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3D heterogeneous integration structure based on 40 nm- and 0.18 µm-technology nodes.
- Source :
- 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1646-1651, 6p
- Publication Year :
- 2015
Details
- Language :
- English
- ISBNs :
- 9781479986095
- Database :
- Complementary Index
- Journal :
- 2015 IEEE 65th Electronic Components & Technology Conference (ECTC)
- Publication Type :
- Conference
- Accession number :
- 108854195
- Full Text :
- https://doi.org/10.1109/ECTC.2015.7159817