1. Dynamic annealing in ion implanted SiC: Flux versus temperature dependence.
- Author
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Kuznetsov, A.Yu., Wong-Lung, J., Hallén, A., Jagadish, C., and Svensson, B.G.
- Subjects
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ANNEALING of crystals , *SILICON , *NONMETALS , *IONS , *PHYSICS - Abstract
A strong influence of ion implantation flux on the accumulation of radiation damage, the so-called dose rate effect, is observed and systematically studied in SiC. 100 keV Si[sup +] ions were implanted into bulk 4H-SiC wafers using different ion fluxes (1.9×10[sup 10]–4.9×10[sup 13] ions/cm[sup 2] s) and keeping the implantation dose constant at 5×10[sup 14] Si[sup +]/cm[sup 2]. The implants were performed both at room and elevated temperatures, up to 220 °C. Rutherford backscattering spectrometry in the channelling mode using 2 MeV He[sup +] ions was employed to measure ion implantation damage profiles in the samples. For the flux interval used the most, pronounced dynamic annealing effect was detected at 80–160 °C, having an activation energy of 1.3 eV. For example, at 100 °C the amount of disordered Si atoms at the projected ion range is reduced by a factor of 4 by decreasing the ion flux from 4.9×10[sup 13] to 1.9×10[sup 10] ions/cm[sup 2] s. The results are discussed in terms of migration and annihilation of intrinsic type defects for both the Si- and C-sublattices. In addition, two regions for the damage accumulation – at the surface and at the damage peak for 100 keV Si[sup +] ions – are observed. © 2003 American Institute of Physics. [ABSTRACT FROM AUTHOR]
- Published
- 2003
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