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2. Toward Low-Thermal-Budget Hafnia-Based Ferroelectrics via Atomic Layer Deposition

3. Robust low-temperature (350 °C) ferroelectric Hf0.5Zr0.5O2 fabricated using anhydrous H2O2 as the ALD oxidant

7. Low-thermal-budget (300 °C) ferroelectric TiN/Hf0.5Zr0.5O2/TiN capacitors realized using high-pressure annealing

9. Robust low-temperature (350 °C) ferroelectric Hf0.5Zr0.5O2 fabricated using anhydrous H2O2 as the ALD oxidant.

11. A Novel Combinatorial Approach to the Ferroelectric Properties in HfxZr1− xO 2 Deposited by Atomic Layer Deposition

13. Correlation between ferroelectricity and ferroelectric orthorhombic phase of HfxZr1−xO2 thin films using synchrotron x-ray analysis

14. Improvement in ferroelectricity and breakdown voltage of over 20-nm-thick HfxZr1−xO2/ZrO2 bilayer by atomic layer deposition

18. Low-thermal-budget (300 °C) ferroelectric TiN/Hf0.5Zr0.5O2/TiN capacitors realized using high-pressure annealing.

19. A Novel Combinatorial Approach to the Ferroelectric Properties in HfxZr1−xO2 Deposited by Atomic Layer Deposition.

21. Cross-Point Ferroelectric Hf 0.5 Zr 0.5 O 2 Capacitors for Remanent Polarization-Driven In-Memory Computing.

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