Search

To increase density of superconductor digital and neuromorphic circuits by 10x and reach integration scale of $10^8$ Josephson junctions (JJs) per chip, we developed a new fabrication process on 200-mm wafers, using self-shunted Nb/Al-AlOx/Nb JJs and kinetic inductors. The process has a layer of JJs, a layer of resistors, and 10 fully planarized superconducting layers: 8 Nb layers and 2 layers of high kinetic inductance materials, Mo$_2$N and NbN, with sheet inductance of 8 pH/sq and 3 pH/sq, respectively. NbN films were deposited by two methods: with $T_c$=15.5 K by reactive sputtering of a Nb target in Ar+N$_2$ mixture; with $T_c$ in the range from 9 K to 13 K by plasma-enhanced chemical vapor deposition (PECVD) using Tris(diethylamido)(tert-butylimido)niobium(V) metalorganic precursor. PECVD of NbN was investigated to obtain conformal deposition and filling narrow trenches and vias with high depth-to-width ratios, which was not possible to achieve using sputtering and other physical vapor deposition (PVD) methods at temperatures below $200 ^oC$ required to prevent degradation of Nb/Al-AlOx/Nb junctions. Nb layers with 200 nm thickness are used in the process layer stack as ground planes to maintain a high level of interlayer shielding and low intralayer mutual coupling, for passive transmission lines with wave impedances matching impedances of JJs, typically <=50 $\Omega$, and for low-value inductors. NbN and NbN/Nb bilayer are used for cell inductors. Using NbN/Nb bilayers and individual pattering of both layers to form inductors allowed us to minimize parasitic kinetic inductance associated with interlayer vias and connections to JJs as well as to increase critical currents of the vias. Fabrication details and results of electrical characterization of NbN films, wires, and vias, and comparison with Nb properties are given., Comment: 12 pages, 16 figures, 4 tables, 49 references. Submitted to IEEE TAS on Nov. 10, 2022

Using a fully automated cryogenic wafer prober, we measured superconductor fabrication process control monitors and simple integrated circuits on 200 mm wafers at 4.4 K, including SQIF-based magnetic field sensors, SQUID-based circuits for measuring inductors, Nb/Al-AlOx/Nb Josephson junctions, test structures for measuring critical current of superconducting wires and vias, resistors, etc., to demonstrate the feasibility of using the system for characterizing niobium superconducting devices and integrated circuits on a wafer scale. Data on the wafer-scale distributions of the residual magnetic field, junction tunnel resistance, energy gap, inductance of multiple Nb layers, critical currents of interlayer vias are presented. Comparison with existing models is made. The wafers were fabricated in the SFQ5ee process, the fully planarized process with eight niobium layers and a layer of kinetic inductors, developed for superconductor electronics at MIT Lincoln Laboratory. The cryogenic wafer prober was developed at HPD/ FormFactor, Inc., Comment: 11 pages, 11 figures, 1 table, 27 references

Inductance of superconducting thin-film inductors and structures with linewidth down to 250 nm has been experimentally evaluated. The inductors include various striplines and microstrips, their 90-degree bends and meanders, interlayer vias, etc., typically used in superconducting digital circuits. The circuits have been fabricated by a fully planarized process with 8 niobium layers, developed at MIT Lincoln Laboratory for very-large-scale superconducting integrated circuits. Excellent run-to-run reproducibility and inductance uniformity of better than 1% across 200-mm wafers have been found. It has been found that the inductance per unit length of stripline and microstrip line inductors continues to grow as the inductor linewidth is reduced deep into the submicron range to the widths comparable to the film thickness and magnetic field penetration depth. It is shown that the linewidth reduction does not lead to widening of the parameter spread due to diminishing sensitivity of the inductance to the linewidth and dielectric thickness. The experimental results were compared with numeric inductance extraction using commercial software and freeware, and a good agreement was found for 3-D inductance extractors. Methods of further miniaturization of circuit inductors for achieving circuit densities > 10^6 Josephson junctions per cm^2 are discussed., Comment: 5 pages, 7 figures, 31 references. Presented at Applied Superconductivity Conference, ASC 2014, Charlotte, NC, USA, August 10-15, 2014

A fabrication process for Nb/Al-AlOx/Nb Josephson junctions (JJs) with sizes down to 200 nm has been developed on a 200-mm-wafer tool set typical for CMOS foundry. This process is the core of several nodes of a roadmap for fully-planarized fabrication processes for superconductor integrated circuits with 4, 8, and 10 niobium layers developed at MIT Lincoln Laboratory. The process utilizes 248 nm photolithography, anodization, high-density plasma etching, and chemical mechanical polishing (CMP) for planarization of SiO$_2$ interlayer dielectric. JJ electric properties and statistics such as on-chip and wafer spreads of critical current, $I_c$, normal-state conductance, $G_N$, and run-to-run reproducibility have been measured on 200-mm wafers over a broad range of JJ diameters from 200 nm to 1500 nm and critical current densities, $J_c$, from 10 kA/$cm^2$ to 50 kA/$cm^2$ where the JJs become self-shunted. Diffraction-limited photolithography of JJs is discussed. A relationship between JJ mask size, JJ size on wafer, and the minimum printable size for coherent and partially coherent illumination has been worked out. The $G_N$ and $I_c$ spreads obtained have been found to be mainly caused by variations of the JJ areas and agree with the model accounting for an enhancement of mask errors near the diffraction-limited minimum printable size of JJs. $I_c$ and $G_N$ spreads from 0.8% to 3% have been obtained for JJs with sizes from 1500 nm down to 500 nm. The spreads increase to about 8% for 200-nm JJs. Prospects for circuit densities > $10^6$ JJ/$cm^2$ and 193-nm photolithography for JJ definition are discussed., Comment: 13 pages, 16 figures, 62 references. Presented at Applied Superconductivity Conference, ASC 2014, Charlotte, NC, USA, August 10-15, 2014

This letter describes a new inorganic shadow mask that has been employed for the evaporation of all-epitaxial Al/Al2O3/Al superconducting tunnel junctions. Organic resists that are commonly used for shadow masks and other lift-off processes are not compatible with ultra-high vacuum deposition systems, and they can break down at even moderately elevated temperatures. The inorganic mask described herein does not suffer these same shortcomings. It was fabricated from a Ge/Nb bilayer, comprising suspended Nb bridges supported by an undercut Ge sacrificial layer. Utilizing such a bilayer mask on C-plane sapphire, the growth of epitaxial Al tunnel junctions was achieved using molecular beam epitaxy. Crystalline Al2O3 was grown diffusively at 300 C in a molecular oxygen background of 2.0 utorr, while amorphous oxide was grown at room temperature and 25 mtorr. A variety of analysis techniques were employed to evaluate the materials, and tunnel junction current-voltage characteristics were measured at millikelvin temperatures., Comment: 4 pages, 4 figures

Rectennas were studied with the intent of converting the Earth's (black body) radiation into dc power for satellites in earth orbit. Power densities; metal-oxide-metal diodes; antenna design configurations; fluid patterns; substrate mounted antennas; and directions for future work are outlined. This presentation is represented by viewgraphs only.

The key design issues of the Millimeter Wave/Infrared (MMW/IR) monolithic rectenna have been resolved. The work at Georgia Tech in the last year has focused on increasing the power received by the physically small MMW rectennas in order to increase the rectification efficiency. The solution to this problem is to place a focusing element on the back side of the substrate. The size of the focusing element can be adjusted to help maintain the optimum input power density not only for different power densities called for in various mission scenarios, but also for the nonuniform power density profile of a narrow EM-beam.