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Journal of synchrotron radiation 28(1), 131 - 145 (2021). doi:10.1107/S1600577520013958, In this paper the back-side-illuminated Percival 2-Megapixel (P2M) detector is presented, along with its characterization by means of optical and X-ray photons. For the first time, the response of the system to soft X-rays (250 eV to 1 keV) is presented. The main performance parameters of the first detector are measured, assessing the capabilities in terms of noise, dynamic range and single-photon discrimination capability. Present limitations and coming improvements are discussed., Published by Wiley-Blackwell, [S.l.]

One of the major limitations of X-ray Absorption Spectroscopy (XAS) experiment at synchrotron facilities is the performance of the detectors. In order to be able to measure more challenging samples and to cope with the very high photon flux of the current and future (diffraction limited) sources, technological developments of detectors are necessary. This article reports on the construction and characterization of a monolithic 19-channel germanium detector demonstrator fitted with CMOS preamplifiers. The detector was characterized in the laboratory with radioactive sources and with the X-ray synchrotron beam. Characteristics such as energy resolution, linearity, counting rate capabilities, and stability of the detector were thoroughly evaluated. In addition, it was proved that by using an advanced pulse processor such as Xspress4, it was possible to improve the performance of the detector system by eliminating the crosstalk among channels and by suppressing the charge-shared events. This work could pave the way to enhanced germanium fluorescence detectors for high-throughput X-ray spectroscopy.

Radiation measurements 140, 106459 (2021). doi:10.1016/j.radmeas.2020.106459, At synchrotron facilities, many X-ray imaging and diffraction experiments require pixel detectors with minimal noise, high speed and reasonably small pixel size, all of which can be achieved with the Medipix ASIC family. So, ESRF, Diamond Light Source and DESY have developed detector systems based on Medipix. In this paper, we report on these developments, with an emphasis on the challenges involved building readout systems and the potential of the Medipix family ASICs in this field of research., Published by Elsevier Science, Amsterdam [u.a.]

We performed simulations and experimental tests of a new method for improving the spatial resolution of x-ray imaging detectors using tilted angle irradiation. In this method, the x-ray beam arrives at the detector surface at an angle of

The Timepix3 ASIC can be used very effectively for time resolved experiments at synchrotron facilities. We have carried out characterizations with the synchrotron beam in order to determine the time resolution and other characteristics such as the energy resolution, charge sharing and signals overlapping. The best time resolution achieved is 19 ns FWHM for 12 keV photons and 350 V bias voltage. The time resolution shows dependency on the photon energy as well as on the chip and acquisition parameters.

X-ray computed micro-tomography (μCT) is one of the most advanced and common non-destructive techniques in the field of medical imaging and material science. It allows recreating virtual models (3D models), without destroying the original objects, by measuring three-dimensional X-ray attenuation coefficient maps of samples on the (sub) micrometer scale. The quality of the images obtained using μCT is strongly dependent on the performance of the associated X-ray detector i.e. to the acquisition of information of the X-ray beam traversing the patient/sample being precise and accurate. Detectors for μCT have to meet the requirements of the specific tomography procedure in which they are going to be used. In general, the key parameters are high spatial resolution, high dynamic range, uniformity of response, high contrast sensitivity, fast acquisition readout and support of high frame rates. At present the detection devices in commercial μCT scanners are dominated by charge-coupled devices (CCD), photodiode arrays, CMOS acquisition circuits and more recently by hybrid pixel detectors. Monolithic CMOS imaging sensors, which offer reduced pixel sizes and low electronic noise, are certainly excellent candidates for μCT and may be used for the development of novel high-resolution imaging applications. The uses of monolithic CMOS based detectors such as the PERCIVAL detector are being recently explored for synchrotron and FEL applications. PERCIVAL was developed to operate in synchrotron and FEL facilities in the soft X-ray regime from 250 eV to 1 keV and it could offer all the aforementioned technical requirements needed in μCT experiments. In order to adapt the system for a typical tomography application, a scintillator is required, to convert incoming X-ray radiation (∼ tens of KeV) into visible light which may be detected with high efficiency. Such a taper-based scintillator was developed and mounted in front of the sensitive area of the PERCIVAL imager. In this presentation we will report the setup of the detector system and preliminary results of first μCTs of reference objects, which were performed in the TomoLab at ELETTRA.

In this paper, we are presenting the results of the first test of the Percival P2M-FSI detector with tender x-rays photons at a synchrotron beamline. Percival is a monolithic CMOS Imager for detection of x-rays in Synchrotron Rings and Free Electron Lasers: the Front-Side-Illuminated (FSI) version of the detector has been proven able to successfully distinguish tender (2keV) x-ray single photons.

Monte Carlo (MC) simulation study of the dependence of paralyzable dead time value on the bunch filling pattern of the beam at Diamond Light Source (DLS) synchrotron and its validation using experimental data is reported. There are two major beam structures in DLS namely, Standard mode and Hybrid mode. A difference in experimental values of dead time for 64-pixel germanium detector for standard mode and hybrid mode was found which triggered this study. For each ICR, the simulation outputs the corresponding Output Count Rate (OCR) and time stamp of the output photon. Pile-up correction has been implemented in the code to reject the pile-up photons. MC simulations are within 4.5% error from the experimental data depending on the beam structure. The simulation has been validated with 36-pixel germanium detector data collected with the beam and portable X-ray set as also with 64-pixel germanium and Silicon Drift Detector (SDD) data collected with beam.

