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The EXperiment for Cryogenic Large-Aperture Intensity Mapping (EXCLAIM) is a balloon-borne telescope designed to survey star formation over cosmological time scales using intensity mapping in the 420 - 540 GHz frequency range. EXCLAIM uses a fully cryogenic telescope coupled to six on-chip spectrometers featuring kinetic inductance detectors (KIDs) to achieve high sensitivity, allowing for fast integration in dark atmospheric windows. The telescope receiver is cooled to $\approx$ 1.7 K by immersion in a superfluid helium bath and enclosed in a superfluid-tight shell with a meta-material anti-reflection coated silicon window. In addition to the optics and the spectrometer package, the receiver contains the magnetic shielding, the cryogenic segment of the spectrometer readout, and the sub-Kelvin cooling system. A three-stage continuous adiabatic demagnetization refrigerator (CADR) keeps the detectors at 100 mK while a $^4$He sorption cooler provides a 900 mK thermal intercept for mechanical suspensions and coaxial cables. We present the design of the EXCLAIM receiver and report on the flight-like testing of major receiver components, including the superfluid-tight receiver window and the sub-Kelvin coolers., Comment: 13 pages, 7 figures, 1 table

The current state of far-infrared astronomy drives the need to develop compact, sensitive spectrometers for future space and ground-based instruments. Here we present details of the $\rm \mu$-Spec spectrometers currently in development for the far-infrared balloon mission EXCLAIM. The spectrometers are designed to cover the $\rm 555 - 714\ \mu$m range with a resolution of $\rm R\ =\ \lambda / \Delta\lambda\ =\ 512$ at the $\rm 638\ \mu$m band center. The spectrometer design incorporates a Rowland grating spectrometer implemented in a parallel plate waveguide on a low-loss single-crystal Si chip, employing Nb microstrip planar transmission lines and thin-film Al kinetic inductance detectors (KIDs). The EXCLAIM $\rm \mu$-Spec design is an advancement upon a successful $\rm R = 64\ \mu$-Spec prototype, and can be considered a sub-mm superconducting photonic integrated circuit (PIC) that combines spectral dispersion and detection. The design operates in a single $M{=}2$ grating order, allowing one spectrometer to cover the full EXCLAIM band without requiring a multi-order focal plane. The EXCLAIM instrument will fly six spectrometers, which are fabricated on a single 150 mm diameter Si wafer. Fabrication involves a flip-wafer-bonding process with patterning of the superconducting layers on both sides of the Si dielectric. The spectrometers are designed to operate at 100 mK, and will include 355 Al KID detectors targeting a goal of NEP ${\sim}8\times10^{-19}$ $\rm W/\sqrt{Hz}$. We summarize the design, fabrication, and ongoing development of these $\rm \mu$-Spec spectrometers for EXCLAIM., Comment: 9 pages, 5 figures, to appear in the Proceedings of the SPIE Astronomical Telescopes + Instrumentation (2022)

The EXperiment for Cryogenic Large-Aperture Intensity Mapping (EXCLAIM) is a balloon-borne far-infrared telescope that will survey star formation history over cosmological time scales to improve our understanding of why the star formation rate declined at redshift z < 2, despite continued clustering of dark matter. Specifically,EXCLAIM will map the emission of redshifted carbon monoxide and singly-ionized carbon lines in windows over a redshift range 0 < z < 3.5, following an innovative approach known as intensity mapping. Intensity mapping measures the statistics of brightness fluctuations of cumulative line emissions instead of detecting individual galaxies, thus enabling a blind, complete census of the emitting gas. To detect this emission unambiguously, EXCLAIM will cross-correlate with a spectroscopic galaxy catalog. The EXCLAIM mission uses a cryogenic design to cool the telescope optics to approximately 1.7 K. The telescope features a 90-cm primary mirror to probe spatial scales on the sky from the linear regime up to shot noise-dominated scales. The telescope optical elements couple to six {\mu}-Spec spectrometer modules, operating over a 420-540 GHz frequency band with a spectral resolution of 512 and featuring microwave kinetic inductance detectors. A Radio Frequency System-on-Chip (RFSoC) reads out the detectors in the baseline design. The cryogenic telescope and the sensitive detectors allow EXCLAIM to reach high sensitivity in spectral windows of low emission in the upper atmosphere. Here, an overview of the mission design and development status since the start of the EXCLAIM project in early 2019 is presented., Comment: SPIE Astronomical Telescopes + Instrumentation. arXiv admin note: substantial text overlap with arXiv:1912.07118

