22 results on '"Ritzdorf, T."'
Search Results
2. Tools for Monitoring and Control of Bath Components
3. Electroless Deposition Processes and Tools
4. Formation of TSV for the stacking of advanced logic devices utilizing bumpless wafer-on-wafer technology
5. Electroplated Damascene Copper: Process Influences on Recrystallization and Texture
6. Microstructure and Texture of Electroplated Copper in Damascene Structures
7. Two- and three-dimensional numerical modeling of copper electroplating for advanced ULSI metallization
8. Wet process optimization to deposit conformal Cu diffusion barrier into TSV
9. Through-silicon-via technology for 3D integration
10. Electric Field Effects on the Formation of Isolated Macro Porous Silicon
11. Design and modeling of equipment used in electrochemical processes for microelectronics
12. Copper electrodeposition for 3D integration.
13. Through silicon via copper electrodeposition for 3D integration.
14. High rate electrodeposition of near-eutectic PbSn solders.
15. Electrodeposition of ternary near-eutectic SnAgCu solders with an alkaline bath.
16. Wet process optimization to deposit conformal Cu diffusion barrier into TSV.
17. Comparative investigation of plating conditions on self-annealing of electrochemically deposited copper films.
18. Self-annealing of electrochemically deposited copper films in advanced interconnect applications.
19. ECS Transactions: Preface
20. Self-annealing of electrochemically deposited copper films in advanced interconnect applications
21. A Cu/low-κ dual damascene interconnect for high performance and low cost integrated circuits
22. Factors affecting copper filling process within high aspect ratio deep vias for 3D chip stacking.
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.