High brilliance synchrotrons and FELs require high performing detector systems to realise their full potential. High dynamic range, low noise and high frame rate are all of great importance. In this paper we present first optical characterization results of the P2M CMOS sensor, designed for soft X-ray detection at such facilities. Previous work is summarised and an overview of the sensor is presented. Test results for the sensor’s column-parallel ADC and readout chain are presented, and first test results for the pixel acquired using the Photon Transfer Curve (PTC) method are shown. Finally, an outline of future work is provided.

This work presents the design and development of a CdTe sensor, Medipix3RXv2 readout ASICs photocounting detector of 55 pm pixel size arranged in an arc modular distribution for its use in X-ray Pair Distribution Function (PDF) applications at the Diamond Light Source (DLS) synchrotron. This contribution highlights the concept and technical solutions adopted for this new detector which include the development of a fibre optic link between the detector head and the readout FPGA cards. This solution enables a considerable reduction in the weight and size of the detector head.

This paper focuses on the evaluation of operational conditions such as temperature, exposure time and flux on the polarization of a Schottky electron collection CdTe detector. A Schottky ${\rm e}^ - $ collection CdTe Medipix3RX hybrid pixel detector was developed as a part of the CALIPSO-HIZPAD2 EU project. The $128 \times 128$ pixel matrix and 0.75 mm thick CdTe sensor bump-bonded to Medipix3RX readout chips enabled the study of the polarization effects. Single and quad module Medipix3RX chips were used which had $128 \times 128$ and $256 \times 256$ pixel matrices, respectively. This study reports the sensor-level and pixel-level polarization effects of the detector obtained from a laboratory X-ray source. We report that the sensor-level polarization is highly dependent on temperature, flux and exposure time. Furthermore, the study of pixel-level polarization effects led to identification of a new type of pixel behaviour that is characterised by three distinct phases and, thus, named “tri-phase” (3-P) pixels. The 3-P pixels were the dominant cause of degradation of the flat-field image uniformity under high flux operation. A new method of identifying the optimum operational conditions that utilises a criterion related to the 3-P pixels is proposed. A generated optimum operational conditions chart under the new method is reported. The criterion is used for bias voltage reset depolarization of the detector. The method successfully represented the dependency of polarization on temperature, flux and exposure time and was reproducible for multiple sensors. Operating the detector under the 3-P pixel criterion resulted in the total efficiency not falling below 95%.

2019 26th IEEE International Conference on Electronics, Circuits and Systems (ICECS), Genoa, Italy, 27 Nov 2019 - 29 Nov 2019; ... IEEE International Symposium on Circuits and Systems proceedings 51, 50 (2019). doi:10.1109/ICECS46596.2019.8964996, High brilliance synchrotrons and Free Electron Lasers (FELs) require high performing detector systems to realise their full potential. High dynamic range, low noise and high frame rate are all of great importance. In this paper we describe the P2M CMOS sensor, designed for soft X-ray detection at such facilities. We refer to previous work on test devices demonstrating a noise of 5Me- and quantum efficiency of >80% at 400eV (and with good sensitivity even below this value). Initial test results on the first Front Side Illuminated (FSI) 2 Megapixel device are also presented, and an outline of future work is described., Published by Inst. of Electr. and Electronics Engineers, New York, N.Y.

In this paper, we are presenting the Percival detector, a monolithic CMOS Imager for detection of soft x-rays in Synchrotron Rings and Free Electron Lasers. The imager consists in a 2D array of many (2M) small (27um pitch) pixels, without dead or blind zones in the imaging area. The imager achieves low noise and high dynamic range by means of an adaptive-gain in-pixel circuitry, that has been validated on prototypes. The imager features on-chip Analogue-to-Digital conversion to 12+1 bits, and has a readout speed which is compatible with most of Free Electron Laser Facilities. For direct detection of low-energy x-rays, the imager is back-illuminated and post-processed to achieve 100% fill factor.

Diamond Light Source (DLS) I20-Scanning is a high flux X-ray Absorption Spectroscopy (XAS) beamline optimized for challenging samples, operating between 4keV and 20keV. The principal detector used for collecting XAS in fluorescence mode is a Canberra 64-pixel Monolithic Segmented Hyper Pure Germanium Detector (HPGe) historically partnered with the STFC Xspress2 Digital Pulse Processor (DPP). Prior signal analysis had shown that key parameters such as Energy Resolution and Peak-to-Background ratio are compromised by pixel-to-pixel crosstalk within the detector, especially at higher count rates (>250kcps per pixel). The DLS Detector Group have developed the new Xspress4 DPP to address such issues. This results in typically a factor 3-7 increase in detector system count rate for the same Energy Resolution and Peak-to-Background ratio compared to the previous state-of-the-art DPP. An overview of the complete detector system is given and recent results obtained during the commissioning on the beamline are shown. Further, comparative results from challenging experiments are also shown, demonstrating the improved performance attainable at the previous high count rate by partnering legacy HPGe Detectors with the latest DPP technology.

