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117 results on '"Semiconductor chips -- Production processes"'

51. Terahertz clock rides rotary wave

Author

Merritt, Rick

Subjects
Semiconductor industry, Standard IC, Technology application, Semiconductor industry -- Technology application, Semiconductor industry -- Product development, Integrated circuits -- Product development, Integrated circuits -- Production processes, Semiconductor chips -- Product development, Semiconductor chips -- Production processes
Published
2006

52. Intel Cites Reasons to Stay on the Bus

Subjects
Semiconductor industry, Standard IC, Intel Corp. -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

SAN FRANCISCO--Intel will continue riding the bus route. Executives at the chip maker, in a high-level discussion of its Core Microarchitecture at its spring Developer Forum, here, said that the […]

Published
2006

53. Flip-chip methods adapted to nanotube fabrication

Author

Johnson, R. Colin

Subjects
Integrated circuit fabrication, Standard IC, Company business management, Company process management, Nanotubes -- Usage, Integrated circuit fabrication -- Methods, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Published
2006

54. Designers quietly tap async practices

Author

WIlson, Ron

Subjects
ATM, Circuit designer, Integrated circuit design, Standard IC, Semiconductor industry, Technology application, Market trend/market analysis, Fulcrum Microsystems -- Production processes, Asynchronous communications -- Technology application, Circuit design -- Forecasts and trends, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Logic devices -- Production processes, Semiconductor industry -- Production processes
Published
2005

55. Coalition regroups in design-to-mask bid

Author

Goering, Richard

Subjects
Standard IC, Semiconductor industry, Electronic design automation, Technology application, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Semiconductor industry -- Technology application, Semiconductor industry -- Production processes, Electronic design automation -- Technology application
Published
2005

56. TECHNOLOGY INSIGHT: Nanomaterial Opportunities in Integrated Circuits

Author

Garner, Michael

Subjects
Integrated circuits -- Production processes, Integrated circuits -- Design and construction, Semiconductor chips -- Production processes, Semiconductor chips -- Design and construction, Nanotechnology -- Usage, Nanotechnology -- Electric properties, Semiconductor industry -- Production processes, Semiconductor industry -- Materials, Standard IC, Semiconductor industry, Business, Chemicals, plastics and rubber industries, Construction and materials industries, Electronics, Metals, metalworking and machinery industries
Abstract

By C. Michael Garner, Director, Material Technology Operation, Intel Corp., Santa Clara, CA Integrated circuit industry continues to progress along Moore's Law and is currently in production on the 90nm [...]

Published
2004

57. Physical DFY techniques improve yields

Author

Rencher, Mark

Subjects
Standard IC, Semiconductor chips -- Production processes, Semiconductor chips -- Analysis, Integrated circuits -- Production processes, Integrated circuits -- Analysis
Published
2004

58. Littlest Lab Assistant

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Transistors -- Methods, Standard IC
Published
2004

59. Making rigid, flex-an alternative approach to building flexible circuit assemblies

Author

Fjelstad, Joe

Subjects
Standard IC, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

Flexible circuits are, and have been, a compelling technology for making electronic interconnections for many years. The advantages of the technology have been enumerated countless times both in this column […]

Published
2009

60. Fluorocarbon gas plasmas in the dry etching of electronic chips

Author

Becker, Thomas and Gates, Jeffrey

Subjects
Integrated circuits -- Production processes, Integrated circuits -- Chemical properties, Integrated circuits -- Materials, Semiconductor chips -- Production processes, Semiconductor chips -- Chemical properties, Semiconductor chips -- Materials, Fluorocarbons -- Environmental aspects, Fluorocarbons -- Usage, Moore's Law -- Research, Electronics industry -- Environmental aspects, Electronics industry -- Production management, Organosilicon compounds -- Properties, Plasma etching -- Methods, Standard IC, Moore's Law, Electronics industry, Business, Chemicals, plastics and rubber industries
Published
2009

61. Surface preparation prior to deposition

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Standard IC, Business, Engineering and manufacturing industries, High technology industry
Abstract

Integrated circuit design is constantly being scaled down in pursuit of faster circuit operation and lower power consumption. Scaled dimensions in a circuit design generally require attendant changes in fabrication [...]