The EXperiment for Cryogenic Large-Aperture Intensity Mapping (EXCLAIM) is a cryogenic balloon-borne instrument that will map carbon monoxide and singly-ionized carbon emission lines across redshifts from 0 to 3.5, using an intensity mapping approach. EXCLAIM will broaden our understanding of these elemental and molecular gases and the role they play in star formation processes across cosmic time scales. The focal plane of EXCLAIM's cryogenic telescope features six {\mu}-Spec spectrometers. {\mu}-Spec is a compact, integrated grating-analog spectrometer, which uses meandered superconducting niobium microstrip transmission lines on a single-crystal silicon dielectric to synthesize the grating. It features superconducting aluminum microwave kinetic inductance detectors (MKIDs), also in a microstrip architecture. The spectrometers for EXCLAIM couple to the telescope optics via a hybrid planar antenna coupled to a silicon lenslet. The spectrometers operate from 420 to 540 GHz with a resolving power R={\lambda}/{\Delta}{\lambda}=512 and employ an array of 355 MKIDs on each spectrometer. The spectrometer design targets a noise equivalent power (NEP) of 2x10-18W/\sqrt{Hz} (defined at the input to the main lobe of the spectrometer lenslet beam, within a 9-degree half width), enabled by the cryogenic telescope environment, the sensitive MKID detectors, and the low dielectric loss of single-crystal silicon. We report on these spectrometers under development for EXCLAIM, providing an overview of the spectrometer and component designs, the spectrometer fabrication process, fabrication developments since previous prototype demonstrations, and the current status of their development for the EXCLAIM mission., Comment: SPIE Astronomical Telescope + Instrumentation

Despite recent increased attention to Asperger's Syndrome (AS), few psychometric investigations of subjects have appeared and few studies have examined how clinicians and educators might better address the needs of this unique group of people. A diagnosis of AS according to the "Diagnostic and Statistical Manual of Mental Disorders" requires impairment of social interaction, repetitive and stereotyped patterns of behavior, but no clinically significant delay in language or cognitive development. This case report examines in detail the assessment of an inner-city adolescent black male with this syndrome and relates his difficulties to probable compromise of the right frontal (nondominant) lobe. Vocational recommendations were made for this student based on the assessment of his abilities and the recognition of his social limitations. Issues pertaining to future research and educational and vocational planning are discussed. More is known about autism than AS, and this is particularly true among the lower socioeconomic classes. Although AS is related to high functioning autism (HFA), more research is recommended on the practical, clinical implications of diagnosis of AS over HFA. (Contains 1 table, 1 figure, and 44 references.) (Author/SLD)

The µ-Spec integrated spectrometer operating at ~500 GHz, employs thin film superconducting Nb microstrip transmission lines deposited directly on a thin (450 nm) single-crystal silicon dielectric. This single-crystal silicon layer is chosen as the dielectric layer due to its low intrinsic loss, with the goal of achieving both high- efficiency and precise phase control in a compact spectrometer architecture. To avoid roughening or etching through the thin single-crystal silicon dielectric a liftoff technique was developed for patterning these microstrip transmission lines and ground plane structures. This two- layer liftoff process was designed for use with sputter deposition and resulted in a US patent. Although this original technique provided precise control of linewidth, results of initial prototype spectrometer devices and separate diagnostic co-planer waveguide resonator devices showed that unexpected loss was being introduced due to the lift-off process. This extra loss was believed to be due to the “tails” (thin tapered regions) at the edge of the metal traces resulting from the sputtering process, as well as an amorphous oxide layer at the Nb-Si interface. We have since demonstrated an improved lift-off technique, which provides a clean metal-Si interface and removes the loss-inducing tails by a two-step selective etching method. This results in a decrease in microwave loss by more than an order of magnitude when measured in co-planar waveguide microwave resonator structures. We present these microwave test results and also SEM and TEM images of the microstrip interfaces and edge profiles before and after application of the improved process.

