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4. Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post- CMOS Applications 11

6. Proceedings of the Dielectrics for Nanosystems 8: Materials Science, Processing, Reliablity and Manufacturing

13. Proceedings of the Dielectrics for Nanosystems 7: Materials Science, Processing, Reliablity and Manufacturing Symposium

14. Proceedings of the Dielectrics for Nanosystems 6: Materials Science, Processing, Reliablity and Manufacturing Symposium

30. Full-Bit Functional, High-Density 8 Mbit One Transistor–One Capacitor Ferroelectric Random Access Memory Embedded within a Low-Power 130 nm Logic Process

31. Nickel SALICIDE Process Technology for CMOS Devices of 90nm Node and Beyond

32. Full-Bit Functional, High-Density 8Mb 1T-1C FRAM Embedded Within a Low-Power 130nm Logic Process

40. Nanoporous Ultralow Dielectric Constant Organosilicates Templated by Triblock Copolymers

44. Nickel SALICIDE Process Technology for CMOS Devices of 90nm Node and Beyond

45. An Overview of Recent Advances in Metrology Development for Nanoelectronics at the National Institute of Standards and Technology (NIST)

46. Formation and dissolution of copper-based nanoparticles in SiO2 sol–gel film using heat treatment and/or UV light exposure

47. Metrology for 2D materials: a perspective review from the international roadmap for devices and systems.

48. The prognostic strength of serum LDH and serum ferritin in children with neuroblastoma: A report from the International Neuroblastoma Risk Group (INRG) project.

49. Probe assisted localized doping of aluminum into silicon substrates.

50. Innovative Approaches to Combat Healthcare-Associated Infections Using Efficacy Standards Developed Through Industry and Federal Collaboration.

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