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Abstract In the era of artificial intelligence (AI), materials with soft and strong properties are becoming increasingly important. Various three-dimensional (3D) fused deposition modeling (FDM) filaments have been developed as [...]

ABSTRACT Aim Design Methods Findings Conclusions Implications for the Profession Impact Report Methods Patient or Public Involvement and Engagement To investigate the adaptation process of Generation Z nurses at a tertiary hospital in Korea.This qualitative study using grounded theory.The participants were 17 Generation Z nurses who were working at tertiary hospitals in Korea. Data were collected through in‐depth interviews from September 2022 to July 2023.Eight categories and 19 concepts were extracted. The core category was ‘accepting deficient myself as a nurse in a vertical culture’, which consisted of three phases: chaos, endeavouring to adapt and accepting myself. In the adaptation process at the tertiary hospital, most of the participants felt embarrassed by tasks. The most of them tended to stay away from stressors and endeavour to improve their competence. The participants who had familiarity and a sense of belonging and achievement tended to acknowledge themselves.This study provides help in suggesting the importance of a horizontal organisational culture to Generation Z nurses. Also, the support of senior nurses is needed to encourage Generation Z nurses to accept deficient themselves.Generation Z nurses tended to feel confused by the vertical culture, uncertainty of work and daunting tasks; excessive criticism and rebuke seems to make Generation Z nurses feel a sense of shame. The family‐centred culture of nursing organisations could cause conflicts for Generation Z nurses who tend to separate their personal lives from work.Generation Z nurses had no difficulty acquiring knowledge because they had the skills to search for the necessary information, but they experienced difficulty applying this knowledge in practice and becoming familiar with their role as a nurse.We adhered to relevant EQUATOR guidelines of the Consolidated Criteria for Reporting Qualitative Research (COREQ).No patient or public involvement. [ABSTRACT FROM AUTHOR]

This article discusses the design and synthesis of heterocyclic core scaffolds for drug discovery research. The researchers were able to generate unique heterocyclic skeletons from a common derivative and discovered that an amino moiety could be added to the ring system through annulative reactions with quinones. The target compound possesses both carbonyl and amino groups, similar to biologically active quinones. The researchers optimized the reaction conditions and found that the use of Cu(OAc)2 as a catalyst provided the desired product in high yield. The synthesis of various compounds was also explored. These compounds were tested for their anticancer effects and showed good inhibitory activities against human hepatocellular cells and prostate adenocarcinoma cells. The study suggests that these compounds could be further developed as potential anticancer agents for the treatment of liver and prostate cancer. The given text provides data and information related to the synthesis and characterization of compounds 4a, 4b, 4c, 4d, and 4e. The compounds were synthesized using a general procedure involving the reaction of naphthoquinone with different reagents. The compounds were obtained in good yields and characterized using various techniques such as NMR and HRMS. The data presented in the text can be used by researchers studying the cytotoxic effects of these compounds on HepG2 and PC-3 cells. The document provides information on the synthesis and characterization of various compounds. The compounds are described in terms of their chemical structures [Extracted from the article]

A new flexible low‐temperature polycrystalline silicon thin film transistors (LTPS TFTs) backplane on PI substrate with organic dielectric layer and low‐stress structure of island TFT is proposed. This new extremely low stress backplane is able to withstand 20,000 inward bending cycles at a bending radius of 1mm without any noticeable TFT degradation. After 200,000 bending inward cycles at bending radius of 1 mm, the stability test results show that the change of on‐current is 10.07% for hot carrier instability (HCI) test, the change of threshold voltage ‐0.31V for negative bias thermal instability (NBTI) test, the change of threshold voltage ‐0.24V for hysteresis test, and the breakdown voltage of gate insulator 7.73MV/cm, respectively. The AMOLED display panel manufacured with organic ILD does not show any visible degradation of panel image just after 200K rolling at rolling radius of 4mm or 200K folding at folding radius of 1mm. [ABSTRACT FROM AUTHOR]

Oxide semiconductor-based thin-film transistors (TFTs) are promising candidates for display backplanes and memory device applications. To achieve high device performance and sustain the electrical properties under prolonged operation, it is important to overcome the mobility–stability trade-off in oxide TFTs. Here, we propose a bilayer-structured semiconductor stack formed by plasma-enhanced atomic layer deposition (PEALD), where an indium-free gallium zinc oxide (GZO) film is grown on top of indium gallium zinc oxide (IGZO), to be implemented in top gate devices. Applying a GZO layer (with optimum Ga to Zn ratio) between the IGZO and the gate insulator (GI) resulted in two major effects: interface engineering and band alignment modulation. While maintaining a sufficiently large field effect mobility (31.9 cm2 V−1 s−1), considerable improvements in device reliability were observed concerning positive-bias thermal stress (PBTS) and negative-bias illumination stress (NBIS) compared to TFTs incorporating IGZO single layers. This suggests that proper composition control through PEALD in the bilayer oxide semiconductor TFT may help achieve an appropriate balance between mobility and reliability. [ABSTRACT FROM AUTHOR]

