1. Research in the Simulation Model of IGBT Package
- Author
-
Bao Hailong, Zhang Yu, Che Jiajie, Jin Rui, Zhang Peng, Han Ronggang, Liu Jun, and Yu Kunshan
- Subjects
business.industry ,Computer science ,Hardware_PERFORMANCEANDRELIABILITY ,Insulated-gate bipolar transistor ,Integrated circuit design ,computer.software_genre ,Chip ,Simulation software ,Interconnect parasitics ,Chip-scale package ,Embedded system ,Hardware_INTEGRATEDCIRCUITS ,Electronic engineering ,Integrated circuit packaging ,Parasitic extraction ,business ,computer - Abstract
Simulation technology provides a powerful tool for the IGBT module design. The IGBT chip model and the interconnect parasitics are the most important factors for the package design of IGBT module. By the aid of the simulation software, the IGBT chip model is fulfilled and the package parasitics is extracted. So the whole simulation deign platform of IGBT package achieves.
- Published
- 2013