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Direct observation of the capture cross section is challenging due to the need for extremely short filling pulses in the two-gate Deep-Level Transient Spectroscopy (DLTS). Simple estimation of the cross section can be done from DLTS and admittance spectroscopy data but it is not feasible to distinguish temperature dependence of pre-exponential and exponential parts of the emission rate equation with sufficient precision conducting a single experiment. This paper presents experimental data of deep levels in β-Ga2O3 that has been gathered by our group since 2017. Based on the gathered data, we propose a derivation of apparent activation energy (E a m) and capture cross section (σ n m) assuming the temperature dependent capture via the multiphonon emission model, which resulted in a strong correlation between E a m and σ n m according to the Meyer–Neldel rule, which allowed us to estimate low- and high-temperature capture coefficients C 0 and C 1 as well as capture barrier E b. It also has been shown that without considering the temperature dependence of capture cross section, the experimental values of σ n are overestimated by 1–3 orders of magnitude. A careful consideration of the data also allows to be more certain identifying deep levels by their "fingerprints" (E a and σ n) considering two additional parameters (E M N and σ 00) and to verify the density functional theory computation of deep-level recombination properties. [ABSTRACT FROM AUTHOR]

We report the electrical properties, deep trap spectra, and diffusion lengths of non-equilibrium carriers in Ni Schottky diodes and NiO/Ga2O3 heterojunctions (HJs) prepared on the same n−/n+ β-Ga2O3 epi structures. The heterojunctions decrease the reverse current of Ga2O3 high-power rectifiers. In HJs, in contrast to Schottky diodes, the capacitance and AC conductance show a prominent frequency and temperature dependence, suggesting the presence of two temperature activation processes with activation energies of 0.17 and 0.1 eV. The deep trap spectra of the Schottky diodes and HJs differ by the absence in the HJ of deep electron traps E2* with level near Ec − 0.7 eV considered to be an important center of non-radiative recombination. This correlates with the observed increase in the diffusion length of non-equilibrium charge carriers in the HJs to 370 nm compared to 240 nm in the Schottky diodes. The diffusion length of charge carriers in p-NiO was found to be quite short, 30 nm. Possible reasons for the observed differences and possible origin of the minority-trap-like feature commonly reported to be present in the deep level spectra of HJs and also observed in our experiments are discussed. [ABSTRACT FROM AUTHOR]

Point defects were controllably introduced into 270 nm AlGaN Light-Emitting Diodes (LEDs) by 5 MeV electron and 1.1 MeV proton irradiations to examine the effect on electrical and luminescent characteristics. The 5 MeV electron irradiations had only a marginal effect on the charge distribution, current flow, and electroluminescence of LEDs for electron fluences up to 4.5 × 1016 e/cm2 that cause very strong degradation in green, blue, and near-UV LEDs. This lack of changes is attributed to the much higher charge densities in quantum-wells (QWs) and quantum barriers (QBs) of the 270 nm LEDs and to higher bond strength in high Al mole fraction AlGaN layers. By contrast, irradiation with 1.1 MeV protons with a fluence of 1016 p/cm2 leads to more than two orders of magnitude decrease in charge density in the QWs and QBs, a strong increase in the series resistance, and the emergence of deep electron traps near Ec-0.5 eV. The difference is explained by a much higher density of primary defects produced by protons. The observed effects are compared to changes in performance caused by aging after high driving current. [ABSTRACT FROM AUTHOR]

270 nm deep-ultraviolet AlGaN light-emitting diodes were irradiated with either neutrons or 15 MeV protons. Neutrons produced via charge-exchange reactions of 9Be with protons exhibited energy ranges from 0 to 33 MeV, with an average energy of approximately 9.8 MeV. The fluences ranged from 1.1 × 1014 to 2.2 × 1014 neutrons cm−2 and 1013 or 1014 protons cm−2. Two primary degradation modes were observed: increased trap-assisted tunneling, indicated by an initial reduction in turn-on voltage, and a decrease in carrier concentration, shown by reduced forward current due to deep state formation. For instance, 15 MeV proton irradiation resulted in more than an order of magnitude reduction in reverse current at a fluence of 1014 ions cm−2. The decrease in subthreshold leakage current at higher fluences of neutrons and protons is attributed to defect-induced carrier trapping, thereby reducing layer conductivity across the p-n junction. Emission intensity decreased with fluence for both protons and neutrons, without a measurable increase in midgap emission. The nonlinear degradation in current and light output with fluence suggests strong dynamic recombination of defects during irradiation of high aluminum alloys. [ABSTRACT FROM AUTHOR]

