1. Optical Transimpedance Receiver for High Data Transmission in OFDM Modulation Format
- Author
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Frederique Deshours, Georges Alquie, Ghalid Idir Abib, Emmanuel Grard, Victor Rodrigues, Eric Leclerc, Ali Kabalan, Anne-Laure Billabert, Laboratoire d'Electronique et Electromagnétisme (L2E), Université Pierre et Marie Curie - Paris 6 (UPMC), Département Electronique et Physique (TSP - EPH), Institut Mines-Télécom [Paris] (IMT)-Télécom SudParis (TSP), 3S Photonics, United Monolithic Semiconductors (UMS), Electronique, Systèmes de communication et Microsystèmes (ESYCOM), Conservatoire National des Arts et Métiers [CNAM] (CNAM), HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris, Département Electronique et Physique (EPH), and Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris-Conservatoire National des Arts et Métiers [CNAM] (CNAM)
- Subjects
Transimpedance amplifier ,Engineering ,business.industry ,Orthogonal frequency-division multiplexing ,Optical link ,020208 electrical & electronic engineering ,Electrical engineering ,02 engineering and technology ,Optical performance monitoring ,Optical modulation amplitude ,Noise figure ,Passive optical network ,Atomic and Molecular Physics, and Optics ,[SPI.ELEC]Engineering Sciences [physics]/Electromagnetism ,020210 optoelectronics & photonics ,Radio over fiber ,0202 electrical engineering, electronic engineering, information engineering ,Electronic engineering ,business - Abstract
International audience; This paper presents the design and performance of a single-ended transimpedance amplifier (TIA) for gigabit passive optical networks (GPON) implementing orthogonal frequency division multiplexing (OFDM) modulation format. The circuit is realized using an industrial GaAs integrated technology. Low power consumption and small chip area are the main challenges in the TIA design. On-wafer characterization in terms of S-parameters, noise figure, gain compression and intermodulation are presented and compared to simulated results showing a good agreement. The TIA is linked with a broadband PIN photodiode and introduced in a radio over fiber (RoF) system. The optical link is simulated in a microwave software and characterized in terms of error vector magnitude (EVM) by varying the radio frequency (RF) input power and the laser bias current.
- Published
- 2015