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A Post-Bond TSV Test Method Based on RGC Parameters Measurement.
- Source :
-
IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems . Feb2020, Vol. 39 Issue 2, p506-519. 14p. - Publication Year :
- 2020
-
Abstract
- In this paper, we propose a novel post-bond through-silicon via (TSV) test method for post-bond TSV manufacture test. The proposed method can measure the RGC parameters of TSVs using switched-capacitor circuits and calibration method and detect TSV leakage fault, open fault, high-resistance fault, and delay fault based on the measured RGC parameters. The test process has a high resolution and is robust. The fault-detection effectiveness is evaluated via HSPICE simulations. The results of the TSV capacitance measurement have a relative error within 1%, the TSV resistance measurement results have a relative error within 5%, and the TSV conductance measurement results have a relative error within 8.5%. We also perform an Monte Carlo simulation to prove that even under process variation, the proposed method can obtain a TSV capacitance within an absolute error of ±3 fF, obtain a TSV resistance with a relative error of no more than 18.4%, and obtain a TSV conductance of less than 100 ${\mu \Omega }^{{-1}}$ with a relative error of no more than 13%. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 02780070
- Volume :
- 39
- Issue :
- 2
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems
- Publication Type :
- Academic Journal
- Accession number :
- 141418508
- Full Text :
- https://doi.org/10.1109/TCAD.2018.2887051