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154. RF performance boosting for 40nm-node CMOS device by low-k/Cu dual damascene contact

155. Highly reliable TaOx ReRAM and direct evidence of redox reaction mechanism

160. A new direct low-k/Cu dual damascene (DD) contact lines for low-loss (LL) CMOS device platforms

161. Fast switching and long retention Fe-O ReRAM and its switching mechanism

171. A Novel Resistivity Measurement Technique for Scaled-down Cu Interconnects Implemented to Reliability-focused Automobile Applications

177. A robust 45 nm-node, dual damascene interconnects with high quality cu/barrier interface by a novel oxygen absorption process

188. Phase I/II study of carboplatin and weekly paclitaxel for advanced non-small cell lung cancer

195. Advanced LSI embedded with FeRAM for contactless IC cards and its manufacturing technology

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