Co-60 gamma irradiation of SiC merged-PiN Schottky (MPS) diodes up to fluences of 1 Mrad (Si) produces increases in both forward and reverse current, with less damage when the devices are biased during irradiation. Subsequent injection of minority carriers by forward biasing at 300 K can partially produce some damage recovery, but at high forward biases also can lead to further degradation of the devices, even in the absence of radiation damage. Recombination-enhanced annealing by carrier injection overall is not an effective technique for recovering gamma-induced damage in SiC MPS diodes, especially when compared to other near athermal methods like electron wind force annealing. [ABSTRACT FROM AUTHOR]

Ion beam fabrication of metastable polymorphs of Ga2O3, assisted by the controllable accumulation of the disorder in the lattice, is an interesting alternative to conventional deposition techniques. However, the adjustability of the electrical properties in such films is unexplored. In this work, we investigated two strategies for tuning the electron concentration in the ion beam created metastable κ-polymorph: adding silicon donors by ion implantation and adding hydrogen via plasma treatments. Importantly, all heat treatments were limited to ≤600 °C, set by the thermal stability of the ion beam fabricated polymorph. Under these conditions, silicon doping did not change the high resistive state caused by the iron acceptors in the initial wafer and residual defects accumulated upon the implants. Conversely, treating samples in a hydrogen plasma converted the ion beam fabricated κ-polymorph to n-type, with a net donor density in the low 1012 cm−3 range and dominating deep traps near 0.6 eV below the conduction band. The mechanism explaining this n-type conductivity change may be due to hydrogen forming shallow donor complexes with gallium vacancies and/or possibly passivating a fraction of the iron acceptors responsible for the high resistivity in the initial wafers. [ABSTRACT FROM AUTHOR]

NiO/Ga2O3 heterojunction rectifiers were exposed to 1 Mrad fluences of Co-60 γ-rays either with or without reverse biases. While there is a small component of Compton electrons (600 keV), generated via the interaction of 1.17 and 1.33 MeV gamma photons with the semiconductor, which in turn can lead to displacement damage, most of the energy is lost to ionization. The effect of the exposure to radiation is a 1000× reduction in forward current and a 100× increase in reverse current in the rectifiers, which is independent of whether the devices were biased during this step. The on–off ratio is also reduced by almost five orders of magnitude. There is a slight reduction in carrier concentration in the Ga2O3 drift region, with an effective carrier removal rate of <4 cm−1. The changes in electrical characteristics are reversible by application of short forward current pulses during repeated measurement of the current–voltage characteristics at room temperature. There are no permanent total ionizing dose effects present in the rectifiers to 1 Mad fluences, which along with their resistance to displacement damage effects indicate that these devices may be well-suited to harsh terrestrial and space radiation applications if appropriate bias sequences are implemented to reverse the radiation-induced changes. [ABSTRACT FROM AUTHOR]

The band alignments of two candidate dielectrics for ScAlN, namely, SiO2 and Al2O2, were obtained by x-ray photoelectron spectroscopy. We compared the effect of deposition method on the valence band offsets of both sputtered and atomic layer deposition films of SiO2 and Al2O3 on Sc0.27Al0.73 N (bandgap 5.1 eV) films. The band alignments are type I (straddled gap) for SiO2 and type II (staggered gap) for Al2O3. The deposition methods make a large difference in relative valence band offsets, in the range 0.4–0.5 eV for both SiO2 and Al2O3. The absolute valence band offsets were 2.1 or 2.6 eV for SiO2 and 1.5 or 1.9 eV for Al2O3 on ScAlN. Conduction band offsets derived from these valence band offsets, and the measured bandgaps were then in the range 1.0–1.1 eV for SiO2 and 0.30–0.70 eV for Al2O3. These latter differences can be partially ascribed to changes in bandgap for the case of SiO2 deposited by the two different methods, but not for Al2O3, where the bandgap as independent of deposition method. Since both dielectrics can be selectively removed from ScAlN, they are promising as gate dielectrics for transistor structures. [ABSTRACT FROM AUTHOR]

