1. Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2009)
- Author
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Bourouina, Tarik, Courtois, B., Ghodssi, R., Karam, J.M., Soma, A., Yang, H.Y., Electronique, Systèmes de communication et Microsystèmes (ESYCOM), Conservatoire National des Arts et Métiers [CNAM] (CNAM)-Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris, Circuits Multi-Projets (CMP), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Centre National de la Recherche Scientifique (CNRS), Dept. of Electrical and Computer Engineering, Memscap, MEMSCAP, Department of Mechanics, Politecnico di Torino = Polytechnic of Turin (Polito), Center of Nanoscience and Nanotechnology, National Chung Hsing University (NCHU), EDA Publishing Association, Conservatoire National des Arts et Métiers [CNAM] (CNAM), and HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris
- Subjects
Signal processing ,Failure analysis ,Physical measurements ,Technology CAD in general ,Dimensional measurements ,Characterization ,Structured design methodologies ,Assembly technologies ,Numerical simulation ,actuators ,Process integration between MEMS and electronics ,Test structures ,Interoperability of CAD/CAE tools ,Integrated CAD tools ,Failure mechanisms ,Devices and components (sensors ,micromolding) ,Languages for interchange data among designs and tools ,Packaging for harsh environments ,[SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics ,Materials ,Non destructive evaluation ,MOEMS packaging ,Mechanical simulation ,Thermal evaluation ,RF and microwave packaging ,Reliability ,Microlithography issues unique to MEMS/MOEMS ,Modeling and simulation of fabrication processes ,Yield estimation ,Manufacturing ,PACS 85.42 ,Fault simulation and test pattern generation ,Process monitoring ,Model order reduction ,Fault modeling ,Integrated processes (micromachining ,MEMS/MOEMS libraries and IP ,actuators) ,Multiphysics simulation - Abstract
ISBN: 978-2-35500-009-6; This Symposium is a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland and in 2006 and in 2007 in Stresa, Italy and in 2008 in Nice, France. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. We hope you enjoy the technical presentations of 2 conferences - CAD, Design and Test / Microfabrication, Integration and Packaging -, of 2 joint invited talks, and of a special session on 3D Integration of MEMS.
- Published
- 2009