A number of new instrument capabilities are currently in maturation for future in situ use on planetary science missions. Moving beyond the impressive in situ instrumentation already operating in planetary environments beyond Earth will enable the next step in scientific discovery. The approach for developing beyond current instrumentation requires a careful assessment of science-driven capability advancement. To this end, two examples of instrument technology development efforts that are leading to new and important analytical capabilities for in situ planetary science will be discussed: (1) an instrument prototype enabling the interface between liquid separation techniques and laser desorption/ionization mass spectrometry and (2) an addressable excitation source enabling miniaturized electron probe microanalysis for elemental mapping of light and heavy elements.

The Athena-plus team requires X-ray sensors with energy resolution of better than one part in 3,000 at 6 keV X-rays. While bismuth is an excellent material for high X-ray stopping power and low heat capacity (for large signal when an X-ray is stopped by the absorber), oxidation of the bismuth surface can lead to electron traps and other effects that degrade the energy resolution. Bismuth oxide reduction and nitride passivation techniques analogous to those used in indium passivation are being applied in a new technique. The technique will enable improved energy resolution and resistance to aging in bismuth-absorber-coupled X-ray sensors. Elemental bismuth is lithographically integrated into X-ray detector circuits. It encounters several steps where the Bi oxidizes. The technology discussed here will remove oxide from the surface of the Bi and replace it with nitridized surface. Removal of the native oxide and passivating to prevent the growth of the oxide will improve detector performance and insulate the detector against future degradation from oxide growth. Placing the Bi coated sensor in a vacuum system, a reduction chemistry in a plasma (nitrogen/hydrogen (N2/H2) + argon) is used to remove the oxide and promote nitridization of the cleaned Bi surface. Once passivated, the Bi will perform as a better X-ray thermalizer since energy will not be trapped in the bismuth oxides on the surface. A simple additional step, which can be added at various stages of the current fabrication process, can then be applied to encapsulate the Bi film. After plasma passivation, the Bi can be capped with a non-diffusive layer of metal or dielectric. A non-superconducting layer is required such as tungsten or tungsten nitride (WNx).

A paper describes the Thermal Infrared Sensor (TIRS), a QWIP-based instrument intended to supplement the Operational Land Imager (OLI) for the Landsat Data Continuity Mission (LDCM). The TIRS instrument is a far-infrared imager operating in the pushbroom mode with two IR channels: 10.8 and 12 microns. The focal plane will contain three 640x512 QWIP arrays mounted on a silicon substrate. The silicon substrate is a custom-fabricated carrier board with a single layer of aluminum interconnects. The general fabrication process starts with a 4-in. (approx.10-cm) diameter silicon wafer. The wafer is oxidized, a single substrate contact is etched, and aluminum is deposited, patterned, and alloyed. This technology development is aimed at incorporating three large-format infrared detecting arrays based on GaAs QWIP technology onto a common focal plane with precision alignment of all three arrays. This focal plane must survive the rigors of flight qualification and operate at a temperature of 43 K (-230 C) for five years while orbiting the Earth. The challenges presented include ensuring thermal compatibility among all the components, designing and building a compact, somewhat modular system and ensuring alignment to very tight levels. The multi-array focal plane integrated onto a single silicon substrate is a new application of both QWIP array development and silicon wafer scale integration. The Invar-based assembly has been tested to ensure thermal reliability.

Graphene is a single atomic layer of graphite. It is optically transparent and has high electron mobility, and thus has great potential to make transparent conductive electrodes. This invention contributes towards the development of graphene transparent conductive electrodes for next-generation microshutter arrays. The original design for the electrodes of the next generation of microshutters uses indium-tin-oxide (ITO) as the electrode material. ITO is widely used in NASA flight missions. The optical transparency of ITO is limited, and the material is brittle. Also, ITO has been getting more expensive in recent years. The objective of the invention is to develop a graphene transparent conductive electrode that will replace ITO. An exfoliation procedure was developed to make graphene out of graphite crystals. In addition, large areas of single-layer graphene were produced using low-pressure chemical vapor deposition (LPCVD) with high optical transparency. A special graphene transport procedure was developed for transferring graphene from copper substrates to arbitrary substrates. The concept is to grow large-size graphene sheets using the LPCVD system through chemical reaction, transfer the graphene film to a substrate, dope graphene to reduce the sheet resistance, and pattern the film to the dimension of the electrodes in the microshutter array. Graphene transparent conductive electrodes are expected to have a transparency of 97.7%. This covers the electromagnetic spectrum from UV to IR. In comparison, ITO electrodes currently used in microshutter arrays have 85% transparency in mid-IR, and suffer from dramatic transparency drop at a wavelength of near-IR or shorter. Thus, graphene also has potential application as transparent conductive electrodes for Schottky photodiodes in the UV region.