Published
2006

62. Diverse CMP needs require a dielectric selectivity platform

Author

Grover, Gautam and Dirksen, James

Subjects
Semiconductor industry, Standard IC, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

OVERVIEW It is likely the 45nm technology node will see the introduction of new materials and integration schemes. For the early adopters, the choice of materials, applications, and integration schemes […]

Published
2005

63. Chipmakers sparing no effort to cut manufacturing costs

Subjects
Standard IC, Semiconductor industry, Company financing, Integrated circuits -- Production management, Integrated circuits -- Production processes, Integrated circuits -- Finance, Semiconductor chips -- Production management, Semiconductor chips -- Production processes, Semiconductor chips -- Finance, Semiconductor industry -- Production management, Semiconductor industry -- Production processes, Semiconductor industry -- Finance
Published
2003

65. The backbone of circuit connections: a look at how wire harness and cable standards were developed by association partnerships

Author

Crawford, Jack

Subjects
Semiconductor chips -- Production processes, Integrated circuits -- Production processes, Standard IC, Business, Electronics and electrical industries, Engineering and manufacturing industries
Abstract

The transition from cancelled military standards to industry-developed standards has been in progress for many years. As liaison to committees developing standards for assembly and joining, I've already encountered the [...]

Published
2002

66. Enpirion Achieves Quantum Leap in Micro-Fabrication and Materials Technology Introducing the World's First 2-Dimensional Thin-Film Magnetic Cores with New Wafer Level Magnetics Technology

Subjects
Magnetic alloys -- Production processes, Integrated circuits -- Production processes, Circuit components -- Production processes, Semiconductor chips -- Production processes, Standard IC, Semiconductor device, Business, Business, international
Abstract

* Newly developed planar magnetic alloy * Proven cost-effective CMOS compatible mass production process * Enables world's lowest cost highest density DC-DC converters HAMPTON, N.J. -- Enpirion, the leader of [...]

Published
2012

67. New 3D transistors promising future chips, lighter laptops

Subjects
Notebook computers -- Production processes, Transistors -- Production processes, Integrated circuits -- Production processes, Laptop computers -- Production processes, Semiconductor chips -- Production processes, Nanotechnology, Silicon -- Production processes, Laptop/portable computer, Standard IC, Business, international
Abstract

Researchers from Purdue and Harvard universities have created a new type of transistor made from a material that could replace silicon and have a 3D structure instead of conventional flat [...]

Published
2011

68. SHARPENING THE LINES

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Standard IC, News, opinion and commentary, Massachusetts Institute of Technology
Abstract

CAMBRIDGE, Mass. -- The following information was released by the Massachusetts Institute of Technology (MIT): The microchip revolution has seen a steady shrinking of features on silicon chips, packing in [...]

Published
2011

69. DIAMONDS, SILVER AND THE QUEST FOR SINGLE PHOTONS TINY CRYSTAL TOWERS ENLIGHTEN UNDERSTANDING OF PHOTON EMISSION, COULD INSPIRE DIAMOND MICROCHIPS FOR QUANTUM COMPUTING

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Standard IC, News, opinion and commentary
Abstract

ARLINGTON, VA -- The following information was released by the National Science Foundation: Building on earlier work, scientists and engineers recently developed a manufacturing process that allows them to craft [...]

Published
2011

70. X-FAB Releases First 0.18 Micrometer Foundry Solution for Integrated Hall Sensors

Subjects
Measuring instruments -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Sensors -- Production processes, Standard IC, Business, Business, international
Abstract

High-Performance Hall Sensor Capability Proven to Enable Cost-Effective SoCs ERFURT, Germany -- X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in 'More than Moore' technologies, today announced the industry's [...]

