1. Low temperature atomic layer deposition of cobalt using dicobalt hexacarbonyl-1-heptyne as precursor
- Author
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Mathias Franz, Mahnaz Safian Jouzdani, Lysann Kaßner, Marcus Daniel, Frank Stahr, and Stefan E. Schulz
- Subjects
atomic layer deposition (ald) ,cobalt ,low-temperature ald ,peald ,plasma-enhanced ald ,xps ,Technology ,Chemical technology ,TP1-1185 ,Science ,Physics ,QC1-999 - Abstract
In this work, we present the development of an atomic layer deposition (ALD) process for metallic cobalt. The process operates at low temperatures using dicobalt hexacarbonyl-1-heptyne [Co2(CO)6HC≡CC5H11] and hydrogen plasma. For this precursor an ALD window in the temperature range between 50 and 110 °C was determined with a constant deposition rate of approximately 0.1 Å/cycle. The upper limit of the ALD window is defined by the onset of the decomposition of the precursor. In our case, decomposition occurs at temperatures of 125 °C and above, resulting in a film growth in chemical vapour deposition mode. The lower limit of the ALD window is around 35 °C, where the reduction of the precursor is incomplete. The saturation behaviour of the process was investigated. X-ray photoelectron spectroscopy measurements could show that the deposited cobalt is in the metallic state. The finally established process in ALD mode shows a homogeneous coating at the wafer level.
- Published
- 2023
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