37 results on '"Colonna, Jean-Philippe"'
Search Results
2. Stress Engineering in Germanium-Silicon Heterostructure Using Surface Activated Hot Bonding
3. Germanium thin film manufacturing using covalent bonding process
4. Erbium implanted silicon rich oxide thin films suitable for slot waveguides applications
5. High Power 2.5D Integrated Thermoelectric Generators Combined with Microchannels Technology
6. Investigation of hafnium-aluminate alloys in view of integration as interpoly dielectrics of future Flash memories
7. Integrated thermoelectric sensors based on quantum dot superlattice for thermal management applications
8. Design and fabrication of an ultra-thin silicon vapor chamber for compact electronic cooling
9. Effect of Nitridation for High-K Layers by ALCVDTM in Order to Decrease the Trapping in Non Volatile Memories
10. Oxidation of Suspended Stacked Silicon Nanowire for Sub-10nm Cross-Section Shape Optimization
11. Growth and Thermal Stability of SiGe/Si Superlattices on Bulk Si Wafers
12. 3D Suspended Nanowires Integration for CMOS and Beyond
13. Advanced Substrates for GaN-Based Power Devices
14. Thermal and Mechanical Simulations for Fan-Out Wafer-Level Packaging Technology: Introduction of a "Solder Heatsink"
15. Add-On Microchannels for Hotspot Thermal Management of Microelectronic Chips in Compact Applications
16. Embedded Vapor Chamber in Microelectronics Devices
17. Theoretical Study of Miniaturization of a Silicon Vapor Chamber for Compact Microelectronics
18. In-Situ Confocal Microscopy to Analyze Volume Expansion of Solid State Microbatteries.
19. 3D hybrid bonding assembly studied by scanning thermal microscopy, resistive thermometry and Finite Element Modelling
20. Environment and baking influence on charge retention on silicon nitride charge trap layers.
21. Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells
22. Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits
23. Thermal performance of 3D ICs: Analysis and alternatives
24. Using TSVs for thermal mitigation in 3D circuits: Wish and truth
25. Thermal Effects of Silicon Thickness in 3-D ICs: Measurements and Simulations
26. Limit to the erbium ions emission in silicon-rich oxide films by erbium ion clustering
27. Electrical and morphological assessment of via middle and backside process technology for 3D integration
28. Explanation of the Charge-Trapping Properties of Silicon Nitride Storage Layers for NVM Devices Part I: Experimental Evidences From Physical and Electrical Characterizations
29. CVD Growth and Passivation of W and TiN Nanocrystals for Non-volatile Memory Applications
30. Realization of Hybrid Silicon core/silicon Nitride Shell Nanodots by LPCVD for NVM Application
31. Impact of integrating microchannel cooling within 3D microelectronic packages for portable applications.
32. Stress Engineering in Germanium-Silicon Heterostructure Using Surface Activated Hot Bonding
33. Graphite-based heat spreaders for hotspot mitigation in 3D ICs.
34. 3D Suspended Nanowires Integration for CMOS and Beyond
35. Oxidation of Suspended Stacked Silicon Nanowire for Sub-10nm Cross-Section Shape Optimization
36. Growth and Thermal Stability of SiGe/Si Superlattices on Bulk Si Wafers
37. Effect of Nitridation for High-K Layers by ALCVDTM in Order to Decrease the Trapping in Non Volatile Memories
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.