ,0210 nano-technology ,business ,Leakage (electronics) - Abstract
In this paper, we systematically investigated the leakage mechanism of the ion-implantation isolated AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MIS-HEMTs) on Si substrate. By means of combined DC tests at different temperatures and electric field dependence, we demonstrated the following original results: (1) It is proved that gate leakage is the main contribution to OFF-state leakage of ion-implantation isolated AlGaN/GaN MIS-HEMTs, and the gate leakage path is a series connection of the gate dielectric Si 3 N 4 and Si 3 N 4 -GaN interface. (2) The dominant mechanisms of the leakage current through LPCVD-Si 3 N 4 gate dielectric and Si 3 N 4 -GaN interface are identified to be Frenkel–Poole emission and two-dimensional variable range hopping (2D-VRH), respectively. (3) A certain temperature annealing could reduce the density of the interface state that produced by ion implantation, and consequently suppress the interface leakage transport, which results in a decrease in OFF-state leakage current of ion-implantation isolated AlGaN/GaN MIS-HEMTs.
- Published
- 2017