A new avalanche silicon detector concept is introduced with a low gain in the region of 5 to 10, known as a Low Gain Avalanche Detector, LGAD. The lower gain reduces noise in comparison with a standard avalanche photodiode. The LGAD can be segmented to produce hybrid pixel detectors for low energy X-ray detection. Thin LGAD′s produce the same, or larger, signals as standard PIN diode detectors produced by minimum ionising particles (mips), however the collection time is reduced. The thickness reduction factor of an LGAD sensor is equal to the gain of the LGAD. For example; a 30µm thick sensor with a gain of 10 will give the same signal from a mip as a 300µm thick PIN diode. The LGAD has a fast rise time, useful for fast silicon timing detectors with sub-ns rise times from X-ray or mip interactions. Simulation of LGADs, using Sentaurus TCAD, of a pixelated device has been performed to determine the implant structures for the required gain and high voltage characteristics and to understand the in-pixel gain uniformity for a range of pixel sizes. Devices have been fabricated at Micron Semiconductor which produce the desired gain (measured to be approximately 10) and electrical performance with a breakdown voltage > 400V. LGAD sensors compatible with the Timepix readout system with varying pixel sizes have been fabricated. X-ray measurements have been performed on 5mm pads with a minimum detetable energy of 17.5 keV. Along with the detection of low energy photons these devices have been shown to produce a very fast response. Devices with this technology will be used in both the ATLAS and CMS timing detectors using pixels of the order 1mm x 1mm. Pixels have been fabricated in 2x2, 3x3 and 5x5 arrays. The measurements of gain and gain uniformity are presented.

The PERCIVAL collaboration to develop a soft X-ray imager able to address the challenges of high brilliance light sources, such as new-generation synchrotrons and Free Electron Lasers, has reached one of its major milestones: a full 2-MegaPixel (P2M) system (uninterrupted 4 × 4 cm2 active area) has already seen its first light.Smaller prototypes of the device, a monolithic active pixel sensor based on CMOS technology, have already been fully characterised, and have demonstrated high frame rate, large dynamic range, and relatively high quantum efficiency.The PERCIVAL modular layout allows for clover-leaf like arrangement of up to four P2M systems. Moreover, it will be post-processed in order to achieve a high quantum efficiency in its primary energy range (250 eV to 1 keV).We will present the P2M system, its status and newest results, bring these in context with achieved prototype performance, and outline future steps.

The Medipix3RX is the latest version of the Medipix3 photon counting ASICs, which implements two new operational modes, with respect to the Medipix2 ASIC, aimed at eliminating charge shared events (referred to as Charge Summing Mode (CSM)) and at providing spectroscopic information (referred to as Colour Mode (CM)). The Medipix3RX is a redesign of the Medipix3v0 ASIC and corrects for the underperformance of CSM features observed in the previous version. This paper presents the results from synchrotron X-rays tests to evaluate the Medipix3RX ASIC performance. The newly implemented CSM algorithm eliminates the charge sharing effect at the same time as allocating the event to the readout pixel corresponding to the sensor pixel where the X-ray photon impinged. The new pixel trimming circuit led to a reduced dispersion between pixels. Further results of the linearity for all the gain modes, energy resolution and pixel uniformity are also presented.

Multi-element germanium detectors for X-ray fluorescence are widely used in synchrotron experiments and in particular in XAFS experiments. This paper presents the construction and characterization of a demonstrator built to investigate the viability of multi-element monolithic germanium detectors equipped with CMOS front-end electronics. Semikon Detector GmbH fabricated a germanium sensor segmented with a pad pattern with pad size $1\times 1~\hbox{mm}^2$ . 16 channels were instrumented with the CUBE preamplifiers developed at XGLab Srl. The detector was tested with radioactive sources and with the synchrotron X-ray beam of Diamond. The results showed spectra with energy resolution satisfactory for XAFS experiments but with a considerable tail. The low energy tail was proved to be due to charge sharing. In addition the spectra showed the peak stability as a function of counting rate better than 1% for rate up to 838 kcps. The non-linearity of the peak position vs. energy was estimated to be a maximum of 0.13% No evidence of charge loss in the crystal was identified. This work proved that this technology is a viable option to improve the throughput of germanium fluorescence detectors as long as methods to reduce events leading to charge sharing are in place.

A multichip CdTe-Medipix3RX detector system was developed in order to bring the advantages of photon-counting detectors to applications in the hard X-ray range of energies. The detector head consisted of 2×2 Medipix3RX ASICs bump-bonded to a 28 mm×28 mm e − collection Schottky contact CdTe sensor. Schottky CdTe sensors undergo performance degrading polarization which increases with temperature, flux and the longer the HV is applied. Keeping the temperature stable and periodically refreshing the high voltage bias supply was used to minimize the polarization and achieve a stable and reproducible detector response. This leads to good quality images and successful results on the energy resolving capabilities of the system.