Published
2009

71. CEA/Leti and IBM to Collaborate on Future Nanoelectronics Technology

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Nanotechnology, Computers -- Production processes, Computer industry -- Production processes -- Research agreements, Complementary metal oxide semiconductors -- Production processes, Standard IC, Software/hardware leasing, Microcomputer industry, Computer industry, Business, Business, international
Abstract

CEA/Leti Becomes a Research Associate of IBM and IBM's Semiconductor Joint Development Alliance Ecosystem Centered in Albany GRENOBLE, France -- CEA/Leti (the Electronics and Information Technology Laboratory of the CEA, [...]

Published
2009

72. IBM and Mentor Graphics to Develop 22nm Computational Lithography Solution for the Integrated Circuit Industry

Subjects
Mentor Graphics Corp. -- Production processes, International Business Machines Corp. -- Production processes, Computer software industry -- Production processes, Software -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Computer industry -- Production processes, Semiconductor industry, Standard IC, Software quality, Microcomputer industry, Computer industry, Business, Business, international
Abstract

ARMONK, N.Y. & WILSONVILLE, Ore. -- IBM (NYSE: IBM) and Mentor Graphics Corporation (Nasdaq: MENT) today announced an agreement to jointly develop and distribute next-generation computational lithography (CL) software solutions [...]

Published
2008

73. X-FAB Sarawak Set to Begin Volume Production of 0.35 Micrometer Analog/Mixed-Signal High-Voltage Technology

Subjects
Analog to digital converters -- Technology application, Analog to digital converters -- Production management, Analog to digital converters -- Production processes, Measuring instruments -- Technology application, Measuring instruments -- Production management, Measuring instruments -- Production processes, Integrated circuits -- Technology application, Integrated circuits -- Production management, Integrated circuits -- Production processes, Semiconductor chips -- Technology application, Semiconductor chips -- Production management, Semiconductor chips -- Production processes, Standard IC, Technology application, Business, Business, international
Abstract

Process Qualification Enables Dual Sourcing by X-FAB UK and X-FAB Sarawak for Ample Capacity ERFURT, Germany -- X-FAB Silicon Foundries, the world's leading foundry for the production of analog/digital integrated [...]

Published
2008

74. austriamicrosystems High-Voltage CMOS Process Design Kit Based on Tanner Tools Available

Subjects
Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Complementary metal oxide semiconductors -- Production processes, Semiconductor industry, Standard IC, Business, Business, international
Abstract

New Tanner Based Process Design Kit Includes Complete Set of High-Voltage Devices, Model Files and IO Libraries Optimized for High-Voltage CMOS Product Design UNTERPREMSTAETTEN, Austria & ERLANGEN, Germany -- Fraunhofer [...]

Published
2008

75. TRADE NEWS: Agilent Technologies Offers First Commercial Package to Extract Device Models from Semiconductor Process Targets

Subjects
Agilent Technologies Inc. -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Circuit components -- Production processes, Semiconductor chips -- Production processes, Instrument industry -- Production processes, Complementary metal oxide semiconductors -- Production processes, Semiconductor industry, Standard IC, Semiconductor device, Business, Business, international
Abstract

Target Modeling Package for IC-CAP Enables Faster IC Design SANTA CLARA, Calif. -- Agilent Technologies Inc. (NYSE:A) today announced the first commercially available package that extracts models from semiconductor manufacturing [...]

Published
2008

76. I.B.M. to Announce an Advance in Chips

Author

Markoff, John

Subjects
Standard IC, Semiconductor device, Microcomputer industry, Computer industry, International Business Machines Corp. -- Production processes, Integrated circuits -- Production processes, Circuit components -- Production processes, Semiconductor chips -- Production processes, Computer industry -- Production processes
Abstract

The International Business Machines Corporation plans to announce today that it has perfected a significant new manufacturing process to produce semiconductor chips that can achieve either higher speed or significantly […]

Published
1998

77. Coming: self-powered integrated circuits

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Standard IC, Business, Engineering and manufacturing industries, Metals, metalworking and machinery industries
Abstract

The National Nano Device Lab in Taiwan has developed a manufacturing process that can build integrated circuits combining a two-sided solar cell and thin-film transistors (TFTs). The underlying process is [...]

