TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip.

Details

Language :

English

ISBNs :

9781479961559

Database :

Complementary Index

Journal :

2014 IEEE International Symposium on Defect & Fault Tolerance in VLSI & Nanotechnology Systems (DFT)

Publication Type :

Conference

Accession number :

101233536

Full Text :

https://doi.org/10.1109/DFT.2014.6962067