The Lancelot beam position and profile monitor records the scattered radiation off a thin, low-density foil, which passes through a pinhole perpendicular to the path of the beam and is detected by a Medipix3RX sensor. This arrangement does not expose the detector to the direct beam at synchrotrons and results in a negligible drop in flux downstream of the module. It allows for magnified images of the beam to be acquired in real time with high signal-to-noise ratios, enabling measurements of tiny displacements in the position of the centroid of approximately 1 μm. It also provides a means for independently measuring the photon energy of the incident monoenergetic photon beam. A constant frame rate of up to 245 Hz is achieved. The results of measurements with two Lancelot detectors installed in different environments at the Diamond Light Source are presented and their performance is discussed.

In this paper the design and implementation of a novel portable X-ray imager system is presented. The design features a direct X-ray detection scheme by making use of a hybrid detector (Medipix3RX). Taking advantages of the capabilities of the Medipix3RX, like a high resolution, zero dead-time, single photon detection and charge-sharing mode, the imager has a better resolution and higher sensitivity compared to using traditional indirect detection schemes. A detailed description of the system is presented, which consists of a vacuum chamber containing the sensor, an electronic board for temperature management, conditioning and readout of the sensor and a data processing unit which also handles network connection and allow communication with clients by acting as a server. A field programmable gate array (FPGA) device is used to implement the readout protocol for the Medipix3RX, apart from the readout the FPGA can perform complex image processing functions such as feature extraction, histogram, profiling and image compression at high speeds. The temperature of the sensor is monitored and controlled through a PID algorithm making use of a Peltier cooler, improving the energy resolution and response stability of the sensor. Without implementing data compression techniques, the system is capable of transferring 680 profiles/s or 240 images/s in a continuous mode. Implementation of equalization procedures and tests on colour mode are presented in this paper. For the experimental measurements the Medipix3RX sensor was used with a Silicon layer. One of the tested applications of the system is as an X-ray beam position monitor (XBPM) device for synchrotron applications. The XBPM allows a non-destructive real time measurement of the beam position, size and intensity. A Kapton foil is placed in the beam path scattering radiation towards a pinhole camera setup that allows the sensor to obtain an image of the beam. By using profiles of the synchrotron X-ray beam, high frequency movement of the beam position can be studied, up to 340 Hz. The system is capable of realizing an independent energy measure of the beam by using the Medipix3RX variable energy threshold feature.

We report on the production of an array of active edge silicon sensors as a prototype of a large array. Four Medipix3RX.1 chips were bump bonded to four single chip sized Advacam active edge n-on-n sensors. These detectors were then mounted into a 2 by 2 array and tested on B16 at Diamond Light Source with an x-ray beam spot of 2um. The results from these tests, compared with optical metrology give confidence that these sensors are sensitive to the physical edge of the sensor, with only a modest loss of efficiency in the final two rows of pixels. We present the efficiency maps recorded with the microfocus beam and a sample powder diffraction measurement. These results give confidence that this sensor technology can be used in much larger arrays of detectors at synchrotron light sources., 11 pages, 12 figures

A three million pixel photon counting large area detector has been commissioned for the coherent diffraction imaging beamline (I13) of Diamond Light Source. Challenging requirements of small pixel size, large area and fast frame rates required the construction of a detector based upon a tiling of a large number of the latest generation of the Medipix family of photon counting ASICs, Medipix3RX and a highly parallel readout system based upon the Front End Module cards developed by STFC. Such a detector provides a significant improvement in field of view whilst maintaining the resolution afforded by the small pixel size, when compared to previously available Medipix-based detectors such as the quad-chip Merlin. A number of commissioning experiments have been performed on the beamline, and this Conference Record provides intial results from these measurements and determines the capabilities of the detector and beamline system.

Multi-element germanium detectors for X-ray fluorescence are widely used in synchrotrons. A demonstrator of highly segmented germanium detector fitted with cube preamplifier [1] for X-ray spectroscopy has been reported in this paper after a first demonstrator gave encouraging results a few years ago [2]. This demonstrator has nineteen hexagonal pixels of 2 mm pitch fitted with cube preamplifier. All the nineteen channels of this demonstrator were tested and found to be working with analogue chain electronics. Eight central channels of this demonstrator were calibrated using digital pulse processor, namely Xspress3 [3] and were exposed to beam. The beam size used was 20 µm × 20 µm so that the beam can be focused at the center of pixels and a raster scan amongst pixels can be done.

Recent advances in the growth of CdZnTe material have allowed the development of small pixel, spectroscopic, X-ray imaging detectors. These detectors have applications in a diverse range of fields such as medical, security and industrial sectors. As the size of the pixels decreases relative to the detector thickness, the probability that charge is shared between multiple pixels increases due to the non zero width of the charge clouds drifting through the detector. These charge sharing events will result in a degradation of the spectroscopic performance of detectors and must be considered when analyzing the detector response. In this paper charge sharing and charge loss in a 250 $\mu$ m pitch CdZnTe pixel detector has been investigated using a mono-chromatic X-ray beam at the Diamond Light Source, U.K. Using a 20 $\mu$ m beam diameter the detector response has been mapped for X-ray energies both above (40 keV) and below (26 keV) the material $K$ -shell absorption energies to study charge sharing and the role of fluorescence X-rays in these events.

The peak brilliance reached by today's Free-Electron Laser and Synchrotron light sources requires photon detectors matching their output intensity and other characteristics in order to fully realiz ...

