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Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology.

Authors :
Zhou, Xin
Zhang, Gang
Feng, Shuai
Tam, Kam Weng
Zhang, Zhuowei
Tang, Wanchun
Yang, Jiquan
Source :
IEEE Transactions on Components, Packaging & Manufacturing Technology. Oct2022, Vol. 12 Issue 10, p1681-1691. 11p.
Publication Year :
2022

Abstract

A new class of 3-D integrated multiband bandpass filters (BPFs) based on substrate integrated waveguide (SIW) technology is presented in this work, for the first time. Split-type dual-extended doublet (SDED) coupling topologies are developed to propose these BPFs with a desired multiband response by the LEGO-style assembly of planar SIW resonant-mode blocks. These design schemes offer attractive and promising advantages with regard to compact size, low cost, flexible and expandable topology, as well as integration of high-density integrated circuits. For demonstration, dual- and triple-band BPFs are designed, fabricated, and measured. The measurement results are in good agreement with the simulation ones. Results indicate that the proposals can provide not only nice selective multiband signal transmission in such flexibly extensible topologies with new spatial schemes but also increase space utilization and reduce footprint. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
21563950
Volume :
12
Issue :
10
Database :
Academic Search Index
Journal :
IEEE Transactions on Components, Packaging & Manufacturing Technology
Publication Type :
Academic Journal
Accession number :
160689962
Full Text :
https://doi.org/10.1109/TCPMT.2022.3215446