In situ phosphorus-doped Ge1−x Sn x layers grown using low-temperature metal-organic chemical vapor deposition.

We report the metal-organic chemical vapor deposition method for epitaxy of n+-Ge and Ge1−xSnx layer with an electron concentration as high as 2 × 1019 cm−3 by in situ phosphorus (P) doping. In this study, we examined MO precursors of tertiary-butyl-germane (t-BGe), tri-butyl-vinyl-tin (TBVSn), and two kinds of P precursors of tri-ethyl-phosphine (TEP) and tertiary-butyl-phosphine (t-BP). We have investigated crystalline and electrical characteristics of P-doped Ge and Ge1−xSnx layers. In the case of using TEP, the P-doped Ge0.98Sn0.02 epitaxial layer grown at 320 °C on virtual Ge substrate was demonstrated, in which the chemical P-incorporation as high as 1 × 1019 cm−3 and the full electrical activation of P. By using t-BP instead of TEP, the chemical P-incorporation as high as 8.1 × 1019 cm−3 was achieved for Ge epitaxial layer grown at 300 °C. It is found that the activation energy of the growth rate of Ge and P with t-BGe, TEP, and t-BP was estimated to be 1.0−1.2, 2.1, and 1.1 eV, respectively. The precursor combination of t-BGe and t-BP has a wider temperature window for a lower growth temperature. In situ P-doping with t-BP enables us to grow the Ge0.975Sn0.025 epitaxial layer with an electron concentration as high as 1.7 × 1019 cm−3 at the temperature as low as 300 °C. For both cases of TEP and t-BP, we observed that increasing Sn content significantly reduces the P-incorporation, which is not common phenomenon in a conventional CVD growth. [ABSTRACT FROM AUTHOR]