Three-dimensional (3D) photodiode detectors offer advantages over standard planar photodiodes in a range of applications, including X-ray detection for synchrotrons and medical imaging. The principal advantage of these sensors for X-ray imaging is their low charge sharing between adjacent pixels, which could improve spatial and spectral resolution. A 'double-sided' 3D detector has been bonded to a Medipix2 single-photon-counting readout chip, and tested in a monochromatic X-ray beam at the Diamond synchrotron. Tests of the 3D detector's response spectrum and its Line Spread Function have shown that it has substantially lower charge sharing than a standard planar Medipix2 sensor. Additionally, the 3D detector was used to image diffraction rings produced by a powdered silicon sample, demonstrating the detector's use in a standard synchrotron experiment.

A wide range of position-sensitive X-ray detectors have been commissioned on the synchrotron X-ray beamlines operating at the Diamond Light Source in UK. In addition to mature technologies such as image-plates, CCD-based detectors, multi-wire and micro-strip gas detectors, more recent detectors based on semiconductor pixel or strip sensors coupled to CMOS read-out chips are also in use for routine synchrotron X-ray diffraction and scattering experiments. The performance of several commercial and developmental pixel/strip detectors for synchrotron studies are discussed with emphasis on the image quality achieved with these devices. Examples of pixel or strip detector applications at Diamond Light Source as well as the status of the commissioning of these detectors on the beamlines are presented. Finally, priorities and ideas for future developments are discussed.

3D detectors are photodiode detectors with n- and p-type electrode columns passing through a silicon substrate. This structure gives a much smaller spacing between the electrodes than in a standard photodiode, greatly reducing the detector's operating voltage and collection time. The device structure also reduces charge sharing between adjacent pixels. This improves the image quality, making these detectors potentially useful for applications such as X-ray diffraction experiments in synchrotrons. A set of silicon detectors with a simplified “double-sided” 3D structure have been fabricated. After being bump-bonded to Medipix2 single-photon-counting readout chips, they have been tested using X-rays and alpha particles. The test results show that the 3D detectors have substantially lower charge sharing than a planar detector of the same thickness.

Future high-luminosity colliders, such as the Super-LHC at CERN, will require pixel detectors capable of withstanding extremely high radiation damage. In this article, the performances of various 3D detector structures are simulated with up to 1 × 10 16 1 MeV- n eq / cm 2 radiation damage. The simulations show that 3D detectors have higher collection efficiency and lower depletion voltages than planar detectors due to their small electrode spacing. When designing a 3D detector with a large pixel size, such as an ATLAS sensor, different electrode column layouts are possible. Using a small number of n + readout electrodes per pixel leads to higher depletion voltages and lower collection efficiency, due to the larger electrode spacing. Conversely, using more electrodes increases both the insensitive volume occupied by the electrode columns and the capacitive noise. Overall, the best performance after 1 × 10 16 1 MeV- n eq / cm 2 damage is achieved by using 4–6 n + electrodes per pixel.

iWoRiD 2015, Hamburg, Germany, 28 Jun 2015 - 2 Jul 2015; Journal of Instrumentation 11(02), C02090 (2016). doi:10.1088/1748-0221/11/02/C02090, PERCIVAL ("Pixelated Energy Resolving CMOS Imager, Versatile And Large") is a monolithic active pixel sensor (MAPS) based on CMOS technology. Is being developed by DESY, RAL/STFC, Elettra, DLS, and PAL to address the various requirements of detectors at synchrotron radiation sources and Free Electron Lasers (FELs) in the soft X-ray regime. These requirements include high frame rates and FELs base-rate compatibility, large dynamic range, single-photon counting capability with low probability of false positives, high quantum efficiency (QE), and (multi-)megapixel arrangements with good spatial resolution. Small-scale back-side-illuminated (BSI) prototype systems are undergoing detailed testing with X-rays and optical photons, in preparation of submission of a larger sensor. A first BSI processed prototype was tested in 2014 and a preliminary result—first detection of 350eV photons with some pixel types of PERCIVAL—reported at this meeting a year ago. Subsequent more detailed analysis revealed a very low QE and pointed to contamination as a possible cause. In the past year, BSI-processed chips on two more wafers were tested and their response to soft X-ray evaluated. We report here the improved charge collection efficiency (CCE) of different PERCIVAL pixel types for 400eV soft X-rays together with Airy patterns, response to a flat field, and noise performance for such a newly BSI-processed prototype sensor., Published by Inst. of Physics, London

The PERCIVAL (Pixelated Energy Resolving CMOS Imager, Versatile And Large) soft X-ray 2D imaging detector is based on stitched, wafer-scale sensors possessing a thick epi-layer, which together with back-thinning and back-side illumination yields elevated quantum efficiency in the photon energy range of 125–1000 eV. Main application fields of PERCIVAL are foreseen in photon science with FELs and synchrotron radiation. This requires high dynamic range up to 105 ph @ 250 eV paired with single photon sensitivity with high confidence at moderate frame rates in the range of 10–120 Hz. These figures imply the availability of dynamic gain switching on a pixel-by-pixel basis and a highly parallel, low noise analog and digital readout, which has been realized in the PERCIVAL sensor layout. Different aspects of the detector performance have been assessed using prototype sensors with different pixel and ADC types. This work will report on the recent test results performed on the newest chip prototypes with the improved pixel and ADC architecture. For the target frame rates in the 10–120 Hz range an average noise floor of 14e− has been determined, indicating the ability of detecting single photons with energies above 250 eV. Owing to the successfully implemented adaptive 3-stage multiple-gain switching, the integrated charge level exceeds 4 10^6 e− or 57000 X-ray photons at 250 eV per frame at 120 Hz. For all gains the noise level remains below the Poisson limit also in high-flux conditions. Additionally, a short overview over the updates on an oncoming 2 Mpixel (P2M) detector system (expected at the end of 2016) will be reported.

