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Research on the influence mechanism and modification technology of UV-curing adhesive on the HPLD thermal-induced misalignment.
- Source :
-
International Journal of Adhesion & Adhesives . Jan2023, Vol. 121, pN.PAG-N.PAG. 1p. - Publication Year :
- 2023
-
Abstract
- The demand for output performance and reliability of the HPLD (high-power laser diode) has become increasingly stringent with the development of application requirements. The thermal effect of the HPLD will lead to optical components' thermal-induced misalignment, which will significantly affect the output quality and power of the laser. In this paper, the influence of the thickness and uniformity of UV-curing adhesive on the thermal-induced misalignment of the bonding module is revealed. Then the thermal stability of UV-curing adhesive is optimized by the microparticles composite modification method. Finally, the single emitter array laser is packaged with the optimized modified UV-curing adhesive, the thermal-induced misalignment of beam-shaping components can be reduced by 8 times, and the power reduction ratio of the laser is reduced from 3.8% to 0.72%. This research supports efficient control of the thermal-induced misalignment which to ensures high-performance packaging and manufacturing for HPLD. [ABSTRACT FROM AUTHOR]
- Subjects :
- *ADHESIVES
*SEMICONDUCTOR lasers
*THERMAL stability
Subjects
Details
- Language :
- English
- ISSN :
- 01437496
- Volume :
- 121
- Database :
- Academic Search Index
- Journal :
- International Journal of Adhesion & Adhesives
- Publication Type :
- Academic Journal
- Accession number :
- 161158495
- Full Text :
- https://doi.org/10.1016/j.ijadhadh.2022.103320