1. Pressure-constrained sonication activation of flexible printed metal circuit
- Author
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Lingxiao Cao, Zhonghao Wang, Daiwei Hu, Haoxuan Dong, Chunchun Qu, Yi Zheng, Chao Yang, Rui Zhang, Chunxiao Xing, Zhen Li, Zhe Xin, Du Chen, Zhenghe Song, and Zhizhu He
- Subjects
Science - Abstract
Abstract Metal micro/nanoparticle ink-based printed circuits have shown promise for promoting the scalable application of flexible electronics due to enabling superhigh metallic conductivity with cost-effective mass production. However, it is challenging to activate printed metal-particle patterns to approach the intrinsic conductivity without damaging the flexible substrate, especially for high melting-point metals. Here, we report a pressure-constrained sonication activation (PCSA) method of the printed flexible circuits for more than dozens of metal (covering melting points from room temperature to 3422 °C) and even nonmetallic inks, which is integrated with the large-scale roll-to-roll process. The PCSA-induced synergistic heat-softening and vibration-bonding effect of particles can enable multilayer circuit interconnection and join electronic components onto printed circuits without solder within 1 s at room temperature. We demonstrate PCSA-based applications of 3D flexible origami electronics, erasable and foldable double-sided electroluminescent displays, and custom-designed and large-area electronic textiles, thus indicating its potential for universality in flexible electronics.
- Published
- 2024
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