The design and performance characterization of a new light-weight and compact X-ray scintillation detector is presented. The detectors are intended for use on the new I11 powder diffraction beamline at the third-generation Diamond synchrotron facility where X-ray beams of high photon brightness are generated by insertion devices. The performance characteristics of these detection units were measured first using a radioactive source (efficiency of detection and background count rate) and then synchrotron X-rays (peak stability, light yield linearity and response consistency). Here, the results obtained from these tests are reported, and the suitability of the design for the Diamond powder beamline is demonstrated by presenting diffraction data obtained from a silicon powder standard using a prototype multicrystal analyser stage.

Considerable interest has been manifested for the use of high-brilliance X-ray synchrotron sources and X-ray Free-Electron Lasers for the investigation of samples.

With the increased brilliance of state-of-the-art synchrotron radiation sources and the advent of free-electron lasers (FELs) enabling revolutionary science with EUV to X-ray photons comes an urgent need for suitable photon imaging detectors. Requirements include high frame rates, very large dynamic range, single-photon sensitivity with low probability of false positives and (multi)-megapixels. At DESY, one ongoing development project – in collaboration with RAL/STFC, Elettra Sincrotrone Trieste, Diamond, and Pohang Accelerator Laboratory – is the CMOS-based soft X-ray imager PERCIVAL. PERCIVAL is a monolithic active-pixel sensor back-thinned to access its primary energy range of 250 eV to 1 keV with target efficiencies above 90%. According to preliminary specifications, the roughly 10 cm × 10 cm, 3.5k × 3.7k monolithic sensor will operate at frame rates up to 120 Hz (commensurate with most FELs) and use multiple gains within 27 µm pixels to measure 1 to ∼100000 (500 eV) simultaneously arriving photons. DESY is also leading the development of the AGIPD, a high-speed detector based on hybrid pixel technology intended for use at the European XFEL. This system is being developed in collaboration with PSI, University of Hamburg, and University of Bonn. The AGIPD allows single-pulse imaging at 4.5 MHz frame rate into a 352-frame buffer, with a dynamic range allowing single-photon detection and detection of more than 10000 photons at 12.4 keV in the same image. Modules of 65k pixels each are configured to make up (multi)megapixel cameras. This review describes the AGIPD and the PERCIVAL concepts and systems, including some recent results and a summary of their current status. It also gives a short overview over other FEL-relevant developments where the Photon Science Detector Group at DESY is involved.

Silicon sensor technologies with reduced dead area at the sensor's perimeter are under development at a number of institutes. Several fabrication methods for sensors which are sensitive close to the physical edge of the device are under investigation utilising techniques such as active-edges, passivated edges and current-terminating rings. Such technologies offer the goal of a seamlessly tiled detection surface with minimum dead space between the individual modules. In order to quantify the performance of different geometries and different bulk and implant types, characterisation of several sensors fabricated using active-edge technology were performed at the B16 beam line of the Diamond Light Source. The sensors were fabricated by VTT and bump-bonded to Timepix ROICs. They were 100 and 200 μ m thick sensors, with the last pixel-to-edge distance of either 50 or 100 μ m. The sensors were fabricated as either n-on-n or n-on-p type devices. Using 15 keV monochromatic X-rays with a beam spot of 2.5 μ m, the performance at the outer edge and corners pixels of the sensors was evaluated at three bias voltages. The results indicate a significant change in the charge collection properties between the edge and 5th (up to 275 μ m) from edge pixel for the 200 μ m thick n-on-n sensor. The edge pixel performance of the 100 μ m thick n-on-p sensors is affected only for the last two pixels (up to 110 μ m) subject to biasing conditions. Imaging characteristics of all sensor types investigated are stable over time and the non-uniformities can be minimised by flat-field corrections. The results from the synchrotron tests combined with lab measurements are presented along with an explanation of the observed effects.

The PERCIVAL ("Pixelated Energy Resolving CMOS Imager, Versatile and Large") is a collaboration of DESY, RAL/STFC, ELETTRA, and DLS to develop a monolithic active pixel sensor (MAPS) to provide a suitable detector for photon science for the photon energy regime between 250 eV and 1 keV. An important performance parameter is the spatial resolution which can be inferred from the Modulation Transfer Function (MTF). The MTF measures in optical systems the relative contrast of a pattern in function of the spatial frequency. With a back-thinned and back-illuminated PERCIVAL prototype chip, dedicated MTF evaluation data were taken at Elettra's TwinMic Beamline in March 2014 at a photon energy of 535 eV. We will present our MTF derivation approaches together with MTF results for 3 pixel types of the irradiated test sensor.

