137 results on '"Yang Fang-Zu"'
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2. Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application
3. Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating
4. Phase transformation sequence of amorphous nickel-molybdenum electrodeposit
5. Molecular structure impacts of tetrazole derivatives on their diffusion and adsorption behaviors for microvia copper void-free filling
6. Advanced Ag nanoparticles for the catalyzation of glyoxylic acid oxidation in through-holes electroless copper metallization
7. 1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplating
8. Insights into the synergistic effects of safranine in an acidic copper bath on through-hole void-free filling for high-quality electronics interconnection
9. A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickening
10. Insights into the DMH tautomeric structures and its effects on the electro-reduction of Au(DMH)4− coordination ions
11. Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications
12. Electro-reduction of Cr(III) ions under the effects of complexing agents and Fe(II) ions
13. Coordination behavior of theophylline with Au(III) and electrochemical reduction of the complex
14. Phase transformation sequence of amorphous ferrochrome alloy electrodeposit
15. Instrumental methodologies of electronic electroplating towards the integrated circuit industry
16. Novel fullerene-based ferrocene dyad and diferrocene triad: Synthesis and effects of introduction of fullerene[60] and phenyl linker on the thermodynamic stability, the magnetic properties and the band structure
17. Novel, Simple, and Green Citrate-Based Copper Electronic Electroplating Bath in Microvia Void-Free Filling for Printed Circuit Board Application
18. Confined Etchant Layer Technique: An Electrochemical Approach to Micro-/Nanomachining.
19. Electropolishing of titanium alloy under hydrodynamic mode
20. Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents
21. Molecular plating of actinide compounds on wafer-scale aluminum substrate
22. Suppressing Sulfite Dimerization at a Polarized Gold Electrode/Water Solution Interface for High-Quality Gold Electrodeposition
23. Novel and Green Chemical Compound of HAu(Cys)2: Toward a Simple and Sustainable Electrolyte Recipe for Cyanide-Free Gold Electrodeposition
24. Insights into the Effects of Chloride ions on Cyanide-Free Gold Electrodeposition
25. Electrochemistry and Coordination Behaviors of Hypoxanthine-Au(III) Ion in the Cyanide-Free Gold Electrodeposition
26. Controllable nanogap fabrication on microchip by chronopotentiometry
27. Novel and Green Chemical Compound of HAu(Cys)2: Toward a Simple and Sustainable Electrolyte Recipe for Cyanide-Free Gold Electrodeposition.
28. Illuminating nanostructured gold electrode: surface plasmons or electron ejection?
29. Rational fabrication of silver-coated AFM TERS tips with a high enhancement and long lifetime
30. Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface
31. Initial Behavior of the Electroless Nickel Deposition on Pretreated Aluminum
32. Electrocrystallization of Pd-Ni Alloys on Glassy Carbon Electrode
33. Application of Copper Electrochemical Deposition for the Metallization of Micropores
34. Studies on Structure and Electrocatalytic Hydrogen Evolution of Nanocrystalline Ni-Mo-Fe Alloy Electrodeposit Electrodes
35. Competing Mechanisms in the Acetaldehyde Functionalization of Positively Charged Hydrogenated Silicene
36. Structure and Properties of Three-dimensional Reticular Sn-Co Alloy Electrodes as Anode Material for Lithium Batteries
37. Determination of adsorbed species of hypophosphite electrooxidation on Ni electrode by in situ infrared with shell-isolated nanoparticle-enhanced Raman spectroscopy
38. Corrosion Resistance of Electroless Ni-P Deposits and Its Relation to P Contents
39. Electrodeposition and Structure of Ni-W-B Amorphous Alloy
40. Rational fabrication of a gold-coated AFM TERS tip by pulsed electrodeposition
41. White-light induced grafting of 3-MPA on the Si(111)–H surface for catalyzing Au nanoparticles’ in situ growth
42. Competing Mechanisms in the Acetaldehyde Functionalization of Positively Charged Hydrogenated Silicene.
43. Competing Mechanistic Pathways of Ethylene Functionalization of Positively Charged H–Si(111) Surfaces
44. A density functional theory approach to mushroom-like platinum clusters on palladium-shell over Au core nanoparticles for high electrocatalytic activity
45. Phase transformation sequence of mixed-structural electroless Ni-19.7at.% P deposit
46. Conductance histogram evolution of an EC–MCBJ fabricated Au atomic point contact
47. A density functional theory approach to mushroom-like platinum clusters on palladium-shell over Au core nanoparticles for high electrocatalytic activity
48. Electroless Deposition and Characterization of Nickel Coating in Lead-and Cadmium-free Bath
49. Electrodeposition, Structure and Corrosion Resistance of Nanocrystalline Ni-W Alloy
50. Electrochemically Assisted Fabrication of Metal Atomic Wires and Molecular Junctions by MCBJ and STM‐BJ Methods
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