111 results on '"Ousten, Yves"'
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2. Enhancing Capacitor Performance for High-Field MRI Systems: A Comprehensive Analysis and Advanced Modeling Approach
3. List of Authors
4. Reliability of Laser Diodes for High-rate Optical Communications – A Monte Carlo-based Method to Predict Lifetime Distributions and Failure Rates in Operating Conditions
5. Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability
6. Photothermal activated failure mechanism in polymer-based packaging of low power InGaN/GaN MQW LED under active storage
7. Méthodologies d'analyse de la fiabilité de dispositifs à LED
8. FEM simulation‐based development of a new tunable non‐magnetic RF high voltage capacitor for the new generation of MRI
9. Power MOSFET active power cycling for medical system reliability assessment
10. FEM simulation‐based development of a new tunable non‐magnetic RF high voltage capacitor for the new generation of MRI.
11. 3 - Reliability of Laser Diodes for High-rate Optical Communications – A Monte Carlo-based Method to Predict Lifetime Distributions and Failure Rates in Operating Conditions
12. Implementation of a 'Design of Experiments' methodology for the prediction of phototransistor degradation in a space environment
13. An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy
14. Use of signal processing imaging for the study of a 3D package in harsh environment
15. Ultra-thin actives for embedded components: halfway between thin film technology and embedded Surface Mounted Device.
16. Electrical modeling approach and manufacturing of a new adjustable capacitor for medical applications
17. A new non-magnetic trimmer for the magnetic resonance imaging system
18. Comparative FEM thermo-mechanical simulations for built-in reliability: Surface mounted technology versus embedded technology for silicon dies
19. Photothermal activated pellicular failure mechanism in polymer-based packaging of low power InGaN/GaN MQW LED under active storage
20. Overview on Sustainability, Robustness, and Reliability of GaN Single-Chip LED Devices
21. Starck effects model used to highlight selective activation of failure mechanisms in MQW InGaN/GaN light emitting diodes
22. Trapped mobile charges effects on electro-optical performances in silicon phototransistors for space applications
23. OpERaS : 'OptoElectronic Reliability applied to Space environment' Un nouveau consortium pour l'évaluation de la fiabilité de dispositifs optoélectroniques et photoniques dédiés à l'environnement spatial
24. Méthodologie d'analyse physique pour l'évaluation de la fiabilité de Diodes Electroluminescentes InGaN/GaN
25. Electro-optical Characterizations at the Emitter Level in Stacked Laser Diodes Bars for Space Applications
26. Overview of light emitting diodes: Reliability estimation from the junction to the packaging
27. Thermomechanical Stresses and Optical Misalignment in 1550 nm Emissive Optoelectronic Modules Using FEM and Process Dispersions
28. Benefits of individual emitter electro-optical characterizations in packaged high power Laser diode bars for space applications
29. Embedded passive components to increase the reliability of high frequency electronic circuits
30. Characterization and reliability of quartz resonators submitted to high temperature
31. Projet Européen VIGOR: Indusrialisation et dissipation thermique de modules 3D
32. Scanning laser ultrasonics experiments for in-situ non-destructive analysis of integrated circuits
33. Monte-carlo computations for predicted degradation of photonic devices in space environment
34. Applications de l acoustique picoseconde à l analyse non destructive de circuits intégrés
35. Caractérisation des condensateurs enterrés pour des applications hyperfréquences
36. Simulation and results on thermal management T4.2
37. Embedded Passive Design for High Speed Circuits
38. Reliability of Low-Cost PCB Interconnections for Telecommunication Applications
39. Reliability analysis of ceramic capacitors under 200C
40. FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint
41. Predictive reliability using FEA simulations of power stacked ceramic capacitors for aeronautical applications
42. Processing of piezoelectric ceramics and new applications of the piezoelectric resonance
43. Impedance spectroscopy on aluminium and tantalum capacitors after more than 10 years in uses at EDF
44. Application of Picosecond Ultrasonics to Non-Destructive Defect Analysis in VLSI Circuits
45. Extraction of the MLCC Matrix of Compliance Used for Reliability
46. Reliability Analysis of Tantalum Capacitors for High Temperature Application
47. Dissipation thermique dans les dispositifs à fortes densités de puissance. Cas des TBHs sur GaAs et évaluation de deux techniques de report
48. Caractérisation d interfaces Cu/Al2O3 par un système d analyse ultrasonore
49. Long term in-vacuum reliability testing of 980nm laser diode pump modules for space applications
50. Crack Propagation Modeling in Silicon: A Comprehensive Thermomechanical Finite-Element Model Approach for Power Devices
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