Published
2011

78. Solido Integrates New Transistor-Level Statistical Design and Verification Technology with Cadence Virtuoso Analog Design Environment and Cadence Spectre Circuit Simulator

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Circuit design, Circuit designer, Integrated circuit design, Standard IC, Business, Business, international
Abstract

Integration Brings Sophisticated Statistical Design and Verification to Analog and Custom IC Designers; Ensures That Nanometer Designs Work Despite Wide Variations within a Given Manufacturing Process SASKATOON, Canada -- Solido [...]

Published
2007

79. MoSys Licenses 1T-SRAM for Advanced 55NM Process Technology to NEC Electronics; Technology to Help Drive New Advances in IC Products for Innovative Consumer, Networking, Graphics Applications

Subjects
Semiconductor industry, Standard IC, MoSys Inc. -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

SUNNYVALE, CA, May 23, 2007 (MARKET WIRE via COMTEX) -- MoSys, Inc. (NASDAQ: MOSY), the industry's leading provider of high-density system-on-chip (SoC) embedded memory intellectual property (IP), today announced that […]

Published
2007

80. IBM Brings Nature to Computer Chip Manufacturing; First-Ever Manufacturing Application of 'Self Assembly' Used to Create a Vacuum -- the Ultimate Insulator -- Around Nanowires for Next-Generation Microprocessors

Subjects
Standard IC, Microprocessor, Microprocessor upgrade, Microcomputer industry, Computer industry, International Business Machines Corp. -- Production processes, Central processing units -- Production processes, Microprocessors -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Computer industry -- Production processes
Abstract

ARMONK, NY, May 03, 2007 (MARKET WIRE via COMTEX) -- IBM (NYSE: IBM) today announced the first-ever application of a breakthrough self-assembling nanotechnology to conventional chip manufacturing, borrowing a process […]

Published
2007

81. Semiconductor Insights: Qualcomm Realizes 65nm with TSMC

Subjects
Intel Corp. -- Production processes, QUALCOMM Inc. -- Production processes, Telecommunications equipment industry -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Circuit components -- Production processes, Semiconductor chips -- Production processes, Semiconductor industry, Standard IC, Semiconductor device, Telecommunications equipment industry, Business, general, Business, regional
Abstract

OTTAWA, ONTARIO, Mar 29, 2007 (CCNMatthews via COMTEX) -- Semiconductor Insights (SI), the leader in technical and patent analyses of integrated circuits and electronic systems today announced that it is [...]

Published
2007

82. Semiconductor Insights: Qualcomm Realizes 65nm with TSMC

Subjects
Semiconductor industry, Standard IC, Semiconductor device, Telecommunications equipment industry, QUALCOMM Inc. -- Production processes, Semiconductor industry -- Production processes, Telecommunications equipment industry -- Production processes, Integrated circuits -- Production processes, Circuit components -- Production processes, Semiconductor chips -- Production processes
Abstract

OTTAWA, ONTARIO, Mar 29, 2007 (MARKET WIRE via COMTEX) -- Semiconductor Insights (SI), the leader in technical and patent analyses of integrated circuits and electronic systems today announced that it […]

Published
2007

83. Solido Design Announces New Transistor-Level Statistical Design and Verification Technology for Analog/Mixed-Signal, Custom Digital and Memory IC Designs

Subjects
Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Semiconductor industry, Standard IC, Business, Business, international
Abstract

New Technology Provides Framework to Ensure That Nanometer Designs Work Despite Wide Variations Within a Given Manufacturing Process SASKATOON, Saskatchewan -- Solido Design Automation today took the wraps off a [...]

