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Your search keyword '"van Grunsven, E."' showing total 2 results
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2 results on '"van Grunsven, E."'

1. Reinvestigation of Peroxisomal 3-Ketoacyl-CoA Thiolase Deficiency: Identification of the True Defect at the Level of D-Bifunctional Protein.

Author

Ferdinandusse, S., van Grunsven, E. G., Oostheim, W., Denis, S., Hogenhout, E. M., Ijlst, L., van Roermund, C. W. T., Waterham, H. R., Goldfischer, S., and Wanders, R. J. A.

Subjects
*FATTY acids, *PEROXISOMAL disorders, *CENTRAL nervous system diseases
Abstract

Presents a study which reinvestigated peroxisomal 3-ketoacyl-CoA thiolase deficiency. Identification of the true defect at the level of D-bifunctional protein; Methodology; Results.

Published
2002
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2. System-in-package integration of passives using 3D through-silicon vias.

Author

Roozeboom, F., Dekkers, W., Làmy, Y., Klootwijk, J. H., van Grunsven, E., and Kim, H.-D.

Subjects
*ELECTRIC equipment, *SURFACE chemistry, *SEMICONDUCTOR industry, *SEMICONDUCTOR industrial equipment industry, *TECHNOLOGICAL innovations
Abstract

The article offers analyses on few technology options in 3D passive integration, as well as the in through-silicon via (TSV) technology. Si-integrated trench capacitors was created through a passive integration in order to composed a triple metal"insulator"metal (MIM) layer stacks. As a result, the use of TSB technology shows a very fine and high aspect of ratio, which can be wet-etched thru a conventional reactive ion etching (RIE).

Published
2008

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