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405 results on '"Vanfleteren, Jan"'

1. A Novel Method for Component Positioning in Thermoformed Electronics

Author

Madadnia, Behnam, Bossuyt, Frederick, Vanfleteren, Jan, Kacprzyk, Janusz, Series Editor, Gomide, Fernando, Advisory Editor, Kaynak, Okyay, Advisory Editor, Liu, Derong, Advisory Editor, Pedrycz, Witold, Advisory Editor, Polycarpou, Marios M., Advisory Editor, Rudas, Imre J., Advisory Editor, Wang, Jun, Advisory Editor, Valle, Maurizio, editor, Lehmhus, Dirk, editor, Gianoglio, Christian, editor, Ragusa, Edoardo, editor, Seminara, Lucia, editor, Bosse, Stefan, editor, Ibrahim, Ali, editor, and Thoben, Klaus-Dieter, editor

Published
2023
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13. Optimized Packaging and Storage Strategies to Improve Immunosensors’ Shelf-Life

Author

Vermeulen, An, Lopes, Paula, Devlieghere, Frank, Ragaert, Peter, Vanfleteren, Jan, and Khashayar, Patricia

Abstract

Objectives: immunosensors are a versatile technology enabling affinity-based detection of a large variety of molecular targets. Their common use in practice, however, is limited due to the instability of the antibodies and therefore shelf-life issues. Despite the negative impact of these challenges on the commercialization of such sensors, not many studies have provided solutions in this regard. This work illustrates how the experience from the food packaging industry could help reduce the negative effect of environmental factors such as O2, humidity, and temperature on the performance of immunosensors and improve their long-term stability. To the best of our knowledge, this approach is completely novel. Methods: Different packaging approaches, namely vacuum packaging, and packaging under modified atmosphere along with multilayer packaging material with good to excellent gas and water barrier properties based on the food packaging studies were compared. The packed samples were exposed to different storage conditions (humidity and temperature) to determine the optimum storage condition. Results: The tray-top-film with Polyamide (PA)/ethylene vinyl alcohol copolymers (EVOH)/PA/polyethylene (PE)/polypropylene (PP) foil, flushed with 100% N2, packed within 2-h after the fabrication of the immunosensor was concluded as the optimum packaging. With regard to relative humidity, values below 50% should be considered during the packaging process and storage to avoid possible dehydration of the immunosensor and so its over time performance loss. When packed under these conditions, the shelf-life of the immunosensor is increased to more than six months even if stored in room temperature.

Published
2024
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26. System-in-Foil Technology

Author

Dietzel, Andreas, van den Brand, Jeroen, Vanfleteren, Jan, Christiaens, Wim, Bosman, Erwin, De Baets, Johan, and Burghartz, Joachim, editor

Published
2011
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39. In vivo blue light illumination for optogenetic inhibition: effect on local temperature and excitability of the rat hippocampus

Author

Acharya, Anirudh R, primary, Vandekerckhove, Bram, additional, Larsen, Lars Emil, additional, Delbeke, Jean, additional, Wadman, Wytse J, additional, Vonck, Kristl, additional, Carette, Evelien, additional, Meurs, Alfred, additional, Vanfleteren, Jan, additional, Boon, Paul, additional, Missinne, Jeroen, additional, and Raedt, Robrecht, additional

Published
2021
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41. Reducing out-of-plane deformation of metal interconnects in structural electronics

Author

Vanfleteren Jan, Madadnia Behnam, and Bossuyt Frederick

Subjects
Fabrication, Meander (mathematics), Materials science, Stack (abstract data type), Stretchable electronics, Delamination, Copper interconnect, Mechanical engineering, Electronics, Deformation (meteorology)
Abstract

This paper presents a novel approach for removing out-of-plane deformation in metal interconnects by adding a fractional structure to the original meander shape and using the optimised fabrication stack. In thermoformed electronics in cases where copper is used as the conductor, the twisting of meander-shaped structures caused by excessive mechanical stress can cause a non-uniform surface, delamination of the metal interconnect from the substrate, and in some cases, a short circuit to the adjacent tracks. Typically, stretchable electronics designers use various shapes and widths of the copper interconnect to tackle this issue. Using conventional meander shapes such as horseshoes and U shapes is not universally practical, especially when stretching is higher than 30 percent leading to significant out-of-plane deformation. Limiting this out-of-plane deformation by reducing the track width is not always applicable, as a minimum width is needed from a technology and conductivity perspective. The presented approach is inspired by computational and experimental studies of multiple meander shapes and fabrication methods. A geometry-based and fabrication-based approach is presented, which can reduce the mechanical stress of almost all possible meander shapes by increasing the meander’s path length to accommodate the metal track’s produced torque during stretching. An analytical approach is provided for calculating the optimal meander parameters, and the optimal fabrication stack is achieved based on simulation results. Experiments and finite-element modeling for an industrial case study show the improvement in the stress distribution and reduction of out-of-plane.

Published
2021

50. Introduction of a high quality nanofilm of aluminum oxide enhances the performance of EWOD microfluidic platforms

Author

Karcz, Adriana, Schaubroeck, David, Verplancke, Rik, Van Soom, Ann, and Vanfleteren, Jan

Subjects
Technology and Engineering, digital microfluidics, electrowetting on dielectric, lab on a chip, microfabrication
Abstract

Electrowetting on dielectric (EWOD) is a promising technology for the construction of lab-on-chip devices which allows to perform on chip manipulation of pL-uL droplets with the use of applied electric fields. EWOD chips actuated with low voltages are preferred for the use with living cells, however, the microfabrication of those remains a challenge. Here, we propose the addition of a high quality 13 nm thick nanofilm of aluminum (III) oxide (II) to enhance the range of operational voltages of four EWOD dielectric stacks. Our ultimate goal is the development of a transparent microchip for a dynamic in vitro cell culture.

Published
2021

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