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Na Li,1 Xiang Yu,2 Michael Pecht3 1School of Law, Ningbo University, Ningbo, People’s Republic of China; 2School of Law and Politics, Ningbo Institute of Technology, Zhejiang University, Ningbo, People’s Republic of China; 3Center for Advanced Life Cycle Engineering, University of Maryland, College Park, MD, USAAbstract: The concept of pharmaceutical data exclusivity protection comes from the West. The Agreement on Trade-Related Aspects of Intellectual Property Rights (TRIPS) establishes the basic rules for pharmaceutical data exclusivity protection. People’s Republic of China’s domestic law is consistent with the TRIPS agreement. In the drug registration approval process of the People’s Republic of China’s Drug Supervision Department, pharmaceutical data exclusivity protection has encountered some problems, including data authentication, exclusive rights to data, number of drugs requiring data to be submitted, and drug costs. In view of the long-term interests of the People’s Republic of China’s pharmaceutical industry and intellectual property protection trends, there are a lot of difficulties in the enforcement of pharmaceutical data exclusivity protection law that need to be overcome. Some measures can be taken, such as establishing a shorter data exclusivity protection period, only protecting the data submitted and relied on in the People’s Republic of China, only protecting the drugs that use new chemical components, allowing application and necessary research before the expiry of pharmaceutical data exclusivity protection period of generic drugs.Keywords: drug, developing countries, approval, competition

Thermomechanical properties of low temperature cofired ceramic substrates in the range of operational temperatures are necessary to incorporate into the design models for multichip modules and other electronic packages. These properties are also required in assessing reliability and aiding in screening and qualification procedures. This paper presents the test methods and experimental results on various thermomechanical properties of low temperature cofired ceramic over the temperature range of -55 [degrees] C to +250 [degrees] C. Material properties determined from the tests include the modulus of elasticity, the modulus of rupture, the fracture toughness, and the coefficient of thermal expansion.

The fatigue life and lead stiffness of electronics surface mounted components are studied. Gullwing and J solder joints and leads were subjected to three-dimensional finite element analysis to evaluate the effects of lead stiffness on the materials' fatigue life and formulate a reliable method for solder life span computation. Results reveal that solder fatigue life is highly dependent on the components' physical features, such as height and thickness.

The feasibilty of using an energy-partitioning approach in investigating the creep and fatigue behaviors of solder materials is discussed. The technique, which is based on the Halford-Manson strain-range partitioning method, is capable of examining the factors that affect solder fatigue behavior. It relies on the solder material's stress-strain history in establishing the inelastic work dissipated and elastic strain-energy stored during each temperature cycle. This technique can be very useful in the systematic analysis of solder fatigue behavior.

The finite element method (FEM) is used to study the stress concentration in plated-through-hole (PTH) structures of multilayered printed circuit boards (MLB). The research gives new data on how surface shape and mechanical properties affect the design of MLBs. Three-dimensional and axisymmetric FEM models are developed to analyze the stresses in FR-4 and kevlar-polyimide MLBs. Results show that stresses decrease with an increase in plate thickness and spacing. Stress relief is provided by innerplanes, internal pads and signal layers in FR-4 MLBs. Stresses increase along the length of the barrel for Kevlar-polyimide MLBs.