812 results on '"Gessner T"'
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302. Comparison of CoSi2 interconnection lines on crystalline and noncrystalline silicon fabricated by writing focused ion beam implantation
303. Electrical characterization of reactively sputtered TiN diffusion barrier layers for copper metallization
304. Structure and electrical properties of thin copper films deposited by MOCVD
305. Evaluation of selective tungsten plugs on TiN, W and AlSi by analytical and electrical measurements
306. Resistance to blood flow in microvessels in vivo.
307. Technology tools for a high precision accelerometer in bulk micromechanics
308. ChemInform Abstract: 3,4‐Dibromo‐2,5‐bis‐dicyanomethylene‐1‐(1‐pyridinio)‐3‐cyclopentene‐1‐ ides: Novel Pyridinium Ylides of the Cylopentadiene Series.
309. Interface reactions between CVD and PVD tungsten and aluminium
310. Selective tungsten CVD on sputtered tungsten for via fill
311. Electrostatic micromechanic actuators
312. EFFECTS OF PHOTODYNAMIC TREATMENT OF PLATELETS OR ENDOTHELIAL CELLS in vitro ON PLATELET AGGREGATION
313. A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface.
314. Laser display technology.
315. High temperature stable metallization schemes for SiC-technology operating in air.
316. Polymer lab-on-chip systems with integrated electrochemical pumps suitable for large-scale fabrication.
317. Investigation of tungsten CVD on Mo and TiN
318. Chapter 8 - Spin-on Si-based low-k materials
319. Chapter 7 - Chemical vapor deposition of C-F low-k materials
320. Infrared spectroscopy of bonded silicon wafers.
321. Silicon vibration sensor arrays with electrically tunable band selectivity.
322. Fabrication of subwavelength holes using nanoimprint lithography
323. Quantum mechanical methods for the simulation of electronic transport through carbon nanotubes.
324. Influence of copper on the catalytic carbon nanotube growth process.
325. Characterization of Sputtered Ta and TaN Films by Spectroscopic Ellipsometry.
326. Fabrication and characterization of a micro-machined ultrasonic transducer.
327. Plasma levels of daunorubicin metabolites and the outcome of ANLL therapy.
328. A simplified method for determination of daunorubicin, adriamycin, and their chief fluorescent metabolites in human plasma by high-pressure liquid chromatography.
329. Enhancement and deactivation of some microsomal glycosyl transferases.
330. Gamma- und Röntgendetektoren aus hochohmigem neutronendotiertem n-Silizium.
331. Mechanism for gastric accumulation of meperidine and effect of antacid.
332. Direct bonding with on-wafer metal interconnections
333. Seven symptom profiles.
334. Ein‐ und zweikernige Kupfer(I)‐ und Silber(I)‐Phosphan‐Komplexe mit β‐Diketonato‐Teilstrukturen
335. Enzymatic Properties of Human Glucuronyltransferase and a Sensitive Method for Its Assay in a Stable B Lymphocyte Cell Line
336. Ellipsometric study of the change in the porosity of silica xerogels after chemical modification of the surface with hexamethyldisilazane
337. Copper alloy formation and film properties after annealing of Al/Cu stacks in different ambients
338. Application of combined thermal and electrical simulation for optimization of deep submicron interconnection systems
339. Silicon oxide in SiSi bonded wafers
340. Closed-form formulae for frequency-dependent 3-D interconnect inductance
341. A single-crystal Si-resonator with on-chip readout amplifier in standard CMOS
342. Modelling and simulation for dielectric constant of aerogel
343. Silicon mirrors and micromirror arrays for spatial laser beam modulation
344. Microstructural changes of Pt/Ti bilayer during annealing in different atmospheres an XRD study
345. Direct calibration ELISA: a rapid method for the simplified determination of association constants of unlabeled biological molecules
346. Determination of ohmic contacts to n-type 6H- and polycrystalline 3C-SiC using circular transmission line structures
347. Drug interactions: inhibition of acetaminophen glucuronidation by drugs.
348. Gamma- und Rontgendetektoren aus hochohmigem neutronendotiertem n-Silizium
349. Copper dry etching technique for ULSI interconnections
350. Halogen based copper RIE - influence of the material characteristics and deposition processes
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