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Corrections to "Enhancing the Reliability of Wafer Level Packaging by Using Solder Joints Layout Design".
- Source :
-
IEEE Transactions on Components & Packaging Technologies . Mar2007, Vol. 30 Issue 1, p190-190. 1/2p. - Publication Year :
- 2007
-
Abstract
- A correction to the article "Enhancing the Reliability of Wafer Level Packaging by Using Solder Joints Layout Design," by Chang-Ming Liu, Chang-Chun Lee, and Kuo-Ning Chiang, published in one of the previous issues of the journal.
- Subjects :
- *SOLDER & soldering
Subjects
Details
- Language :
- English
- ISSN :
- 15213331
- Volume :
- 30
- Issue :
- 1
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Components & Packaging Technologies
- Publication Type :
- Academic Journal
- Accession number :
- 24685899
- Full Text :
- https://doi.org/10.1109/TCAPT.2006.890539