150 results on '"Spelt, Jan K."'
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2. Measurements of wall-media contact forces and work in a vibratory finisher
3. Lab on a rod: Size-based particle separation and sorting in a helical channel
4. Inertial particle separation in helical channels: A calibrated numerical analysis
5. Aerodynamic focusing of an abrasive air jet and its effect on machining resolution
6. Predicting delamination in multilayer composite circuit boards with bonded microelectronic components
7. Jet properties and mixing chamber flow in a high-pressure abrasive slurry jet: part II—machining rates and CFD modeling
8. Jet properties and mixing chamber flow in a high-pressure abrasive slurry jet: part I—measurement of jet and chamber conditions
9. Strain-rate dependent influence of adherend stiffness on fracture load prediction of BGA solder joints
10. Fracture load prediction of BGA solder joints: Cohesive zone modeling and experimental verification
11. Effect of entrained air in abrasive water jet micro-machining: Reduction of channel width and waviness using slurry entrainment
12. Abrasive waterjet micro-machining of channels in metals: Model to predict high aspect-ratio channel profiles for submerged and unsubmerged machining
13. Influence of process parameters on average particle speeds in a vibratory finisher
14. Bulk mass flow in a vibratory finisher: mechanisms and effect of process parameters
15. Comparison of solder joint fracture behavior in Arcan and DCB specimens
16. Effect of processing parameters on fracture toughness of lead-free solder joints
17. Finite element continuum modeling of vibrationally-fluidized granular flows
18. Electrochemical slurry jet micro-machining of tungsten carbide with a sodium chloride solution
19. Abrasive waterjet micro-machining of channels in metals: Comparison between machining in air and submerged in water
20. Particle impact velocities in a vibrationally fluidized granular flow: Measurements and discrete element predictions
21. High pressure abrasive slurry jet micro-machining using slurry entrainment
22. Effect of Solder Joint Length on Fracture Under Bending
23. Effect of geometry on the fracture behavior of lead-free solder joints
24. Mixed-mode fracture load prediction in lead-free solder joints
25. R-curve behavior of Cu–Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure
26. Fracture load prediction of lead-free solder joints
27. Inertial particle separation in helical channels: A calibrated numerical analysis
28. Lab on a rod: Size-based particle separation and sorting in a helical channel
29. Durability
30. Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints
31. Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies
32. Ultrasonic couplants for acoustic microscopy of low speed materials
33. Copper and copper-nickel alloys as zebra mussel antifoulants
34. Attachment strength of zebra mussels on natural polymeric, and metallic materials
35. Preston-static tubes for the measurement of wall shear stress
36. Tribological behavior of aluminum alloys in a vibratory finishing process
37. Analysis of thermal warpage in a PCB with an array of PTH connectors
38. Jet properties and mixing chamber flow in a high-pressure abrasive slurry jet: part II—machining rates and CFD modeling
39. Low-stress creep deformation in two opto-electronic glass-epoxy joints: Part I – adhesive creep data
40. Low-stress creep deformation in two opto-electronic glass-epoxy joints: Part II – Joint measurements and FEA
41. Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling
42. Load Sharing Between Discrete Solder Joints in Bending: Effect of Spacing and Joint Properties
43. Effect of adhesive fillet geometry on bond strength between microelectronic components and composite circuit boards
44. Effect of Solder Joint Length on Fracture Under Bending
45. Combined effect of strain-rate and mode-ratio on the fracture of lead-free solder joints
46. High pressure abrasive slurry jet micro-machining using slurry entrainment
47. Micro-Machining of Channels using a High Pressure Abrasive Slurry Jet Machine (HASJM)
48. 'BGA Solder Joint Fracture as a Function of Strain Rate and PCB Rigidity': SMTA International Conference on Soldering and Reliability
49. Surface Finishing of Micro-channels Using Low Kinetic Energy Abrasives
50. Development of a laser displacement probe to measure particle impact velocities in vibrationally fluidized granular flows
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