451 results on '"Jalar, Azman"'
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2. Effect of Die Deflection during Au Wire Bonding Process on Bonding Quality in Overhang Semiconductor Package
3. Moisture Content and Early Corrosion Detection of Cu Wire Bonding in a Semiconductor Package
4. Undissolved gold in fine-pitch BGA solder joint under thermal cycling test
5. Titanium dioxide ion-sensitive extended gate field effect transistor (ISEGFET): selective detection of potassium ions in artificial blood serum
6. Superluminal Geometrodynamics of Braneworld Hyperdrive via Brane-Bulk Interaction
7. Thermal Management on the Solder Joints of Adjacent Ball Grid Array (BGA) Rework Components Using Laser Soldering
8. Effect of Thermomechanical Treatment on Microstructural and Localized Micromechanical Properties of Sn–0.7Cu Solder Alloy
9. Unleashing the potential of gallium oxide: A paradigm shift in optoelectronic applications for image sensing and neuromorphic computing applications
10. Early Corrosion Detection of Cu-Ag Wedge bonding in Semiconductor Package
11. Dynamic precipitation and dynamic recrystallization behaviors of Mg-Gd-Nd-Zr magnesium alloy during thermal compression deformation
12. Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach
13. Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging
14. Effect of Nd on microstructure and mechanical properties of Mg-7Gd-0.5Zr alloy
15. Effect of alloy particle size and stencil aperture shape on solder printing quality
16. Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
17. EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg3Cu0.5 solder
18. Magnesium-doped ZnO nanorod electrolyte–insulator–semiconductor (EIS) sensor for detecting calcium ions
19. Effect of Potting Encapsulation on Crack Formation and Propagation in Electronic Package
20. Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component
21. Calcium ion-selective electrode based on the facile synthesis of CuO over Cu wires
22. Bondability of ultrasonic Aluminum bonds on the molybdenum (de)selenide and molybdenum of back contact layer of copper indium gallium (de)selenide CIGS thin film photovoltaic solar panel
23. Linear growth behaviour of intermetallic compound layer in electronic interconnections
24. Study on Rare Earth Modified Co Based Composite Powder and its Effects on the Microstructure and Properties of Cemented Carbide
25. Effect of Deformation Temperature on the Dynamic Recrystallization Mechanism and Dynamic Precipitation Behavior of Mg-Gd-Nd-Zr Alloy
26. Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework
27. Effect of Sn Plating Thickness on Wettability, Solderability, and Electrical Connections of Electronic Lead Connectors for Surface Mount Technology Applications
28. Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition
29. Low-cost fabrication of a pH sensor based on writing directly over parchment-type paper with pencil
30. Superluminal geometrodynamics of braneworld hyperdrive via brane–bulk interaction.
31. Real-time viral detection through electrolyte-gated field effect transistors: possibility of rapid COVID-19 detection.
32. Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu
33. Effect of Ultrasonic Process Parameter on Resistance and Plastic Deformation of the Aluminum Ribbon Bond on Molybdenum Layer
34. Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component
35. Effect of Potting Encapsulation on Crack Formation and Propagation in Electronic Package
36. Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach
37. Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds
38. Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition
39. Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly
40. Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing.
41. Measurement of Aluminium Remnant Thickness on Copper Wire Bonding using 3D Laser Scanning Microscope
42. Adsorption isotherm and kinetic study of gas-solid system of formaldehyde on oil palm mesocarp bio-char: Pyrolysis effect
43. Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire
44. SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
45. Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
46. Real-time viral detection through electrolyte-gated field effect transistors: possibility of rapid COVID-19 detection
47. Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates
48. Dynamic Precipitation and Dynamic Recrystallization Behaviors of Mg-Gd-Nd-Zr Magnesium Alloy During Thermal Compression Deformation
49. Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry
50. Temperature Cycling Test on Ultrasonic Aluminum Bonds and Conductive Adhesive of Copper Indium Gallium (di)Selenide (CIGS) Thin-Film Photovoltaic Solar Panel
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