Published
2007

84. I.B.M. to Make Smaller and Faster Chips

Author

Zuckerman, Laurence

Subjects
Semiconductor industry, Standard IC, Intel Corp. -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

I.B.M. plans to announce today that it has solved a fundamental problem holding back the development of faster semiconductor chips and will begin manufacturing chips early next year that are […]

Published
1997

86. Cadence(R) and PDF Solutions(R) to Collaborate on IC Design-for-Manufacturability Products and Roadmap

Subjects
Semiconductor industry, Standard IC, PDF Solutions Inc. -- Production processes, Cadence Design Systems Inc. -- Production processes, Computer software industry -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

SAN JOSE, CA, Apr 26, 2006 (MARKET WIRE via COMTEX) -- Cadence Design Systems, Inc. (NASDAQ: CDNS), the leading provider of IC and Electronic Systems Design Automation solutions, and PDF […]

Published
2006

87. True Circuits PLLs Selected by Icera

Subjects
Semiconductor industry, Standard IC, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

LOS ALTOS, CA, Apr 25, 2006 (MARKET WIRE via COMTEX) -- True Circuits, Inc. (TCI), a leading provider of analog and mixed-signal intellectual property (IP) for the semiconductor, systems and […]

Published
2006

88. UMC Fabricates World's Highest Frequency Silicon Circuit Using CMOS - 192-GHz Voltage-Controlled Oscillator; Push-push Voltage-Controlled Oscillator (VCO) designed by the University of Florida reaches 192-GHz Operating Frequency

Subjects
Circuit design, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Semiconductor industry, Standard IC, Integrated circuit design, Circuit designer, Business, Business, international
Abstract

HSINCHU, Taiwan -- UMC (NYSE:UMC)(TSE:2303), a world leading semiconductor foundry, today announced that it has fabricated a push-push Voltage-Controlled Oscillator (VCO) with an operating frequency of 192-GHz using its 0.13um [...]

Published
2006

89. X-FAB Offers IP Blocks for RF Designs; Speeds up Implementation of RF Circuitry into Working Silicon

Subjects
X-Fab Semiconductor Foundries AG -- Production processes, Circuit design, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Circuit components -- Production processes, Semiconductor chips -- Production processes, Semiconductor industry, Standard IC, Integrated circuit design, Semiconductor device, Circuit designer, Business, Business, international
Abstract

ERFURT, Germany -- X-FAB Semiconductor Foundries AG, one of the world's leading analog mixed-signal semiconductor foundries, has extended its IP offering to include RF building blocks for its 0.6 micrometer [...]

Published
2006

90. 32nm Inlet CPUs on schedule

Author

Nystedt, Dan

Subjects
Semiconductor industry, Standard IC, Intel Corp. -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

INTEL HAS ANNOUNCED that it has completed devetopment work on manufacturing technology that will allow it to produce chips with circuitry measuring a scant 32 nanometers--or a billionth of a […]

Published
2009

91. Pyxis Technology Announces Plan to Enter DFM Routing Space; EDA Startup Comes out of Stealth Mode; Announces Plans for New IC Routing Architecture Optimized for the Challenges Of Sub-100 nm Technology Nodes

Subjects
Integrated circuits -- Production processes, Integrated circuits -- Planning, Integrated circuits -- Technology application, Semiconductor chips -- Production processes, Semiconductor chips -- Planning, Semiconductor chips -- Technology application, Submarine boats -- Production processes, Submarine boats -- Planning, Submarine boats -- Technology application, Software -- Production processes, Software -- Planning, Software -- Technology application, Company business management, Company business planning, Standard IC, Technology application, Software quality, Company process management, Business, Business, international
Abstract

SANTA CLARA, Calif. -- New Software Promises to Optimize Designs for the Manufacturing Process, Simplify the Post-Tapeout Flow and Improve Design Yield Pyxis Technology, an electronic design automation (EDA) company [...]

Published
2005

92. CMOS RFIC Design Principles

Author

Caverly, Robert

Subjects
Semiconductor industry, Standard IC, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Complementary metal oxide semiconductors -- Production processes
Abstract

At one time, high-frequency engineers might have associated silicon CMOS processes with digital circuits or, at most, low-frequency RF devices. But with nanoscale fabrication processes improving, a variety of semiconductor [...]