The changes of electrical properties and deep trap spectra induced in n-type β-Ga2O3 by 1 GeV protons with a fluence of 4 × 1013 cm−2 were studied. The carrier removal rates were ∼100 cm−1 at this energy. For comparison, for 20 MeV proton irradiation at comparable fluences (5–10 × 1014 cm−2), the removal rate was ∼400 cm−1 for donor concentrations of 3 × 1016 cm−3 and ∼100 cm−1 for concentrations of <1016 cm−3. These removal rates were in stark contrast with modeling results that predicted the introduction rates of vacancies to be two orders of magnitude higher for 20 MeV protons. Measurements of deep electron and hole traps densities by deep level transient spectroscopy with electrical or optical injection (DLTS or ODLTS), and capacitance–voltage profiling under monochromatic light illumination showed that the 1 GeV proton irradiation resulted in the introduction of deep donors E2*(Ec-0.75 eV) and E3 (Ec-1 eV) and deep acceptors with optical ionization threshold near 2.3 eV producing a feature near 250 K in ODLTS and 3.1 eV with related ODLTS feature near 450 K. The total concentration of all deep traps was much lower than that necessary to explain the observed decrease in net donor density upon irradiation. The donor densities showed a nonuniform distribution in proton irradiated films with the concentration greatly decreased toward the surface. Possible reasons for the observed performance are discussed. [ABSTRACT FROM AUTHOR]

Transition metal (TM) ions incorporated into a host from a wide bandgap semiconductor are recognized as a promising system for quantum technologies with enormous potential. In this work, we report on a TM color center in β-Ga2O3 with physical properties attractive for quantum information applications. The center is found to emit at 1.316 μm and exhibits weak coupling to phonons, with optically addressable higher-lying excited states, beneficial for single-photon emission within the telecom range (O-band). Using magneto-photoluminescence (PL) complemented by time-resolved PL measurements, we identify the monitored emission to be internal 1E→3A2 spin-forbidden transitions of a 3d8 TM ion with a spin-triplet ground state—a possible candidate for a spin qubit. We tentatively attribute this color center to a complex involving a sixfold coordinated Cu3+ ion. [ABSTRACT FROM AUTHOR]

The effects of 20 MeV proton irradiation with fluences of 5 × 1014 and 1015 p/cm2 on electrical properties of lightly Sn doped n-type (net donor concentration 3 × 1017 cm−3) bulk β-Ga2O3 samples with (010) and (−201) orientation were studied. Proton irradiation decreases the net donor density with a removal rate close to 200 cm−1 for both orientations and similar to the electron removal rates in lightly Si doped β-Ga2O3 epilayers. The main deep electron traps introduced in the β-Ga2O3 crystals of both orientations are near Ec−0.45 eV, while in Si doped films, the dominant centers were the so-called E2* (Ec−0.75 eV) and E3 (Ec−0.1 eV) traps. Deep acceptor spectra in our bulk –Ga2O3(Sn) crystals were dominated by the well-known centers with an optical ionization energy of near 2.3 eV, often attributed to split Ga vacancies. These deep acceptors are present in a higher concentration and are introduced by protons at a higher rate for the (010) orientation. Another important difference between the two orientations is the introduction in the surface region (∼0.1 μm from the surface) of the (010) of a very high density of deep acceptors with a level near Ec−0.27 eV, not observed in high densities in the (−201) orientation or in Si doped epitaxial layers. The presence of these traps gives rise to a very pronounced hysteresis in the low temperature forward current–voltage characteristics of the (010) samples. These results are yet another indication of a significant impact of the orientation of the β-Ga2O3 crystals on their properties, in this case, after proton irradiation. [ABSTRACT FROM AUTHOR]