We are developing the VAPoR (Volatile Analysis by Pyrolysis of Regolith) instrument towards studying soil composition, volatiles, and trapped noble gases in the polar regions of the Moon. VAPOR will ingest a soil sample and conduct analysis by pyrolysis and time-of-flight mass spectrometry (ToF-MS). Here, we describe miniaturization efforts within this development, including a carbon nanotube (CNT) field emission electron gun that is under consideration for use as the electron impact ionization source for the ToF-MS.

A complex MEMS microshutter array system has been developed at NASA Goddard Space Flight Center (GSFC) for use as a multi-object aperture array for a Near-Infrared Spectrometer (NIRSpec). The NIRSpec is one of the four major instruments carried by the James Webb Space Telescope (JWST), the next generation of space telescope after the Hubble Space Telescope retires. The microshutter arrays (MSAs) are designed for the selective transmission of light with high efficiency and high contrast. It is demonstrated in Figure 1 how a MSA is used as a multiple object selector in deep space. The MSAs empower the NIRSpec instrument simultaneously collect spectra from more than 100 targets therefore increases the instrument efficiency 100 times or more. The MSA assembly is one of three major innovations on JWST and the first major MEMS devices serving observation missions in space. The MSA system developed at NASA GSFC is assembled with four quadrant fully addressable 365x171 shutter arrays that are actuated magnetically, latched and addressed electrostatically. As shown in Figure 2, each MSA is fabricated out of a 4' silicon-on-insulator (SOI) wafer using MEMS bulk-micromachining technology. Individual shutters are close-packed silicon nitride membranes with a pixel size close to 100x200 pm (Figure 3). Shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. In order to prevent light leak, light shields are made on to the surrounding frame of each shutter to cover the gaps between the shutters and the Game (Figure 4). Micro-ribs and sub-micron bumps are tailored on hack walls and light shields, respectively, to prevent sticktion, shown in Figures 4 and 5. JWST instruments are required to operate at cryogenic temperatures as low as 35K, though they are to be subjected to various levels of ground tests at room temperature. The shutters should therefore maintain nearly flat in the entire temperature range between 35K and 300K. Through intensive numerical simulations and experimental studies, an optically opaque and electrically conductive metal-nitride thin film was selected as a coating material deposited on the shutters with the best thermal-expansion match to silicon nitride - the shutter blade thin film material. A shutter image shown in Figure 6 was taken at room temperature, presenting shutters slightly bowing down as expected. Shutters become flat when the temperature decreases to 35K. The MSAs are then bonded to silicon substrates that are fabricated out of 6" single-silicon wafers in the thickness of 2mm. The bonding is conducted using a novel single-sided indium flip-chip bonding technology. Indium bumps fabricated on a substrate are shown in Figure 7. There are 180,000 indium bumps for bonding a flight format MSA array to its substrate. Besides a MSA, each substrate houses five customer-designed ASIC (Application Specific Integrated Circuit) multiplexer/address chips for 2-dimensional addressing, twenty capacitors, two temperature sensors, numbers of resistors and all necessary interconnects, as shown in Figure 8. Complete MSA quadrant assemblies have been successfully manufactured and fully functionally tested. The assemblies have passed a series of critical reviews required by JWST in satisfying all the design specifications. The qualification tests cover programmable 2-D addressing, life tests, optical contrast tests, and environmental tests including radiation, vibration, and acoustic tests. A 2-D addressing pattern with 'ESA' letters programmed in a MSA is shown in Figure 9. The MSAs passed 1 million cycle life tests and achieved high optical contrast over 10,000. MSA teams are now making progress in final fabrication, testing and assembly (Figure 10). The delivery of flight-format MSA system is scheduled at the end of 2008 for being integrated to the focal plane of the NIRSpec detectors.

Two-dimensional MEMS microshutter arrays are being developed for use as a high contrast field selector for the Near Infrared Spectrograph (NIRSpec) on the James Webb Space Telescope (JWST). We present details of microshutter array fabrication and give results of work done to optimize the flatness of microshutter elements through film stress control for both room temperature and cryogenic (35K) operation.