Published
2008

93. AMD & SOI: winning with performance/watt/dollar: Nick Kepler, vice president of logic technology development at AMD talks about the role of SOI in the company's strategy

Author

Kepler, Nick

Subjects
Semiconductor industry, Standard IC, Microcomputer industry, Computer industry, International Business Machines Corp. -- Production processes, Executives -- Interviews, Technology, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Computer industry -- Production processes
Abstract

AMD Advanced Substrate News: How important is SOI to your strategy? Nick Kepler: SOI is an important part of AMD's product strategy. We are currently utilizing it for our entire […]

Published
2006

94. Process enhances spin-on low-k dielectric processing. (Technology News)

Author

Fitzgerald, Kevin

Subjects
Semiconductor industry, Standard IC, Shipley Co. -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

A new processing scheme allows for the solid-phase processing of spin-on porous low-k materials, overcoming the issues of barrier layer integrity, mechanical polishing, process-induced k value increases, and other integration […]

Published
2003

95. Covercoats, coverlayers and coverfi1ms...the basics. (Flexible Thinking)

Author

Fjelstad, Joseph

Subjects
Semiconductor industry, Standard IC, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

Flexible circuits almost always require a coating of some fashion over the finished circuits. At the same time, openings are nearly always required to provide access to circuit features for […]

Published
2003

96. Lead-free wave soldering: with the adoption of lead-free alloys in the electronics industry, soldering is the most critical assembly process!

Author

Westby, George

Subjects
Semiconductor chips -- Production processes, Integrated circuits -- Production processes, Solder and soldering -- Analysis, Standard IC, Business, Electronics and electrical industries, Engineering and manufacturing industries
Abstract

Problem To manage a lead-free wave soldering process, a number of equipment and process issues to should be considered. Implementing a lead-free wave solder process requires a solid plan. One [...]

Published
2002

97. Ohmi heads new Japanese research consortia(*). (Asiafocus)

Author

Kimura, Masahide

Subjects
Standard IC, Company business management, Company financing, Company process management, High-Performance and Agilent Cleanroom Association -- Finance, Tohoku University -- Officials and employees -- Management, Societies -- Finance, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Associations, institutions, etc. -- Finance, Japan -- Science and technology policy
Abstract

Tadahiro Ohmi, Tohoku University heads two new Japanese research projects. Other ongoing Japanese research consortia include the government-supported MIRAI project on basic 0.07-0.05µm technology, and the privately funded ASKA/Selete efforts […]

Published
2002

98. New '3-D' transistors promising future chips, lighter laptops

Subjects
Notebook computers -- Production processes, Transistors -- Production processes, Integrated circuits -- Production processes, Laptop computers -- Production processes, Semiconductor chips -- Production processes, Nanotechnology, Silicon -- Production processes, Laptop/portable computer, Standard IC, Computers, News, opinion and commentary
Abstract

WEST LAFAYETTE, IN - Researchers from Purdue and Harvard universities have created a new type of transistor made from a material that could replace silicon and have a 3-D structure [...]

Published
2011

99. Mentor Graphics Tessent YieldInsight Demonstrates Faster IC Failure and Yield Analysis at Fujitsu

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Standard IC, Computers, News, opinion and commentary
Abstract

Mentor Graphics Corporation (NASDAQ: MENT) announced evaluation results at Fujitsu Semiconductor Ltd. that shows the Tessent® YieldInsight® diagnosis-driven yield analysis tool can help cut the time required to determine the [...]

Published
2011

100. FUJITSU/TSMC TO COLLABORATE ON 28NM PROCESS TECHNOLOGY

Subjects
Taiwan Semiconductor Manufacturing Company Ltd. -- Production processes, Fujitsu Semiconductor America Inc. -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Semiconductor industry, Standard IC, Business, Computers and office automation industries, Engineering and manufacturing industries
Abstract

Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) have agreed to collaborate on 28-nanometer (nm) process technology targeted for foundry production of Fujitsu Microelectronics' 28nm [...]

Published
2009

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