A new flexible low‐temperature polycrystalline silicon thin film transistors (LTPS TFTs) on PI substrate with organic ILD layer, island TFT, and TFT channel perpendicular to stress direction was proposed. AMOLED display panel manufactured with organic ILD did not show any visible degradation of panel image after outward rolling cycles of 200,000 at rolling radius of 4 mm or inward folding cycles of 200,000 at folding radius of 1 mm. Another novel structure of TFT with channel perpendicular to stress direction significantly reduced change of threshold voltage of −0.03 V compared with change of threshold voltage of −0.6 V for TFT with channel parallel to stress direction for reliability test of high drain current (HDC) after 100,000 outward‐bending cycles at bending radius of 3 mm. After inward‐bending cycles of 200,000 at bending radius of 1 mm, reliability test results for TFT device with organic ILD layer showed that change of on‐current is 10.07% for hot carrier instability (HCI) test, change of threshold voltage −0.31 V for negative bias thermal instability (NBTI) test, change of threshold voltage −0.24 V for hysteresis test, and breakdown voltage of gate insulator 7.73 MV/cm, respectively, and these performances are similar to those of TFT device with inorganic ILD (SiNx). [ABSTRACT FROM AUTHOR]

Currently, metal is the most common exterior material used in robot development due to the need to protect the motor. However, as soft, wearable, and humanoid robots are gradually being developed, many robot parts need to be converted into artificial skin using flexible materials. In this study, in order to develop soft exterior parts for robots, we intended to manufacture exterior robot arm parts via fused filament fabrication (FFF) 3D printing according to various structural and thickness conditions and analyze their mechanical properties. The exterior parts of the robot arms were manufactured utilizing Shore 95 A TPU (eTPU, Esun, Shenzhen, China), which is renowned for its softness and exceptional shock absorption characteristics. The exterior robot arm parts were modeled in two parts, the forearm and upper arm, by applying solid (SL) and re-entrant (RE) structures and thicknesses of 1, 2, and 4 mm. The mechanical properties were analyzed through the use of three-point bending, tensile, and compression testing. All of the characterizations were analyzed using a universal testing machine (AGS-X, SHIMADZU, Kyoto, Japan). After testing the samples, it was confirmed that the RE structure was easily bendable towards the bending curve and required less stress. In terms of the tensile tests, the results were similar to the bending tests; to achieve the maximum point, less stress was required, and for the compression tests, the RE structure was able to withstand the load compared to the SL structure. Therefore, after analyzing all three thicknesses, it was confirmed that the RE structure with a 2 mm thickness had excellent characteristics in terms of bending, tensile, and compressive properties. Therefore, the re-entrant pattern with a 2 mm thickness is more suitable for manufacturing a 3D-printed humanoid robot arm. [ABSTRACT FROM AUTHOR]

In this study, to fabricate a soft conductive re-entrant (RE) strain sensor using a fused filament fabrication three-dimensional (3D) printer, carbon/thermoplastic polyurethane (TPU) filaments with three carbon materials—graphene (GR), carbon fiber (CF), and carbon black (CB)—were analyzed. The 3D printing performance of carbon/TPU was evaluated to confirm the applicability to 3D printing. Firstly, the results of the carbon/TPU filament, morphology, and X-ray diffraction analysis confirmed GR-TPU exhibited crystallinity, and the size of the CB particles was the smallest at <100 nm. For the thermal property, thermogravimetric analysis indicated that the carbon content of CB-TPU was the highest. In addition, differential scanning calorimetry showed that, depending on the carbon material content, the Tg of CB-TPU was the highest. However, since the particles were the smallest, they were easily dispersed and the Tm was the lowest. An analysis of the tensile properties indicated that GR-TPU was the weakest, CF-TPU was hard and brittle, and CB-TPU was the softest and toughest. The conductivity of CB-TPU was 36.12 mA, so it was 25 times higher than the other filaments. The results of the 3D printed RE pattern using various types of carbon/TPU and CB-TPU exhibited the best output performance. The results of the tensile property of the 3D printed RE pattern were similar to those of the filaments. In addition, the conductivities of the 3D printed RE patterns were improved more than the filament status, as ordered during 3D printing. Therefore, 3D printed carbon/TPU can be used as a basis for manufacturing soft sensors. [ABSTRACT FROM AUTHOR]