73 results on '"Obeng Y"'
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2. Spatially controlled dissolution of Ag nanoparticles in irradiated SiO 2 sol–gel film
3. Publisher Correction: Metrology for the next generation of semiconductor devices
4. Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post- CMOS Applications 11
5. Formation and dissolution of copper-based nanoparticles in SiO 2 sol–gel film using heat treatment and/or UV light exposure
6. Proceedings of the Dielectrics for Nanosystems 8: Materials Science, Processing, Reliablity and Manufacturing
7. Effect of annealing on the surface microstructural evolution and the electromigration reliability of electroplated Cu films
8. Comparative study on the effect of misalignment on bordered and borderless contacts
9. Preface: Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9
10. An Overview of Recent Advances in Metrology Development for Nanoelectronics at the National Institute of Standards and Technology (NIST)
11. Applicability of dynamic mechanical analysis for CMP polyurethane pad studies
12. Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces
13. Proceedings of the Dielectrics for Nanosystems 7: Materials Science, Processing, Reliablity and Manufacturing Symposium
14. Proceedings of the Dielectrics for Nanosystems 6: Materials Science, Processing, Reliablity and Manufacturing Symposium
15. Broadband Spectroscopic Characterization of Hybrid Low-k Dielectric Thin Films for Micro- and Nanoelectronic Applications
16. (Invited) Broadband Spectroscopic Characterization of Electrically Active Defects in Dielectrics: Monitoring the in-Service Evolution of Dialectics in Integrated System
17. (Invited) Hardware Security to Mitigate Threats to Networked More-Than-Moore Sensors
18. (Invited) Characterization of Buried Interfaces with Scanning Probe Microscopes
19. Dielectric Spectroscopic Detection of Early Failures in 3-D Integrated Circuits
20. Temperature Dependence of Defect Evolution and Distribution in Thermally Cycled Cu-TSVs
21. (Invited) Microwave-Based Metrology Platform Development: Application of Broad-Band RF Metrology to Integrated Circuit Reliability Analyses
22. Measurement Science for "More-Than-Moore" Technology Reliability Assessments
23. (Invited) Impact of Thermal Stability of Isolation Liner on the Electrical Characteristics of TSVs
24. Graphene: Is It the Future for Semiconductors? An Overview of the Material, Devices, and Applications
25. Spatially controlled dissolution of Ag nanoparticles in irradiated SiO2 sol–gel film
26. Formation and dissolution of copper-based nanoparticles in SiO2 sol–gel film using heat treatment and/or UV light exposure
27. An Overview of Recent Advances in Metrology Development for Nanoelectronics at the National Institute of Standards and Technology (NIST)
28. Effect of Slurry Characteristics on the Surface Tribology During Copper CMP Process
29. Formation/dissolution of metallic nanoparticles in SiO2 film using cw and ns UV exposure
30. Full-Bit Functional, High-Density 8 Mbit One Transistor–One Capacitor Ferroelectric Random Access Memory Embedded within a Low-Power 130 nm Logic Process
31. Nickel SALICIDE Process Technology for CMOS Devices of 90nm Node and Beyond
32. Full-Bit Functional, High-Density 8Mb 1T-1C FRAM Embedded Within a Low-Power 130nm Logic Process
33. Chemical Mechanical Planarization of Copper: Role of Oxidants and Inhibitors
34. 45-nm node NiSi FUSI on nitrided oxide bulk CMOS fabricated by a novel integration process.
35. Planar TEM Analysis of Nanoindented Samples Using the Focused Ion Beam Lift-Out Technique
36. Asymmetrical Critical Current Density and Its Influence on Electromigration of Two-Level W-Plug Interconnection
37. New Dielectric Materials
38. Pitting of the Silicon Layer of Poly Buffered LOCOS Stack
39. ChemInform Abstract: Oxidant-Dependent Nonadiabatic Intervalence Transitions.
40. Nanoporous Ultralow Dielectric Constant Organosilicates Templated by Triblock Copolymers
41. Effect of silicon nitride capping layer on via electromigration and failure criterion methodology in multilevel interconnection
42. Impact of post via-etch cleans on mechanical reliability of W-plug vias
43. ECS Transactions: Preface
44. Nickel SALICIDE Process Technology for CMOS Devices of 90nm Node and Beyond
45. An Overview of Recent Advances in Metrology Development for Nanoelectronics at the National Institute of Standards and Technology (NIST)
46. Formation and dissolution of copper-based nanoparticles in SiO2 sol–gel film using heat treatment and/or UV light exposure
47. Metrology for 2D materials: a perspective review from the international roadmap for devices and systems.
48. The prognostic strength of serum LDH and serum ferritin in children with neuroblastoma: A report from the International Neuroblastoma Risk Group (INRG) project.
49. Probe assisted localized doping of aluminum into silicon substrates.
50. Innovative Approaches to Combat Healthcare-Associated Infections Using Efficacy Standards Developed Through Industry and Federal Collaboration.
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