MEMS microshutter arrays are being developed at NASA Goddard Space Flight Center for use as an aperture array for a Near-Infrared Spectrometer (NirSpec). The instruments will be carried on the James Webb Space Telescope (JWST), the next generation of space telescope after Hubble Space Telescope retires. The microshutter arrays are designed for the selective transmission of light with high efficiency and high contrast, Arrays are close-packed silicon nitride membranes with a pixel size of 100x200 microns. Individual shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. Light shields are made on to each shutter for light leak prevention so to enhance optical contrast, Shutters are actuated magnetically, latched and addressed electrostatically. The shutter arrays are fabricated using MEMS technologies.

We report on methods to minimize thermally-induced deformation in a MEMS-based reconfigurable aperture. The device is an enabling component of the Near-Infrared Spectrometer, a principle instrument on NASA's James Webb Space Telescope. The Microshutter Array consists of 384 x 175 individually addressable shutters which can be magnetically rotated 90 deg into the plane of the array and electrostatically latched open. Each shutter is a 100 x 200 micron rectangular membrane suspended by a small neck region and torsion flexure. The primary materials in the shutter are a 5000A Si3N4 layer for mechanical rigidity, 2000A Al for opacity and electrostatic latching, and 2800A CoFe for magnetic actuation. This multi-layer stack presents a challenge due to the operating temperatures required for the device: both room temperature (300K) and cryogenic temperature (35K). Thermal expansion of the materials causes the shutters to bow out of plane excessively, which can prevent actuation of the shutters, cause damage to portions of the array, and allow light leakage around closed shutters. Here we present our investigation of several methods to prevent microshutter bowing including deposition of additional materials on the shutters to create a symmetrical layer stack and replacing the current stack with low-coefficient of thermal expansion materials. Using shutter-size suspended cantilever beams as a rapid-development test bed, we have reduced out-of-plane bowing between 300K and 35K to 10% or better. We are currently applying these results to microshutter arrays to develop shutters that remain flat from room temperature to cryogenic temperature while retaining the required mechanical, optical, and magnetic properties.

Two-dimensional MEMS microshutter arrays are being developed at NASA Goddard Space Flight Center for use in the near-infrared region on the James Webb Space Telescope (JWST). The microshutter arrays are designed for the selective transmission of light with high efficiency and high contrast. The JWST environment requires cryogenic operation at 35K. Microshutter arrays are fabricated out of silicon-oxide-insulated (SOI) silicon wafers. Arrays are close-packed silicon nitride membranes with a pixel size of 100x200 p. Individual shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. The mechanical shutter arrays are fabricated using MEMS technologies. The processing includes a multi- layer metal deposition and patterning of shutter electrodes and magnetic pads, reactive ion etching (NE) of the front side to form shutters out of the nitride membrane, an anisotropic back-etch for wafer thinning, followed by a deep RIE (DRIE) back-etch down to the nitride shutter membrane to form W e s and relieve shutters from the silicon substrate. An additional metal deposition and patterning is used to form back electrodes. Shutters are actuated using a magnetic force and latched using an electrostatic force. . . . KEYWORDS: microshutter, MEMS, RIE, DRIE, micro-optics, near inbred, space telescope

Two-dimensional MEMS microshutter arrays are being developed at NASA Goddard Space Flight Center for use in the near-infrared region on the Next Generation Space Telescope (NGST). The microshutter arrays are designed for the selective transmission of light with high efficiency and high contrast. The NGST environment requires cryogenic operation at 45K. Microshutter arrays are fabricated out of silicon-oxide-insulated (SOI) silicon wafers. Arrays are close-packed silicon nitride membranes with a pixel size of 100x100 microns. Individual shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. The mechanical shutter arrays are fabricated using MEMS technologies. The processing includes a multi-layer metal deposition and patterning of shutter electrodes and magnetic pads, reactive ion etching (RE) of the front side to form shutters out of the nitride membrane, an anisotropic back-etch for wafer thinning, followed by a deep RIE (DRIE) back-etch down to the nitride shutter membrane to form frames and relieve shutters from the silicon substrate. An additional metal deposition and patterning is used to form back electrodes. Shutters are actuated using a magnetic force and latched using an electrostatic force.