Free-Electron Lasers and Synchrotrons are rapidly increasing in brilliance. This has led a requirement of large dynamic range and high frame rate sensors that is now being fulfilled by the PERCVIAL CMOS imager for direct X-ray detection developed at Rutherford Appleton Laboratory. Utilising a lateral overflow pixel and back-side illumination, PERCIVAL simultaneously achieves low-noise single-photon detection and high full well up to 107 e−, all while maintaining a frame rate of 120Hz. PERCIVAL is currently in test structure stage, and will be produced in 2 Mpixel and 13 Mpixel “waferscale” variants in 2015.

The PERCIVAL soft-X-ray (250 eV 1 keV) image detector project is a collaboration between DESY, STFC, Elettra Sincrotrone Trieste and Diamond Light Source. The objective of the project is to develop a back-thinned CMOS detector which outperforms present soft-X ray image detector technology, in terms of sensor size, noise, dynamic range and frame rate. The size of this 13M pixel imager associated with its 120 frames per second frame rate impose very challenging requirements to the Data Acquisition Backend of the system. A DAQ backend system architecture, using a commercial deep-buffer switch to rearrange image data streams coming from different regions of the sensor via several 10Gbps Ethernet links has been proposed to reassemble image frames. Real-time data processing is to be performed on multiple, parallel commodity compute nodes. This contribution to the conference reports on benchmarking tests performed as a feasibility study, and presents the resulting recommendations for the system architecture of the PERCIVAL detector DAQ backend. The feasibility study covered three key issues: Reliably moving data in UDP packets from multiple 10Gbps Ethernet links from the DAQ front-end electronics to commodity compute nodes; Real-time processing on the compute nodes; and finally streaming data to a central parallel storage system.

A set of double-sided 3D silicon detectors have been fabricated, bump bonded to single-photon-counting Medipix2 readout chips, and tested using X-ray sources. When tested with monochromatic X-rays, the 3D detectors show reduced charge sharing compared with standard planar pixel detectors

With the increased brilliance of state-of-the-art Synchrotron radiation sources and the advent of Free Electron Lasers enabling revolutionary science with EUV to X-ray photons comes an urgent need for suitable photon imaging detectors. Requirements include high frame rates, very large dynamic range, single-photon counting capability with low probability of false positives, and (multi)-megapixels. PERCIVAL (``Pixelated Energy Resolving CMOS Imager, Versatile and Large'') is currently being developed by a collaboration of DESY, RAL, Elettra and DLS to address this need for the soft X-ray regime. PERCIVAL is a monolithic active pixel sensor (MAPS), i.e. based on CMOS technology. It will be back-thinned to access its primary energy range of 250 eV to 1 keV with target efficiencies above 90%. According to its preliminary specifications, the roughly 10 × 10 cm2, 3520 × 3710 pixel monolithic sensor will operate at frame rates up to 120 Hz (commensurate with most FELs) and use multiple gains within its 27 μm pixels to measure (e.g. at 500 eV) 1 to ~ 105 simultaneously-arriving photons. Currently, small-scale front-illuminated prototype systems (160 × 210 pixels) are undergoing detailed testing with visible-light as well as X-ray photons.

Over the last decade, synchrotron radiation sources have seen a significant increase in brilliance, and the advent of free electron lasers has made entire new research fields accessible to investigations with X-rays. These advances in light source capabilities have resulted not only in a host of scientific advances and discoveries, but also in a need for a new generation of X-ray imaging detectors that can match the sources' capabilities in terms of frame rate and image dynamic range while recording image information with fine granularity over a large - preferably uninterrupted - (multi)megapixel area with single-photon sensitivity. Developing such next-generation imagers is both costly and time-consuming, and the requirements at many photon science facilities are similar enough to invite a collaborative effort. The Percival ("Pixellated Energy Resolving CMOS Imager, Versatile And Large") imager is being developed by a collaboration of DESY, Rutherford Appleton Laboratory (RAL), Elettra, and Diamond Light Source (DLS) to answer this need for the soft X-ray regime

Our goal is to provide the scientific community with a large (10cm × 10cm) pixellated detector featuring a large dynamic range (1–105 photons), good spatial resolution (27µm), good Quantum Efficiency (QE) in the low energy range (250eV–1keV), variable readout speed (up to 120 frames/s), i.e. with characteristics compatible with user needs at today's of low-energy Free Electron Lasers (FEL) and synchrotron sources.

Hybrid pixel detectors like the Medipix and TIMEPIX developed by the Medipix collaboration combined with high-z materials are of growing interest. In particular the TIMEPIX detector can be operated in photon counting mode and time-over-threshold mode (ToT) to obtain spectral information. Previous studies showed that 110 μm pixel sizes obtain a better energy resolution than 55 μm pixel sizes. Furthermore, threshold scans obtained a better spectral resolution than operation in ToT mode. In this work the influence of noise sources in different measurement approaches on the spectral response of a TIMEPIX chip bump-bonded to CdTe sensor are presented. Two 1mm thick CdTe sensors with pixel sizes of 55 μm and 110 μm, bump-bonded to a TIMEPIX readout chip, were evaluated at the Diamond Light Source synchrotron. A finely collimated, perpendicular pencil beam with x-ray energies of 25 keV and 79 keV was used to investigate single pixels. A small area of 10x10 pixels was investigated in ToT-mode and compared to a threshold scan of the same pixels on both detectors. The measurements are compared to an analytical SPICE/Python simulation that emulates photon counting and time-over-threshold mode.

