151. Dic-guided ellipsometer to characterize ultrathin patterned films with an improved fitting model.
- Author
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Dai, Xingang, Zhang, Hongru, Hu, Yanjun, Jing, Gaoshan, and Fan, Guofang
- Subjects
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THIN films , *SEMICONDUCTOR films , *SEMICONDUCTOR manufacturing , *ATOMIC force microscopy , *ELLIPSOMETRY - Abstract
• An improved fitting method was developed to accurately measure ultrathin sample. • Accurately measured SAM have a mean thickness of 0.89 nm and a RI of 1.387. • Fabrication of ultra-thin SAM films using semiconductor fabrication techniques. • Non-contact characterization of thickness and optical property of ultrathin sample. A differential interference contrast (DIC) system was introduced to guide non-destructive ellipsometer metrology for characterizing ultrathin-film. Patterned self-assembled monolayer was fabricated as ultrathin-film samples. Furthermore, an improved fitting method was developed to describe the samples. The ellipsometer analysis revealed a mean thickness of 0.89 nm and a refractive index of 1.387 for the samples, consistent with Atomic Force Microscopy results and previous reports. These results validate well performance ellipsometers combination with DIC systems as preferred non-destructive characterization tools for determining the ultrathin film. Moreover, the potential capability of the DIC-guided ellipsometry technique was verified in the field of patterned ultrathin film measurements. [ABSTRACT FROM AUTHOR]
- Published
- 2025
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