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Performance and Thermal-Aware Steiner Routing for 3-D Stacked ICs.
- Source :
-
IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems . Sep2009, Vol. 28 Issue 9, p1373-1386. 14p. 6 Diagrams, 12 Charts. - Publication Year :
- 2009
-
Abstract
- In this paper, we present a performance and thermal-aware Steiner routing algorithm for three-dimensional (3-D) stacked integrated circuits. Our algorithm consists of two steps: tree construction and tree refinement. Our tree construction algorithm builds a delay-oriented Steiner tree under a given thermal profile. We show that our 3-D tree construction involves minimization of two-variable Elmore delay function. In our tree refinement algorithm, we reposition the through-silicon-vias (TSVs) used in existing Steiner trees while preserving the original routing topology for further thermal optimization under a performance constraint. We employ a novel scheme to relax the initial nonlinear programming formulation to integer linear programming and consider all TSVs from all nets simultaneously. Our tree construction algorithm outperforms the popular 3-D maze routing by 52% in terms of performance at the cost of 15% wirelength and 6% TSV count increase for four-die stacking. In addition, our TSV relocation results in 9 % maximum-temperature reduction at no additional area cost. We also provide extensive experimental results, including the following: 1) the wirelength and delay, distribution of various types of 3-D interconnects; 2) the impact of TSV RC parasitics on routing and TSV relocation; and 3) the impact of various bonding styles on routing and TSV relocation. Last, we provide results on two-die stacking. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 02780070
- Volume :
- 28
- Issue :
- 9
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems
- Publication Type :
- Academic Journal
- Accession number :
- 44048534
- Full Text :
- https://doi.org/10.1109/TCAD.2009.2024707