1. Study on MEMS Capacitive Differential Pressure Sensor
- Author
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Zhi Hao Hou, Shi Xing Jia, and Zhen Huang
- Subjects
Microelectromechanical systems ,Materials science ,Silicon ,business.industry ,Mechanical Engineering ,Capacitive sensing ,Analytical chemistry ,chemistry.chemical_element ,Capacitive displacement sensor ,Pressure sensor ,Capacitance ,chemistry ,Mechanics of Materials ,Anodic bonding ,Electrode ,Optoelectronics ,General Materials Science ,business - Abstract
The design and fabrication of MEMS capacitive differential pressure sensor is reported. Silicon membrane is used as movable electrode. Gold metal film on glass is used as fixed electrode. Anodic bonding is used to bond together the silicon and glass to form the capacitive pressure sensor. The measurement capacitance of the sensors is 5.37 pF at an applied pressure of 0 kPa and 7.26 pF and the full operating range of 40 kPa.The ratio of changed to initial capacitance was 0.35. The error of the MEMS capacitive pressure sensor is less than 4‰ full-scale(FS) by using quadratic curve fitting which can meet most application requirements.
- Published
- 2014