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Ultrathin two-dimensional (2D) semiconducting layered materials offer great potential for extending Moore's law of the number of transistors in an integrated circuit.sup.1. One key challenge with 2D semiconductors is to avoid the formation of charge scattering and trap sites from adjacent dielectrics. An insulating van der Waals layer of hexagonal boron nitride (hBN) provides an excellent interface dielectric, efficiently reducing charge scattering.sup.2,3. Recent studies have shown the growth of single-crystal hBN films on molten gold surfaces.sup.4 or bulk copper foils.sup.5. However, the use of molten gold is not favoured by industry, owing to its high cost, cross-contamination and potential issues of process control and scalability. Copper foils might be suitable for roll-to-roll processes, but are unlikely to be compatible with advanced microelectronic fabrication on wafers. Thus, a reliable way of growing single-crystal hBN films directly on wafers would contribute to the broad adoption of 2D layered materials in industry. Previous attempts to grow hBN monolayers on Cu (111) metals have failed to achieve mono-orientation, resulting in unwanted grain boundaries when the layers merge into films.sup.6,7. Growing single-crystal hBN on such high-symmetry surface planes as Cu (111).sup.5,8 is widely believed to be impossible, even in theory. Nonetheless, here we report the successful epitaxial growth of single-crystal hBN monolayers on a Cu (111) thin film across a two-inch c-plane sapphire wafer. This surprising result is corroborated by our first-principles calculations, suggesting that the epitaxial growth is enhanced by lateral docking of hBN to Cu (111) steps, ensuring the mono-orientation of hBN monolayers. The obtained single-crystal hBN, incorporated as an interface layer between molybdenum disulfide and hafnium dioxide in a bottom-gate configuration, enhanced the electrical performance of transistors. This reliable approach to producing wafer-scale single-crystal hBN paves the way to future 2D electronics. The epitaxial growth of single-crystal hexagonal boron nitride monolayers on a copper (111) thin film across a sapphire wafer suggests a route to the broad adoption of two-dimensional layered semiconductor materials in industry., Author(s): Tse-An Chen [sup.1] , Chih-Piao Chuu [sup.1] , Chien-Chih Tseng [sup.2] , Chao-Kai Wen [sup.2] , H.-S. Philip Wong [sup.1] , Shuangyuan Pan [sup.3] , Rongtan Li [sup.4] [sup.5] [...]

Recent advances in neuroscience together with nanoscale electronic device technology have resulted in huge interests in realizing brain-like computing hardwares using emerging nanoscale memory devices as synaptic elements. Although there has been experimental work that demonstrated the operation of nanoscale synaptic element at the single device level, network level studies have been limited to simulations. In this work, we demonstrate, using experiments, array level associative learning using phase change synaptic devices connected in a grid like configuration similar to the organization of the biological brain. Implementing Hebbian learning with phase change memory cells, the synaptic grid was able to store presented patterns and recall missing patterns in an associative brain-like fashion. We found that the system is robust to device variations, and large variations in cell resistance states can be accommodated by increasing the number of training epochs. We illustrated the tradeoff between variation tolerance of the network and the overall energy consumption, and found that energy consumption is decreased significantly for lower variation tolerance.

The development of silicon semiconductor technology has produced breakthroughs in electronics--from the microprocessor in the late 1960s to early 1970s, to automation, computers and smartphones--by downscaling the physical size of devices and wires to the nanometre regime. Now, graphene and related two-dimensional (2D) materials offer prospects of unprecedented advances in device performance at the atomic limit, and a synergistic combination of 2D materials with silicon chips promises a heterogeneous platform to deliver massively enhanced potential based on silicon technology. Integration is achieved via three-dimensional monolithic construction of multifunctional high-rise 2D silicon chips, enabling enhanced performance by exploiting the vertical direction and the functional diversification of the silicon platform for applications in opto-electronics and sensing. Here we review the opportunities, progress and challenges of integrating atomically thin materials with silicon-based nanosystems, and also consider the prospects for computational and non-computational applications. Progress in integrating atomically thin two-dimensional materials with silicon-based technology is reviewed, together with the associated opportunities and challenges, and a roadmap for future applications is presented., Author(s): Deji Akinwande [sup.1] , Cedric Huyghebaert [sup.2] , Ching-Hua Wang [sup.3] , Martha I. Serna [sup.1] , Stijn Goossens [sup.4] , Lain-Jong Li [sup.5] , H.-S. Philip Wong [sup.3] [...]

Semiconducting single‐walled carbon nanotube (CNT) is a promising candidate as a channel material for advanced logic transistors, attributed to the ultra‐thin 1‐nm cylindrical geometry, high mobility, and high carrier injection velocity. However, the presence of undesired CNT bundles in the CNT arrays for wafer‐scale device fabrication, even when utilizing the state‐of‐the‐art dimension‐limited self‐alignment (DLSA) method, poses challenges. These CNT bundles degrade the transistor gate's efficiency in controlling the flow of charge carriers in the CNT channel, leading to pronounced device‐to‐device variability. Here, a novel method is introduced to alleviate bundling in CNT arrays assembled via DLSA, by involving small molecule additive to screen the attractive van der Waals force between neighboring CNTs during the DLSA process, resulting in over 50% reduction in CNT bundling. Furthermore, a pioneering methodology for quantifying CNT bundles is presented and employed experimentally to assess bundles in dense CNT arrays assembled by DLSA using transmission electron microscopy. Both experimental data and molecular dynamics simulation reveal that CNT bundling originates from van der Waals attraction between CNTs, and the disturbed liquid‐liquid interface by accumulating excess polar molecules. These findings illuminate new pathways for realizing dense, bundle‐free CNT arrays. [ABSTRACT FROM AUTHOR]

Author(s): Max M. Shulaker (corresponding author) [1, 2]; Gage Hills [1]; Rebecca S. Park [1]; Roger T. Howe [1]; Krishna Saraswat [1]; H.-S. Philip Wong [1]; Subhasish Mitra [1, 3] [...]

Carbon nanotubes (CNTs) have great potential for future high-performance and energy-efficient transistor technology. To realize this potential, methods to dope the CNTs need to be developed to achieve low parasitic resistance of the transistor. Two key issues present themselves: (a) understanding the doping mechanism of the various methods and (b) stability of the doping method. For instance, although studies on molybdenum oxide (MoOx) demonstrate its ability to heavily dope nanomaterials, the interaction between MoOx and the CNT is unclear. Here, we observe an unstable effect of MoOx on the CNT and demonstrate dielectric passivation as a means to preserve the doping strength. The semiconducting CNTs exhibit greater than 103× reduction in resistance after stably doped with MoOx. By exploiting the instability of MoOx, we delve deeper into clarifying the doping mechanism. The relationship between the time-dependent material property of MoOx and the change in the electrical measurements of CNT devices is investigated to study the role of work function in doping the CNTs. We conclude that the doping mechanism of MoOx on the CNT is due to bandgap modulation by charge transfer, which occurs due to the difference in work function between MoOx and the CNT. [ABSTRACT FROM AUTHOR]