151. 3DVLSI with CoolCube process: An alternative path to scaling
- Author
-
Batude, P., primary, Fenouillet-Beranger, C., additional, Pasini, L., additional, Lu, V., additional, Deprat, F., additional, Brunet, L., additional, Sklenard, B., additional, Piegas-Luce, F., additional, Casse, M., additional, Mathieu, B., additional, Billoint, O., additional, Cibrario, G., additional, Turkyilmaz, O., additional, Sarhan, H., additional, Thuries, S., additional, Hutin, L., additional, Sollier, S., additional, Widiez, J., additional, Hortemel, L., additional, Tabone, C., additional, Samson, M-P, additional, Previtali, B., additional, Rambal, N., additional, Ponthenier, F., additional, Mazurier, J., additional, Beneyton, R., additional, Bidaud, M., additional, Josse, E., additional, Petitprez, E., additional, Rozeau, O., additional, Rivoire, M., additional, Euvard-Colnat, C., additional, Seignard, A., additional, Fournel, F., additional, Benaissa, L., additional, Coudrain, P., additional, Leduc, P., additional, Hartmann, J-M., additional, Besson, P., additional, Kerdiles, S., additional, Bout, C., additional, Nemouchi, F., additional, Royer, A., additional, Agraffeil, C., additional, Ghibaudo, G., additional, Signamarcheix, T., additional, Haond, M., additional, Clermidy, F., additional, Faynot, O., additional, and Vinet, M., additional
- Published
- 2015
- Full Text
- View/download PDF