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FAILURE BEHAVIORS OF FLIP CHIP SOLDER JOINTS UNDER VARIOUS LOADING CONDITIONS OF HIGH-SPEED SHEAR TEST.
- Source :
-
International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics . 3/20/2009, Vol. 23 Issue 6/7, p1809-1815. 7p. 1 Black and White Photograph, 3 Diagrams, 1 Chart, 2 Graphs. - Publication Year :
- 2009
-
Abstract
- The failure behaviors of flip chip solder joints under various loading conditions of the high-speed shear test (H-SST) were investigated with an experimental and non-linear 3-dimensional finite element modeling study. The solder composition used in this study was Sn-3.0Ag-0.5Cu (in wt.%). The shear forces were far greater by H-SST than by low-speed shear test (L-SST). The shear force further increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloy. Brittle interfacial fractures were more easily achieved by H-SST, especially at the higher shear speed. This was discussed in terms of the relationship between the strain-rate and work-hardening effect and the resulting stress concentration at the interfacial regions [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 02179792
- Volume :
- 23
- Issue :
- 6/7
- Database :
- Academic Search Index
- Journal :
- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics
- Publication Type :
- Academic Journal
- Accession number :
- 38595720
- Full Text :
- https://doi.org/10.1142/S0217979209061664