Reduced edge or "edgeless" detector design offers seamless tileability of sensors for a wide range of applications from particle physics to synchrotron and free election laser (FEL) facilities and medical imaging. Combined with through-silicon-via (TSV) technology, this would allow reduced material trackers for particle physics and an increase in the active area for synchrotron and FEL pixel detector systems. In order to quantify the performance of different edgeless fabrication methods, 2 edgeless detectors were characterized at the Diamond Light Source using an 11 μm FWHM 15 keV micro-focused X-ray beam. The devices under test were: a 150 μm thick silicon active edge pixel sensor fabricated at VTT and bump-bonded to a Medipix2 ROIC; and a 300 μm thick silicon strip sensor fabricated at CIS with edge reduction performed by SCIPP and the NRL and wire bonded to an ALiBaVa readout system. Sub-pixel resolution of the 55 μm active edge pixels was achieved. Further scans showed no drop in charge collection recorded between the centre and edge pixels, with a maximum deviation of 5% in charge collection between scanned edge pixels. Scans across the cleaved and standard guard ring edges of the strip detector also show no reduction in charge collection. These results indicate techniques such as the scribe, cleave and passivate (SCP) and active edge processes offer real potential for reduced edge, tiled sensors for imaging detection applications.

The PERCIVAL soft X-ray imager is being developed by DESY, RAL, Elettra, DLS, and PAL to address the challenges at high brilliance Light Sources such as new-generation Synchrotrons and Free Electron Lasers. Typical requirements for detector systems at these sources are high frame rates, large dynamic range, single-photon counting capability with low probability of false positives, high quantum efficiency, and (multi)-mega-pixel arrangements. PERCIVAL is a monolithic active pixel sensor, based on CMOS technology. It is designed for the soft X-ray regime and, therefore, it is post-processed in order to achieve high quantum efficiency in its primary energy range (250 eV to 1 keV) . This work will report on the latest experimental results on charge collection efficiency obtained for multiple back-side-illuminated test sensors during two campaigns, at the P04 beam-line at PETRA III, and the CiPo beam-line at Elettra, spanning most of the primary energy range as well as testing the performance for photon-energies below 250 eV . In addition, XPS surface analysis was used to cross-check the obtained results.

High quantum efficiency is important in X-ray imaging applications. This means using high-Z sensor materials. Unfortunately many of these materials suffer from defects that cause non-ideal charge transport. In order to increase the understanding of these defects, we have mapped the 3D response of a number of defects in two 1 mm thick CdTe sensors with different pixel sizes (55μm and 110 μm) using a monoenergetic microbeam at 79 keV. The sensors were bump bonded to Timepix read out chips. Data was collected in photon counting as well as time-over-threshold mode. The time-over-threshold mode is a very powerful tool to investigate charge transport properties and fluorescence in pixellated detectors since the signal from the charge that each photon deposits in each pixel can be analyzed. Results show distorted electrical field around the defects and indications of excess leakage current and large differences in behavior between electron collection and hole collection mode. The experiments were carried out in the Extreme Conditions Beamline I15 at Diamond Light Source.

A three million pixels photon counting area detector for the coherent diffraction imaging beam line (113) of Diamond Light Source has been developed by a joint team of Diamond and STFC staff. The detector is the state of the art of X-ray detection technology since it exploits the latest generation of Medipix ASICs family that introduced a number of innovations. The specifications required by the beam line represented a severe challenge to all of the components of the detector. The frame rate of Excalibur is up to 1,000 frames per second when stored in local RAM or up to 100 frames per second when streamed to storage. Tests with an X-ray set show the imaging capabilities of the detector as well as the data acquisition speed.

In this work the results on imaging and spectroscopic performances of 14 × 14 × 1 mm CdTe detectors with 55 × 55 μm and 110 × 110 μm pixel pitch bump-bonded to a Timepix chip are presented. The performance of the 110 × 110 μm pixel detector was evaluated at the extreme conditions beam line I15 of the Diamond Light Source. The energy of X-rays was set between 25 and 77 keV. The beam was collimated through the edge slits to 20 μm FWHM incident in the middle of the pixel. The detector was operated in the time-over-threshold mode, allowing direct energy measurement. Energy in the neighbouring pixels was summed for spectra reconstruction. Energy resolution at 77 keV was found to be ΔE/E = 3.9%.\ud \ud Comparative imaging and energy resolution studies were carried out between two pixel size detectors with a fluorescence target X-ray tube and radioactive sources. The 110 × 110 μm pixel detector exhibited systematically better energy resolution in comparison to 55 × 55 μm. An imaging performance of 55 × 55 μm pixellated CdTe detector was assessed using the Modulation Transfer Function (MTF) technique and compared to the larger pixel. A considerable degradation in MTF was observed for bias voltages below -300 V. Significant room for improvement of the detector performance was identified both for imaging and spectroscopy and is discussed.