Back to Search
Start Over
Predictions and measurements of interfacial adhesion among encapsulated thin films of flexible devices.
- Source :
-
Thin Solid Films . Jun2015, Vol. 584, p154-160. 7p. - Publication Year :
- 2015
-
Abstract
- This study employed the four-point bending test (4-PBT) to measure the interfacial strength of pressure-sensitive adhesive (PSA)/SiN passivation stacked thin films. Finite element analysis (FEA) is combined with the J integral approach and the modified virtual crack closure technique to validate the results of 4-PBT. The FEA simulation results verify the measurement results. The stress status and energy release rate of the delaminated tip are also determined at different elevations of stacked thin films of 4-PBT specimens adjacent to the PSA/SiN interface. The crack in the PSA parallel to the foregoing interface with a slight span occurs on the fractured interface. This behavior is confirmed by observing the scanning electron micrographs of the specimens after 4-PBT. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 00406090
- Volume :
- 584
- Database :
- Academic Search Index
- Journal :
- Thin Solid Films
- Publication Type :
- Academic Journal
- Accession number :
- 102313429
- Full Text :
- https://doi.org/10.1016/j.tsf.2015.01.020