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2 results on '"Tan, Kee Tchuan"'

1. Integration of electroless copper and electrolytic copper plating

Author

Tan, Kee Tchuan., Goh, Wang Ling, and School of Electrical and Electronic Engineering

Subjects
Engineering::Electrical and electronic engineering::Semiconductors [DRNTU]
Abstract

This thesis presents our findings on the electroless Cu seed deposition process as well as its integration to mainstream Cu electroplating bulk-fill. Initial works include formulating (in-house) a suitable electronless Cu bath composition, and identifying appropriate catalyzation techniques to initiate the electronless Cu film growth. Master of Engineering

Published
2002

2. The use of electroless copper seed in electrochemical deposited copper interconnect

Author

Goh, Wang Ling and Tan, Kee Tchuan

Subjects
*COPPER, *ELECTROPLATING, *CHEMICAL vapor deposition, *THIN films
Abstract

Copper (Cu) electroplating (EP) process requires a Cu seed to conduct the current. Conventional physical vapor deposition (PVD) seed suffers from poor step coverage while chemical vapor deposition (CVD) seed is cost-ineffective. We therefore propose the use of electroless (EL) technique as a Cu seed deposition method and demonstrate its integration with conventional Cu EP. The EL seed has excellent step coverage which when combined with the bottom-up fill capability of additives-based EP process, produces void-free fill. The EL seed-EP Cu film stack has good resistivity, roughness and acceptable (111) texture. However, some adhesion issues remain to be solved for this integration scheme. [Copyright &y& Elsevier]

Published
2004
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